JP2013531812A - 複数の光学装置の製造方法 - Google Patents

複数の光学装置の製造方法 Download PDF

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Publication number
JP2013531812A
JP2013531812A JP2013514509A JP2013514509A JP2013531812A JP 2013531812 A JP2013531812 A JP 2013531812A JP 2013514509 A JP2013514509 A JP 2013514509A JP 2013514509 A JP2013514509 A JP 2013514509A JP 2013531812 A JP2013531812 A JP 2013531812A
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JP
Japan
Prior art keywords
filter
substrate
optical
wafer
spacer
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Pending
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JP2013514509A
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English (en)
Japanese (ja)
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JP2013531812A5 (enExample
Inventor
ラドマン，ハルトムート
リール，ペーター
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Heptagon Oy
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Heptagon Oy
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Publication of JP2013531812A publication Critical patent/JP2013531812A/ja
Publication of JP2013531812A5 publication Critical patent/JP2013531812A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/026—Wafer-level processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Blocking Light For Cameras (AREA)
  • Lens Barrels (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Filters (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Studio Devices (AREA)
JP2013514509A 2010-06-14 2011-06-10 複数の光学装置の製造方法 Pending JP2013531812A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US35438910P 2010-06-14 2010-06-14
US61/354,389 2010-06-14
PCT/CH2011/000140 WO2011156926A1 (en) 2010-06-14 2011-06-10 Method of manufacturing a plurality of optical devices

Publications (2)

Publication Number Publication Date
JP2013531812A true JP2013531812A (ja) 2013-08-08
JP2013531812A5 JP2013531812A5 (enExample) 2014-07-31

Family

ID=44454697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013514509A Pending JP2013531812A (ja) 2010-06-14 2011-06-10 複数の光学装置の製造方法

Country Status (8)

Country Link
US (1) US20130162882A1 (enExample)
EP (1) EP2580781A1 (enExample)
JP (1) JP2013531812A (enExample)
KR (1) KR20130093072A (enExample)
CN (1) CN103201838A (enExample)
SG (1) SG186214A1 (enExample)
TW (1) TW201222795A (enExample)
WO (1) WO2011156926A1 (enExample)

Cited By (1)

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WO2020152782A1 (ja) * 2019-01-22 2020-07-30 オリンパス株式会社 内視鏡用撮像装置の製造方法、内視鏡用撮像装置、および、内視鏡

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JP6247633B2 (ja) * 2011-08-10 2017-12-13 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッドＨｅｐｔａｇｏｎ Ｍｉｃｒｏ Ｏｐｔｉｃｓ Ｐｔｅ． Ｌｔｄ． 光電子モジュールおよびその製造方法
US9595553B2 (en) * 2012-11-02 2017-03-14 Heptagon Micro Optics Pte. Ltd. Optical modules including focal length adjustment and fabrication of the optical modules
SG11201506393YA (en) * 2013-02-22 2015-09-29 Heptagon Micro Optics Pte Ltd Optical imaging apparatus, in particular for computational imaging, having further functionality
WO2014142750A1 (en) * 2013-03-15 2014-09-18 Heptagon Micro Optics Pte. Ltd. Non-contact thermal sensor module
US9923008B2 (en) * 2013-04-12 2018-03-20 Omnivision Technologies, Inc. Wafer-level array cameras and methods for fabricating the same
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
US20170047362A1 (en) * 2015-08-13 2017-02-16 Heptagon Micro Optics Pte. Ltd. Optoelectronic module with customizable spacers
DE102016200287A1 (de) * 2016-01-13 2017-07-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Multiaperturabbildungsvorrichtungen, Verfahren zum Herstellen derselben und Abbildungssystem
CN110534538A (zh) * 2019-09-03 2019-12-03 豪威光电子科技（上海）有限公司 镜头模组及其形成方法
CN110808259A (zh) * 2019-11-25 2020-02-18 华天慧创科技（西安）有限公司 一种晶圆透镜模组
GB202009957D0 (en) * 2020-06-30 2020-08-12 Ams Sensors Singapore Pte Ltd Spacer for an optical device
US11808959B2 (en) 2020-08-11 2023-11-07 Himax Technologies Limited Optical element and wafer level optical module

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JP2005526458A (ja) * 2002-05-13 2005-09-02 マイクロン テクノロジー インコーポレイテッド カラーフィルタイメージングアレイ及びその製造方法
JP2007520166A (ja) * 2004-01-26 2007-07-19 ディジタル・オプティックス・コーポレイション サブピクセル解像度を有する薄型カメラ
WO2009076788A1 (en) * 2007-12-19 2009-06-25 Heptagon Oy Wafer stack, integrated optical device and method for fabricating the same
JP2009544226A (ja) * 2006-07-17 2009-12-10 テッセラ・ノース・アメリカ・インコーポレイテッド カメラシステムおよび関連する方法
JP2010507219A (ja) * 2006-10-19 2010-03-04 フェデラル−モーグル コーポレイション 多層セラミック加熱素子を製造する方法
JP2010067624A (ja) * 2008-09-08 2010-03-25 Sony Corp 撮像素子および撮像装置

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US6235141B1 (en) * 1996-09-27 2001-05-22 Digital Optics Corporation Method of mass producing and packaging integrated optical subsystems
EP1443344A1 (en) 2003-01-29 2004-08-04 Heptagon Oy Manufacturing micro-structured elements
US7329861B2 (en) * 2003-10-14 2008-02-12 Micron Technology, Inc. Integrally packaged imaging module
EP1542074A1 (en) * 2003-12-11 2005-06-15 Heptagon OY Manufacturing a replication tool, sub-master or replica
EP1569276A1 (en) 2004-02-27 2005-08-31 Heptagon OY Micro-optics on optoelectronics
WO2006109638A1 (ja) * 2005-04-08 2006-10-19 Konica Minolta Opto, Inc. 固体撮像素子及びその製造方法
US20070216048A1 (en) 2006-03-20 2007-09-20 Heptagon Oy Manufacturing optical elements
US7692256B2 (en) * 2007-03-23 2010-04-06 Heptagon Oy Method of producing a wafer scale package
JP2009010261A (ja) * 2007-06-29 2009-01-15 Fujikura Ltd 半導体パッケージおよびその製造方法
US20090159200A1 (en) * 2007-12-19 2009-06-25 Heptagon Oy Spacer element and method for manufacturing a spacer element
TWI505703B (zh) * 2007-12-19 2015-10-21 新加坡恒立私人有限公司 光學模組，晶圓等級的封裝及其製造方法
TWI484237B (zh) * 2007-12-19 2015-05-11 新加坡恒立私人有限公司 用於攝影裝置的光學模組、擋板基板、晶圓級封裝、及其製造方法
JP5175620B2 (ja) * 2008-05-29 2013-04-03 シャープ株式会社 電子素子ウェハモジュールおよびその製造方法、電子素子モジュール、電子情報機器
US8828174B2 (en) * 2008-08-20 2014-09-09 Heptagon Micro Optics Pte. Ltd. Method of manufacturing a plurality of optical devices

Patent Citations (7)

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Publication number Priority date Publication date Assignee Title
JP2005526458A (ja) * 2002-05-13 2005-09-02 マイクロン テクノロジー インコーポレイテッド カラーフィルタイメージングアレイ及びその製造方法
JP2007520166A (ja) * 2004-01-26 2007-07-19 ディジタル・オプティックス・コーポレイション サブピクセル解像度を有する薄型カメラ
JP2009544226A (ja) * 2006-07-17 2009-12-10 テッセラ・ノース・アメリカ・インコーポレイテッド カメラシステムおよび関連する方法
JP2010507219A (ja) * 2006-10-19 2010-03-04 フェデラル−モーグル コーポレイション 多層セラミック加熱素子を製造する方法
WO2009076788A1 (en) * 2007-12-19 2009-06-25 Heptagon Oy Wafer stack, integrated optical device and method for fabricating the same
JP2011507284A (ja) * 2007-12-19 2011-03-03 ヘプタゴン・オサケ・ユキチュア ウェハ積層体、一体化された光学装置およびこれを作製するための方法
JP2010067624A (ja) * 2008-09-08 2010-03-25 Sony Corp 撮像素子および撮像装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020152782A1 (ja) * 2019-01-22 2020-07-30 オリンパス株式会社 内視鏡用撮像装置の製造方法、内視鏡用撮像装置、および、内視鏡
CN113272707A (zh) * 2019-01-22 2021-08-17 奥林巴斯株式会社 内窥镜用摄像装置的制造方法、内窥镜用摄像装置和内窥镜
US20210343779A1 (en) * 2019-01-22 2021-11-04 Olympus Corporation Manufacturing method of image pickup apparatus for endoscope, image pickup apparatus for endoscope, and endoscope
US12015045B2 (en) 2019-01-22 2024-06-18 Olympus Corporation Manufacturing method of image pickup apparatus for endoscope, image pickup apparatus for endoscope, and endoscope

Also Published As

Publication number Publication date
CN103201838A (zh) 2013-07-10
US20130162882A1 (en) 2013-06-27
EP2580781A1 (en) 2013-04-17
SG186214A1 (en) 2013-01-30
TW201222795A (en) 2012-06-01
WO2011156926A1 (en) 2011-12-22
KR20130093072A (ko) 2013-08-21

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