JP2017100190A - 電気接続エレメントを備えたプレート - Google Patents
電気接続エレメントを備えたプレート Download PDFInfo
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- JP2017100190A JP2017100190A JP2017000639A JP2017000639A JP2017100190A JP 2017100190 A JP2017100190 A JP 2017100190A JP 2017000639 A JP2017000639 A JP 2017000639A JP 2017000639 A JP2017000639 A JP 2017000639A JP 2017100190 A JP2017100190 A JP 2017100190A
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 167
- 239000000463 material Substances 0.000 claims abstract description 108
- 229910052709 silver Inorganic materials 0.000 claims abstract description 31
- 239000004332 silver Substances 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- 229910052738 indium Inorganic materials 0.000 claims abstract description 25
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 229910052718 tin Inorganic materials 0.000 claims abstract description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 27
- 239000000203 mixture Substances 0.000 claims description 23
- 239000011135 tin Substances 0.000 claims description 19
- 239000011521 glass Substances 0.000 claims description 15
- 229910000831 Steel Inorganic materials 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 239000010959 steel Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- 239000005361 soda-lime glass Substances 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 239000011701 zinc Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- -1 polyethylene Polymers 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 239000005357 flat glass Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000005328 architectural glass Substances 0.000 claims description 2
- 239000005388 borosilicate glass Substances 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 239000005329 float glass Substances 0.000 claims description 2
- 229910052748 manganese Inorganic materials 0.000 claims description 2
- 239000011572 manganese Substances 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 27
- 238000005476 soldering Methods 0.000 description 16
- 125000006850 spacer group Chemical group 0.000 description 13
- 238000009736 wetting Methods 0.000 description 13
- 230000008018 melting Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000035882 stress Effects 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 229910052793 cadmium Inorganic materials 0.000 description 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 230000005499 meniscus Effects 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229910001152 Bi alloy Inorganic materials 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001006 Constantan Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000005336 safety glass Substances 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0006—Exothermic brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Joining Of Glass To Other Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
Abstract
Description
この結果は、当業者にとって意外でありかつ予測されなかった。
1 基板
2 導電性構造体
3 接続エレメント
4 無鉛はんだ材料
5 保護スクリーン印刷層
6 接触面
7 スペーサー
8 はんだ材料
A−A′ 切断線
h スペーサー7の高さ
l スペーサー7の幅
Claims (13)
- 基板(1)の少なくとも一部の領域上に導電性構造体(2)を備えた基板(1)と、
前記導電性構造体(2)の少なくとも一部の領域上にある少なくとも1つの電気接続エレメント(3)と、
前記電気接続エレメント(3)を、少なくとも一部の領域で前記導電性構造体(2)と結合する無鉛はんだ材料(4)とを少なくとも有する、少なくとも1つの接続エレメント(3)を備えたプレート(I)であって、
前記無鉛はんだ材料(4)は、インジウムを58質量%〜62質量%、スズを35質量%〜38質量%、銀を1質量%〜3.5質量%及び銅を0.5質量%〜2質量%含有する、プレート(I)。 - 前記無鉛はんだ材料(4)は、インジウムを59質量%〜61質量%及びスズを35質量%〜38質量%含有する、請求項1に記載のプレート(I)。
- 前記無鉛はんだ材料(4)は、銀を1.5質量%〜3質量%含有する、請求項1又は2に記載のプレート(I)。
- 前記無鉛はんだ材料(4)は、銅を0.8質量%〜1.8質量%、好ましくは銅を1.2質量%〜1.7質量%、特に好ましくは銅を1.4質量%〜1.6質量%含有する、請求項1から3までのいずれか1項に記載のプレート(I)。
- 前記無鉛はんだ材料(4)は、ニッケルを1質量%まで、好ましくはニッケルを0.1質量%〜0.2質量%含有する、請求項1から4までのいずれか1項に記載のプレート(I)。
- 前記基板(1)は、ガラス、好ましくは板ガラス、フロートガラス、石英ガラス、ホウケイ酸ガラス、ソーダ石灰ガラス、又はポリマー、好ましくはポリエチレン、ポリプロピレン、ポリカルボナート、ポリメチルメタクリラート及び/又はこれらの混合物を有する、請求項1から5までのいずれか1項に記載のプレート(I)。
- 前記接続エレメント(3)は、銅、亜鉛、チタン、鉄、ニッケル、コバルト、モリブデン、スズ、マンガン及び/又はクロム及び/又はこれらの合金を有する、請求項1から6までのいずれか1項に記載のプレート(I)。
- 前記接続エレメント(3)は鋼、好ましくは特殊鋼を有する、請求項7に記載のプレート(I)。
- 前記導電性構造体(2)は銀を有する、請求項1から8までのいずれか1項に記載のプレート(I)。
- 前記接続エレメント(3)は、接触面(6)を介して全面で、導電性構造体(2)の一部の領域と結合されている、請求項1から9までのいずれか1項に記載のプレート(I)。
- 前記無鉛はんだ材料(4)の層厚は、600μm以下である、請求項1から10までのいずれか1項に記載のプレート(I)。
- 請求項1から11までのいずれか1項に記載のプレート(I)の製造方法において、
a) 接続エレメント(3)の下側に無鉛はんだ材料(4)を塗布し、
b) 基板(1)に導電性構造体(2)を塗布し、
c) 前記はんだ材料(4)を備えた前記接続エレメント(3)を導電性構造体(2)上に配置し、及び
d) 前記接続エレメント(3)を前記導電性構造体(2)とはんだ付けする、プレート(I)の製造方法。 - 請求項1から11までのいずれか1項に記載のプレート(I)の、車両、航空機、船舶、建築用ガラス及び構造用ガラスのための、導電性構造体を備えた、好ましくは加熱導体及び/又はアンテナ導体を備えたプレートとしての使用。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP12181663.1 | 2012-08-24 | ||
EP12181663 | 2012-08-24 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015527825A Division JP6203262B2 (ja) | 2012-08-24 | 2013-07-24 | 電気接続エレメントを備えたプレート |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2017100190A true JP2017100190A (ja) | 2017-06-08 |
Family
ID=48856627
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015527825A Expired - Fee Related JP6203262B2 (ja) | 2012-08-24 | 2013-07-24 | 電気接続エレメントを備えたプレート |
JP2017000639A Pending JP2017100190A (ja) | 2012-08-24 | 2017-01-05 | 電気接続エレメントを備えたプレート |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015527825A Expired - Fee Related JP6203262B2 (ja) | 2012-08-24 | 2013-07-24 | 電気接続エレメントを備えたプレート |
Country Status (12)
Country | Link |
---|---|
US (1) | US9484651B2 (ja) |
EP (1) | EP2888075B1 (ja) |
JP (2) | JP6203262B2 (ja) |
KR (1) | KR101720888B1 (ja) |
CN (1) | CN104540636B (ja) |
BR (1) | BR112015003280B1 (ja) |
EA (1) | EA028332B1 (ja) |
ES (1) | ES2740955T3 (ja) |
MX (1) | MX370004B (ja) |
PL (1) | PL2888075T3 (ja) |
TR (1) | TR201910819T4 (ja) |
WO (1) | WO2014029576A1 (ja) |
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JP2019136771A (ja) * | 2018-02-08 | 2019-08-22 | 国立研究開発法人産業技術総合研究所 | はんだ実装方法及びマイクロ波加熱装置 |
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US10180035B2 (en) | 2013-04-01 | 2019-01-15 | Schlumberger Technology Corporation | Soldered components for downhole use |
US20140290931A1 (en) * | 2013-04-01 | 2014-10-02 | University Of Maryland, College Park | High Temperature Solder For Downhole Components |
KR20190016615A (ko) * | 2014-10-07 | 2019-02-18 | 쌩-고벵 글래스 프랑스 | 전기 전도성 코팅 및 디스크 상에 납땜된 금속 스트립을 갖는 디스크를 제조하는 방법; 및 상응하는 디스크 |
CN107635717B (zh) * | 2015-05-15 | 2021-02-05 | 安波福技术有限公司 | 基于铟-锡-银的无铅焊料 |
GB201515010D0 (en) * | 2015-08-24 | 2015-10-07 | Pilkington Group Ltd | Electrical connector |
DE202015007098U1 (de) * | 2015-10-10 | 2017-01-24 | Fractal-Technologies Dr.-Ing. Thomas Reul GmbH | Hybrides-Bleifreies-Elektrisches-Glas-Löt-Anschluß-Element |
RU2701912C1 (ru) * | 2016-05-10 | 2019-10-02 | Сэн-Гобэн Гласс Франс | Жало для паяльника |
FR3054403B1 (fr) * | 2016-07-22 | 2019-10-18 | Saint-Gobain Glass France | Vitrage avec element electriquement conducteur et sa connexion electrique |
CN108788510B (zh) * | 2017-05-03 | 2021-04-16 | 上汽通用汽车有限公司 | 无铅焊料合金及其制备方法和应用、玻璃组件 |
CN114071812A (zh) | 2017-11-07 | 2022-02-18 | 中央硝子株式会社 | 车窗用玻璃组件 |
GB201804624D0 (en) * | 2018-03-22 | 2018-05-09 | Central Glass Co Ltd | Method of producing a vehicle glass assembly |
DE102018217612A1 (de) * | 2018-10-15 | 2020-04-16 | Siemens Aktiengesellschaft | Verfahren zur elektrischen Kontaktierung eines supraleitenden Bandleiters |
JP7078595B2 (ja) * | 2019-11-15 | 2022-05-31 | 矢崎総業株式会社 | 回路体と導電体との接続構造 |
CN114284770B (zh) * | 2021-12-20 | 2023-04-28 | 福耀玻璃工业集团股份有限公司 | 车用玻璃加热导电组件、车用玻璃及其制作方法 |
US20230339034A1 (en) * | 2022-04-22 | 2023-10-26 | Magna Exteriors, Inc. | Vehicular window assembly process with temperature control of the solder joint that attaches an electrical connector |
WO2024017966A1 (en) * | 2022-07-19 | 2024-01-25 | Agc Glass Europe | An electrically conductive connector for a window pane |
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- 2013-07-24 PL PL13740006T patent/PL2888075T3/pl unknown
- 2013-07-24 ES ES13740006T patent/ES2740955T3/es active Active
- 2013-07-24 TR TR2019/10819T patent/TR201910819T4/tr unknown
- 2013-07-24 US US14/421,993 patent/US9484651B2/en active Active
- 2013-07-24 MX MX2015002351A patent/MX370004B/es active IP Right Grant
- 2013-07-24 WO PCT/EP2013/065561 patent/WO2014029576A1/de active Application Filing
- 2013-07-24 BR BR112015003280-0A patent/BR112015003280B1/pt not_active IP Right Cessation
- 2013-07-24 CN CN201380044442.XA patent/CN104540636B/zh active Active
- 2013-07-24 EP EP13740006.5A patent/EP2888075B1/de active Active
- 2013-07-24 EA EA201590429A patent/EA028332B1/ru not_active IP Right Cessation
- 2013-07-24 JP JP2015527825A patent/JP6203262B2/ja not_active Expired - Fee Related
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JP2019136771A (ja) * | 2018-02-08 | 2019-08-22 | 国立研究開発法人産業技術総合研究所 | はんだ実装方法及びマイクロ波加熱装置 |
JP7241379B2 (ja) | 2018-02-08 | 2023-03-17 | 国立研究開発法人産業技術総合研究所 | はんだ実装方法及びマイクロ波加熱装置 |
Also Published As
Publication number | Publication date |
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EP2888075B1 (de) | 2019-05-08 |
MX2015002351A (es) | 2015-05-12 |
ES2740955T3 (es) | 2020-02-07 |
MX370004B (es) | 2019-11-28 |
US9484651B2 (en) | 2016-11-01 |
WO2014029576A1 (de) | 2014-02-27 |
CN104540636B (zh) | 2017-09-08 |
BR112015003280A2 (pt) | 2017-07-04 |
EA201590429A1 (ru) | 2015-06-30 |
KR101720888B1 (ko) | 2017-03-28 |
TR201910819T4 (tr) | 2019-08-21 |
PL2888075T3 (pl) | 2019-10-31 |
JP2016500575A (ja) | 2016-01-14 |
JP6203262B2 (ja) | 2017-09-27 |
US20150236438A1 (en) | 2015-08-20 |
EP2888075A1 (de) | 2015-07-01 |
CN104540636A (zh) | 2015-04-22 |
KR20150046191A (ko) | 2015-04-29 |
EA028332B1 (ru) | 2017-11-30 |
BR112015003280B1 (pt) | 2020-03-10 |
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