JP2013518370A5 - - Google Patents
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- JP2013518370A5 JP2013518370A5 JP2012550028A JP2012550028A JP2013518370A5 JP 2013518370 A5 JP2013518370 A5 JP 2013518370A5 JP 2012550028 A JP2012550028 A JP 2012550028A JP 2012550028 A JP2012550028 A JP 2012550028A JP 2013518370 A5 JP2013518370 A5 JP 2013518370A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sensing device
- collector portion
- layer
- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 30
- 238000000034 method Methods 0.000 claims 14
- 239000000463 material Substances 0.000 claims 10
- 238000005259 measurement Methods 0.000 claims 8
- 239000000523 sample Substances 0.000 claims 6
- 230000009977 dual effect Effects 0.000 claims 2
- 230000005284 excitation Effects 0.000 claims 2
- 230000003993 interaction Effects 0.000 claims 2
- 239000004642 Polyimide Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 238000004891 communication Methods 0.000 claims 1
- 230000003750 conditioning effect Effects 0.000 claims 1
- 238000001514 detection method Methods 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/691,695 US8889021B2 (en) | 2010-01-21 | 2010-01-21 | Process condition sensing device and method for plasma chamber |
| US12/691,695 | 2010-01-21 | ||
| PCT/US2011/020872 WO2011090850A2 (en) | 2010-01-21 | 2011-01-11 | Process condition sensing device for plasma chamber |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016201451A Division JP6316898B2 (ja) | 2010-01-21 | 2016-10-13 | プラズマチャンバのためのプロセス条件検知デバイス及び方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013518370A JP2013518370A (ja) | 2013-05-20 |
| JP2013518370A5 true JP2013518370A5 (enExample) | 2014-02-27 |
Family
ID=44276795
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012550028A Pending JP2013518370A (ja) | 2010-01-21 | 2011-01-11 | プラズマチャンバのためのプロセス条件検知デバイス |
| JP2016201451A Active JP6316898B2 (ja) | 2010-01-21 | 2016-10-13 | プラズマチャンバのためのプロセス条件検知デバイス及び方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016201451A Active JP6316898B2 (ja) | 2010-01-21 | 2016-10-13 | プラズマチャンバのためのプロセス条件検知デバイス及び方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US8889021B2 (enExample) |
| EP (1) | EP2526743B1 (enExample) |
| JP (2) | JP2013518370A (enExample) |
| KR (1) | KR101764940B1 (enExample) |
| CN (1) | CN102771194B (enExample) |
| TW (1) | TWI612852B (enExample) |
| WO (1) | WO2011090850A2 (enExample) |
Families Citing this family (65)
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| US8889021B2 (en) | 2010-01-21 | 2014-11-18 | Kla-Tencor Corporation | Process condition sensing device and method for plasma chamber |
| US9304160B1 (en) | 2012-05-08 | 2016-04-05 | Kla-Tencor Corporation | Defect inspection apparatus, system, and method |
| US9530617B2 (en) * | 2013-01-30 | 2016-12-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | In-situ charging neutralization |
| US9719867B2 (en) | 2013-05-30 | 2017-08-01 | Kla-Tencor Corporation | Method and system for measuring heat flux |
| US9420639B2 (en) | 2013-11-11 | 2016-08-16 | Applied Materials, Inc. | Smart device fabrication via precision patterning |
| US9620400B2 (en) | 2013-12-21 | 2017-04-11 | Kla-Tencor Corporation | Position sensitive substrate device |
| US10969370B2 (en) * | 2015-06-05 | 2021-04-06 | Semilab Semiconductor Physics Laboratory Co., Ltd. | Measuring semiconductor doping using constant surface potential corona charging |
| NL2017837A (en) | 2015-11-25 | 2017-06-02 | Asml Netherlands Bv | A Measurement Substrate and a Measurement Method |
| JP6630142B2 (ja) * | 2015-12-18 | 2020-01-15 | 株式会社ディスコ | 静電気検出装置 |
| US10818561B2 (en) * | 2016-01-28 | 2020-10-27 | Applied Materials, Inc. | Process monitor device having a plurality of sensors arranged in concentric circles |
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| CN109314036B (zh) * | 2016-05-10 | 2021-03-23 | 谱光仪器股份有限公司 | 侦测带电粒子装置及体现所述装置于质谱法的设备 |
| US10460966B2 (en) | 2016-06-15 | 2019-10-29 | Kla-Tencor Corporation | Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications |
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| US12288673B2 (en) | 2017-11-29 | 2025-04-29 | COMET Technologies USA, Inc. | Retuning for impedance matching network control |
| WO2019156911A1 (en) * | 2018-02-07 | 2019-08-15 | The Government Of The United States Of America As Represented By The Secretary Of The Navy | Non-invasive method for probing plasma impedance |
| KR101999622B1 (ko) * | 2018-03-30 | 2019-07-12 | 광운대학교 산학협력단 | 플라즈마 진단 시스템 및 방법 |
| EP3562285A1 (de) * | 2018-04-25 | 2019-10-30 | Siemens Aktiengesellschaft | Verbinden elektrischer bauelemente |
| KR102026733B1 (ko) * | 2018-05-11 | 2019-09-30 | 엘지전자 주식회사 | 플라즈마 공정 측정 센서 및 그 제조 방법 |
| WO2019221413A1 (ko) * | 2018-05-15 | 2019-11-21 | (주)에스엔텍 | 플라즈마 측정용 웨이퍼 |
| KR102616493B1 (ko) * | 2018-06-05 | 2023-12-21 | 엘지전자 주식회사 | 플라즈마 측정 방법 및 플라즈마 공정 측정 센서 |
| US10916411B2 (en) | 2018-08-13 | 2021-02-09 | Tokyo Electron Limited | Sensor-to-sensor matching methods for chamber matching |
| US11404296B2 (en) * | 2018-09-04 | 2022-08-02 | Applied Materials, Inc. | Method and apparatus for measuring placement of a substrate on a heater pedestal |
| US11342210B2 (en) * | 2018-09-04 | 2022-05-24 | Applied Materials, Inc. | Method and apparatus for measuring wafer movement and placement using vibration data |
| US10794681B2 (en) | 2018-09-04 | 2020-10-06 | Applied Materials, Inc. | Long range capacitive gap measurement in a wafer form sensor system |
| US11521872B2 (en) | 2018-09-04 | 2022-12-06 | Applied Materials, Inc. | Method and apparatus for measuring erosion and calibrating position for a moving process kit |
| US10847393B2 (en) | 2018-09-04 | 2020-11-24 | Applied Materials, Inc. | Method and apparatus for measuring process kit centering |
| US11373890B2 (en) * | 2018-12-17 | 2022-06-28 | Applied Materials, Inc. | Wireless in-situ real-time measurement of electrostatic chucking force in semiconductor wafer processing |
| US11289352B2 (en) | 2019-04-19 | 2022-03-29 | Applied Materials, Inc. | In-situ metrology and process control |
| US11527385B2 (en) | 2021-04-29 | 2022-12-13 | COMET Technologies USA, Inc. | Systems and methods for calibrating capacitors of matching networks |
| US11114279B2 (en) | 2019-06-28 | 2021-09-07 | COMET Technologies USA, Inc. | Arc suppression device for plasma processing equipment |
| US11596309B2 (en) | 2019-07-09 | 2023-03-07 | COMET Technologies USA, Inc. | Hybrid matching network topology |
| KR102200662B1 (ko) | 2019-10-23 | 2021-01-12 | 충남대학교 산학협력단 | 비침습형 플라즈마 공정 진단 방법 및 장치 |
| US11887820B2 (en) | 2020-01-10 | 2024-01-30 | COMET Technologies USA, Inc. | Sector shunts for plasma-based wafer processing systems |
| US11521832B2 (en) | 2020-01-10 | 2022-12-06 | COMET Technologies USA, Inc. | Uniformity control for radio frequency plasma processing systems |
| US11670488B2 (en) | 2020-01-10 | 2023-06-06 | COMET Technologies USA, Inc. | Fast arc detecting match network |
| US12027351B2 (en) * | 2020-01-10 | 2024-07-02 | COMET Technologies USA, Inc. | Plasma non-uniformity detection |
| US20210217588A1 (en) * | 2020-01-10 | 2021-07-15 | COMET Technologies USA, Inc. | Azimuthal sensor array for radio frequency plasma-based wafer processing systems |
| US11830708B2 (en) | 2020-01-10 | 2023-11-28 | COMET Technologies USA, Inc. | Inductive broad-band sensors for electromagnetic waves |
| WO2021149842A1 (ko) * | 2020-01-20 | 2021-07-29 | (주)제이디 | 정전용량 방식의 상태 측정 장치 |
| US11605527B2 (en) | 2020-01-20 | 2023-03-14 | COMET Technologies USA, Inc. | Pulsing control match network |
| US11961711B2 (en) | 2020-01-20 | 2024-04-16 | COMET Technologies USA, Inc. | Radio frequency match network and generator |
| US11668601B2 (en) | 2020-02-24 | 2023-06-06 | Kla Corporation | Instrumented substrate apparatus |
| WO2021256891A1 (ko) * | 2020-06-18 | 2021-12-23 | 주식회사 플라즈맵 | 임플란트 보관 용기의 제조방법 및 임플란트 보관 용기의 플라즈마 처리 방법 |
| EP3968353A1 (en) * | 2020-09-10 | 2022-03-16 | Impedans Ltd | Apparatus for ion energy analysis of plasma processes |
| US12315710B2 (en) | 2020-11-03 | 2025-05-27 | Kwangwoon University Industry-Academic Collaboration Foundation | Plasma diagnosis system and plasma diagnosis method |
| US12057296B2 (en) | 2021-02-22 | 2024-08-06 | COMET Technologies USA, Inc. | Electromagnetic field sensing device |
| US12219685B2 (en) | 2021-04-16 | 2025-02-04 | Lockheed Martin Corporation | Langmuir probe operating at fixed voltages |
| US11923175B2 (en) | 2021-07-28 | 2024-03-05 | COMET Technologies USA, Inc. | Systems and methods for variable gain tuning of matching networks |
| US12062529B2 (en) * | 2021-08-05 | 2024-08-13 | Applied Materials, Inc. | Microwave resonator array for plasma diagnostics |
| EP4177928B1 (en) * | 2021-11-09 | 2024-01-03 | Impedans Ltd | Two stage ion current measuring method in a device for analysis of plasma processes |
| JP2023128957A (ja) * | 2022-03-04 | 2023-09-14 | パナソニックＩｐマネジメント株式会社 | プラズマ電位センサ |
| US12243717B2 (en) | 2022-04-04 | 2025-03-04 | COMET Technologies USA, Inc. | Variable reactance device having isolated gate drive power supplies |
| US12040139B2 (en) | 2022-05-09 | 2024-07-16 | COMET Technologies USA, Inc. | Variable capacitor with linear impedance and high voltage breakdown |
| US11657980B1 (en) | 2022-05-09 | 2023-05-23 | COMET Technologies USA, Inc. | Dielectric fluid variable capacitor |
| US12051549B2 (en) | 2022-08-02 | 2024-07-30 | COMET Technologies USA, Inc. | Coaxial variable capacitor |
| CN115662867A (zh) * | 2022-09-06 | 2023-01-31 | 拓荆科技股份有限公司 | 等离子体探测器及其制备方法 |
| US12132435B2 (en) | 2022-10-27 | 2024-10-29 | COMET Technologies USA, Inc. | Method for repeatable stepper motor homing |
| EP4376050B1 (en) | 2022-11-25 | 2025-07-23 | Impedans Ltd | Shielded apparatus for ion energy analysis of plasma processes |
| KR20240115067A (ko) * | 2023-01-18 | 2024-07-25 | 삼성전자주식회사 | 플라즈마 진단 장치 및 그것의 동작 방법 |
| KR20240162309A (ko) | 2023-05-08 | 2024-11-15 | 삼성전자주식회사 | 센서 장치 및 이를 이용하는 반도체 공정 장치 |
| US20250054789A1 (en) * | 2023-08-07 | 2025-02-13 | Kla Corporation | Method of fabrication and implementation of process condition measurement device |
| JP2025078992A (ja) * | 2023-11-09 | 2025-05-21 | 東京エレクトロン株式会社 | プラズマ評価システム及びプラズマ評価方法 |
| US20250259831A1 (en) * | 2024-02-08 | 2025-08-14 | Applied Materials, Inc. | Wireless measurement characterization |
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| JP3122175B2 (ja) * | 1991-08-05 | 2001-01-09 | 忠弘 大見 | プラズマ処理装置 |
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| US20030197175A1 (en) * | 2002-04-17 | 2003-10-23 | Chong-Jen Huang | Test structure for evaluating antenna effects |
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| JP5407019B2 (ja) * | 2007-08-31 | 2014-02-05 | ラピスセミコンダクタ株式会社 | プラズマモニタリング方法 |
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| WO2010005932A2 (en) * | 2008-07-07 | 2010-01-14 | Lam Research Corporation | Plasma-facing probe arrangement including vacuum gap for use in a plasma processing chamber |
| US8889021B2 (en) | 2010-01-21 | 2014-11-18 | Kla-Tencor Corporation | Process condition sensing device and method for plasma chamber |
-
2010
- 2010-01-21 US US12/691,695 patent/US8889021B2/en active Active
- 2010-11-25 TW TW099140860A patent/TWI612852B/zh active
-
2011
- 2011-01-11 KR KR1020127018009A patent/KR101764940B1/ko active Active
- 2011-01-11 CN CN201180006694.4A patent/CN102771194B/zh active Active
- 2011-01-11 EP EP11735001.7A patent/EP2526743B1/en active Active
- 2011-01-11 JP JP2012550028A patent/JP2013518370A/ja active Pending
- 2011-01-11 WO PCT/US2011/020872 patent/WO2011090850A2/en not_active Ceased
-
2014
- 2014-10-02 US US14/505,289 patent/US20150020972A1/en not_active Abandoned
-
2016
- 2016-10-13 JP JP2016201451A patent/JP6316898B2/ja active Active
-
2017
- 2017-12-21 US US15/851,184 patent/US10777393B2/en active Active
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