JP6630142B2 - 静電気検出装置 - Google Patents
静電気検出装置 Download PDFInfo
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- JP6630142B2 JP6630142B2 JP2015247127A JP2015247127A JP6630142B2 JP 6630142 B2 JP6630142 B2 JP 6630142B2 JP 2015247127 A JP2015247127 A JP 2015247127A JP 2015247127 A JP2015247127 A JP 2015247127A JP 6630142 B2 JP6630142 B2 JP 6630142B2
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- plate
- sensor
- electrostatic charging
- static electricity
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- 239000011888 foil Substances 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
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- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
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- 239000004065 semiconductor Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
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- 230000008030 elimination Effects 0.000 description 1
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- 238000002474 experimental method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
11:カセットテーブル
12:搬出入手段
13、16:搬送手段
14:チャックテーブル
15:切削手段
17:洗浄手段
20:検出体
21:静電気帯電部板
22:収容ケース
23:センサー
24:送信部
25:電源
30:受信機
230:可動部
236:渦電流式変位センサー
Claims (4)
- 静電気検出装置であって、
静電気帯電部板と、該静電気帯電部板に帯電した静電容量を検出するセンサーと、該センサーの検出値を送信する送信部と、該静電気帯電部板を支持すると共に該センサーを収容する収容室を備えた収容ケースと、から少なくとも構成された検出体と、
該送信部から送信された検出値を受信する受信機と、から構成され、
該センサーは、片持ちで支持部に支持されると共に該静電気帯電部板に対面する導電体薄板と、該静電気帯電部板と反対側で該導電体薄板と平行に対面し該支持部に片持ちで支持された裏面に導電体箔が配設された絶縁体薄板と、
該導電体薄板の自由端部と該絶縁体薄板の自由端部とを連結する連結部材と、から構成された可動部と、
該絶縁体薄板の裏面に配設された導電体箔と対面して配設された渦電流式変位センサーと、から構成される静電気検出装置。 - 該静電気帯電部板に対面する導電体薄板がアルミ箔から構成され、該導電体薄板と平行に対面し、片持ちで支持された絶縁体薄板がポリイミドから構成され、
該導電体薄板の自由端部と該絶縁体薄板の自由端部とを連結する連結部材が糸状部材から構成された請求項1に記載の静電気検出装置。 - 該検出体は、検出すべき装置の搬送手段によって被加工物の如く搬送されて装置内の各所における静電容量を検出する請求項1又は2に記載の静電気検出装置。
- 該受信機は、検出された静電容量の値を経過時間と共に記憶する記憶部を備える請求項1乃至3のいずれかに記載の静電気検出装置。
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JP2015247127A JP6630142B2 (ja) | 2015-12-18 | 2015-12-18 | 静電気検出装置 |
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JP2015247127A JP6630142B2 (ja) | 2015-12-18 | 2015-12-18 | 静電気検出装置 |
Publications (2)
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JP2017111073A JP2017111073A (ja) | 2017-06-22 |
JP6630142B2 true JP6630142B2 (ja) | 2020-01-15 |
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JP2015247127A Active JP6630142B2 (ja) | 2015-12-18 | 2015-12-18 | 静電気検出装置 |
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Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102509643B1 (ko) * | 2018-10-31 | 2023-03-16 | 삼성전자주식회사 | 정전기 측정 장치 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6275201A (ja) * | 1985-09-30 | 1987-04-07 | Akashi Seisakusho Co Ltd | 渦電流式変位計の校正方法 |
JPH04155202A (ja) * | 1990-10-18 | 1992-05-28 | Keyence Corp | 渦電流式非接触変位計 |
JP3531890B2 (ja) * | 1995-11-21 | 2004-05-31 | アネルバ株式会社 | 表面電位測定装置、基板処理装置及び表面電位測定方法 |
JPH1154591A (ja) * | 1997-08-06 | 1999-02-26 | Texas Instr Japan Ltd | ダミーウェハ及びその使用方法 |
JP4643782B2 (ja) * | 1999-12-10 | 2011-03-02 | 株式会社キーエンス | 渦電流式変位計とそれを用いた距離測定方法 |
JP2002066865A (ja) * | 2000-09-01 | 2002-03-05 | Disco Abrasive Syst Ltd | 切削装置 |
US7960670B2 (en) * | 2005-05-03 | 2011-06-14 | Kla-Tencor Corporation | Methods of and apparatuses for measuring electrical parameters of a plasma process |
US20030115978A1 (en) * | 2001-12-20 | 2003-06-26 | Moehnke Stephanie J. | Apparatus and method for monitoring environment within a container |
US6889568B2 (en) * | 2002-01-24 | 2005-05-10 | Sensarray Corporation | Process condition sensing wafer and data analysis system |
JP2004111310A (ja) * | 2002-09-20 | 2004-04-08 | Nissin Ion Equipment Co Ltd | 基板の帯電電圧計測装置およびイオンビーム照射装置 |
US7135852B2 (en) * | 2002-12-03 | 2006-11-14 | Sensarray Corporation | Integrated process condition sensing wafer and data analysis system |
US20060043063A1 (en) * | 2004-09-02 | 2006-03-02 | Mahoney Leonard J | Electrically floating diagnostic plasma probe with ion property sensors |
US8889021B2 (en) * | 2010-01-21 | 2014-11-18 | Kla-Tencor Corporation | Process condition sensing device and method for plasma chamber |
JP5834800B2 (ja) * | 2011-11-15 | 2015-12-24 | オムロン株式会社 | 表面電位センサ及び複写機 |
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