CN103201838A - 制造多个光学设备的方法 - Google Patents

制造多个光学设备的方法 Download PDF

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Publication number
CN103201838A
CN103201838A CN2011800294813A CN201180029481A CN103201838A CN 103201838 A CN103201838 A CN 103201838A CN 2011800294813 A CN2011800294813 A CN 2011800294813A CN 201180029481 A CN201180029481 A CN 201180029481A CN 103201838 A CN103201838 A CN 103201838A
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CN
China
Prior art keywords
filter
wafer
optical
substrate
spacer
Prior art date
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Pending
Application number
CN2011800294813A
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English (en)
Chinese (zh)
Inventor
H·拉德曼
P·里尔
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Heptagon Oy
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Heptagon Oy
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Filing date
Publication date
Application filed by Heptagon Oy filed Critical Heptagon Oy
Publication of CN103201838A publication Critical patent/CN103201838A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/026—Wafer-level processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Blocking Light For Cameras (AREA)
  • Lens Barrels (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Filters (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Studio Devices (AREA)
CN2011800294813A 2010-06-14 2011-06-10 制造多个光学设备的方法 Pending CN103201838A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US35438910P 2010-06-14 2010-06-14
US61/354389 2010-06-14
PCT/CH2011/000140 WO2011156926A1 (en) 2010-06-14 2011-06-10 Method of manufacturing a plurality of optical devices

Publications (1)

Publication Number Publication Date
CN103201838A true CN103201838A (zh) 2013-07-10

Family

ID=44454697

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011800294813A Pending CN103201838A (zh) 2010-06-14 2011-06-10 制造多个光学设备的方法

Country Status (8)

Country Link
US (1) US20130162882A1 (enExample)
EP (1) EP2580781A1 (enExample)
JP (1) JP2013531812A (enExample)
KR (1) KR20130093072A (enExample)
CN (1) CN103201838A (enExample)
SG (1) SG186214A1 (enExample)
TW (1) TW201222795A (enExample)
WO (1) WO2011156926A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110534538A (zh) * 2019-09-03 2019-12-03 豪威光电子科技（上海）有限公司 镜头模组及其形成方法
CN110808259A (zh) * 2019-11-25 2020-02-18 华天慧创科技（西安）有限公司 一种晶圆透镜模组
TWI747513B (zh) * 2020-08-11 2021-11-21 奇景光電股份有限公司 光學元件和晶圓級光學模組
CN115769121A (zh) * 2020-06-30 2023-03-07 ams传感器新加坡私人有限公司 用于光学设备的间隔件

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6247633B2 (ja) * 2011-08-10 2017-12-13 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッドＨｅｐｔａｇｏｎ Ｍｉｃｒｏ Ｏｐｔｉｃｓ Ｐｔｅ． Ｌｔｄ． 光電子モジュールおよびその製造方法
US9595553B2 (en) * 2012-11-02 2017-03-14 Heptagon Micro Optics Pte. Ltd. Optical modules including focal length adjustment and fabrication of the optical modules
SG11201506393YA (en) * 2013-02-22 2015-09-29 Heptagon Micro Optics Pte Ltd Optical imaging apparatus, in particular for computational imaging, having further functionality
WO2014142750A1 (en) * 2013-03-15 2014-09-18 Heptagon Micro Optics Pte. Ltd. Non-contact thermal sensor module
US9923008B2 (en) * 2013-04-12 2018-03-20 Omnivision Technologies, Inc. Wafer-level array cameras and methods for fabricating the same
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
US20170047362A1 (en) * 2015-08-13 2017-02-16 Heptagon Micro Optics Pte. Ltd. Optoelectronic module with customizable spacers
DE102016200287A1 (de) * 2016-01-13 2017-07-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Multiaperturabbildungsvorrichtungen, Verfahren zum Herstellen derselben und Abbildungssystem
CN113272707A (zh) * 2019-01-22 2021-08-17 奥林巴斯株式会社 内窥镜用摄像装置的制造方法、内窥镜用摄像装置和内窥镜

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060226452A1 (en) * 2005-04-08 2006-10-12 Konica Minolta Opto, Inc. Solid-state image pickup device and the manufacture method thereof
WO2009076786A1 (en) * 2007-12-19 2009-06-25 Heptagon Oy Spacer element and method for manufacturing a spacer element
TW200947007A (en) * 2007-12-19 2009-11-16 Heptagon Oy Optical module for a camera device, baffle substrate, wafer scale package, and manufacturing methods therefor
CN101593762A (zh) * 2008-05-29 2009-12-02 夏普株式会社 电子元件晶片模块及制造、电子元件模块和电子信息装置
CN101689533A (zh) * 2007-06-29 2010-03-31 株式会社藤仓 半导体封装组件及其制造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6235141B1 (en) * 1996-09-27 2001-05-22 Digital Optics Corporation Method of mass producing and packaging integrated optical subsystems
US6783900B2 (en) * 2002-05-13 2004-08-31 Micron Technology, Inc. Color filter imaging array and method of formation
EP1443344A1 (en) 2003-01-29 2004-08-04 Heptagon Oy Manufacturing micro-structured elements
US7329861B2 (en) * 2003-10-14 2008-02-12 Micron Technology, Inc. Integrally packaged imaging module
EP1542074A1 (en) * 2003-12-11 2005-06-15 Heptagon OY Manufacturing a replication tool, sub-master or replica
EP2315448B1 (en) * 2004-01-26 2018-03-07 DigitalOptics Corporation Thin camera having sub-pixel resolution
EP1569276A1 (en) 2004-02-27 2005-08-31 Heptagon OY Micro-optics on optoelectronics
US20070216048A1 (en) 2006-03-20 2007-09-20 Heptagon Oy Manufacturing optical elements
CN101512768B (zh) * 2006-07-17 2012-11-21 数字光学东方公司 相机系统及相关方法
US7572480B2 (en) * 2006-10-19 2009-08-11 Federal-Mogul World Wide, Inc. Method of fabricating a multilayer ceramic heating element
US7692256B2 (en) * 2007-03-23 2010-04-06 Heptagon Oy Method of producing a wafer scale package
TWI505703B (zh) * 2007-12-19 2015-10-21 新加坡恒立私人有限公司 光學模組，晶圓等級的封裝及其製造方法
TW200937642A (en) * 2007-12-19 2009-09-01 Heptagon Oy Wafer stack, integrated optical device and method for fabricating the same
US8828174B2 (en) * 2008-08-20 2014-09-09 Heptagon Micro Optics Pte. Ltd. Method of manufacturing a plurality of optical devices
JP5332423B2 (ja) * 2008-09-08 2013-11-06 ソニー株式会社 撮像装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060226452A1 (en) * 2005-04-08 2006-10-12 Konica Minolta Opto, Inc. Solid-state image pickup device and the manufacture method thereof
CN101689533A (zh) * 2007-06-29 2010-03-31 株式会社藤仓 半导体封装组件及其制造方法
WO2009076786A1 (en) * 2007-12-19 2009-06-25 Heptagon Oy Spacer element and method for manufacturing a spacer element
TW200947007A (en) * 2007-12-19 2009-11-16 Heptagon Oy Optical module for a camera device, baffle substrate, wafer scale package, and manufacturing methods therefor
CN101593762A (zh) * 2008-05-29 2009-12-02 夏普株式会社 电子元件晶片模块及制造、电子元件模块和电子信息装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110534538A (zh) * 2019-09-03 2019-12-03 豪威光电子科技（上海）有限公司 镜头模组及其形成方法
CN110808259A (zh) * 2019-11-25 2020-02-18 华天慧创科技（西安）有限公司 一种晶圆透镜模组
CN115769121A (zh) * 2020-06-30 2023-03-07 ams传感器新加坡私人有限公司 用于光学设备的间隔件
TWI747513B (zh) * 2020-08-11 2021-11-21 奇景光電股份有限公司 光學元件和晶圓級光學模組
US11808959B2 (en) 2020-08-11 2023-11-07 Himax Technologies Limited Optical element and wafer level optical module

Also Published As

Publication number Publication date
JP2013531812A (ja) 2013-08-08
US20130162882A1 (en) 2013-06-27
EP2580781A1 (en) 2013-04-17
SG186214A1 (en) 2013-01-30
TW201222795A (en) 2012-06-01
WO2011156926A1 (en) 2011-12-22
KR20130093072A (ko) 2013-08-21

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Address after: Singapore Singapore

Applicant after: HEPTAGON MICRO OPTICS PTE. LTD.

Address before: Singapore Singapore

Applicant before: Heptagon OY

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Free format text: CORRECT: APPLICANT; FROM: HEPTAGON MICRO OPTICS PTE. LTD. TO: SINGAPORE HENGLI PRIVATE LTD.

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130710