JP2013516061A5 - - Google Patents

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Publication number
JP2013516061A5
JP2013516061A5 JP2012545503A JP2012545503A JP2013516061A5 JP 2013516061 A5 JP2013516061 A5 JP 2013516061A5 JP 2012545503 A JP2012545503 A JP 2012545503A JP 2012545503 A JP2012545503 A JP 2012545503A JP 2013516061 A5 JP2013516061 A5 JP 2013516061A5
Authority
JP
Japan
Prior art keywords
plate
outlet
wafer
plane
positioner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012545503A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013516061A (ja
Filing date
Publication date
Priority claimed from US12/645,565 external-priority patent/US20110148128A1/en
Application filed filed Critical
Publication of JP2013516061A publication Critical patent/JP2013516061A/ja
Publication of JP2013516061A5 publication Critical patent/JP2013516061A5/ja
Pending legal-status Critical Current

Links

JP2012545503A 2009-12-23 2010-12-16 半導体ウエハ輸送システム Pending JP2013516061A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/645,565 US20110148128A1 (en) 2009-12-23 2009-12-23 Semiconductor Wafer Transport System
US12/645,565 2009-12-23
PCT/IB2010/055899 WO2011077338A1 (en) 2009-12-23 2010-12-16 Semiconductor wafer transport system

Publications (2)

Publication Number Publication Date
JP2013516061A JP2013516061A (ja) 2013-05-09
JP2013516061A5 true JP2013516061A5 (https=) 2013-07-18

Family

ID=43795168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012545503A Pending JP2013516061A (ja) 2009-12-23 2010-12-16 半導体ウエハ輸送システム

Country Status (7)

Country Link
US (1) US20110148128A1 (https=)
EP (1) EP2517236A1 (https=)
JP (1) JP2013516061A (https=)
KR (1) KR20120115279A (https=)
CN (1) CN102687262A (https=)
TW (1) TW201138015A (https=)
WO (1) WO2011077338A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201402399RA (en) * 2013-05-23 2014-12-30 Asm Tech Singapore Pte Ltd A transfer device for holding an object using a gas flow
DE102013021664A1 (de) 2013-12-19 2014-07-31 Daimler Ag Verbrennungskraftmaschine, insbesondere für einen Kraftwagen
JP6128050B2 (ja) * 2014-04-25 2017-05-17 トヨタ自動車株式会社 非接触型搬送ハンド
US9911640B2 (en) * 2015-09-01 2018-03-06 Boris Kesil Universal gripping and suction chuck
TWI565569B (zh) * 2016-02-05 2017-01-11 南京瀚宇彩欣科技有限責任公司 吸著裝置、吸著系統及其應用
CN107301964A (zh) * 2016-04-15 2017-10-27 上海新昇半导体科技有限公司 伯努利基座装置及沉积设备
CN108346607B (zh) * 2017-01-25 2020-11-03 上海新昇半导体科技有限公司 竖直插入式阻挡脚及伯努利吸盘
US10804133B2 (en) 2017-11-21 2020-10-13 Taiwan Semiconductor Manufacturing Co., Ltd. Article transferring method in semiconductor fabrication
CN108183084B (zh) * 2017-12-28 2019-03-22 英特尔产品（成都）有限公司 真空吸嘴组件
CN211605120U (zh) * 2020-03-16 2020-09-29 上海晶盟硅材料有限公司 半导体晶圆的持取装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0663254U (ja) * 1993-02-24 1994-09-06 新明和工業株式会社 非接触式チャック装置
US6183183B1 (en) * 1997-01-16 2001-02-06 Asm America, Inc. Dual arm linear hand-off wafer transfer assembly
WO1999033725A1 (en) * 1997-12-30 1999-07-08 Krytek Corporation Contactless wafer pick-up chuck
US6929299B2 (en) * 2002-08-20 2005-08-16 Asm America, Inc. Bonded structures for use in semiconductor processing environments
US7100954B2 (en) * 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
US20080025835A1 (en) * 2006-07-31 2008-01-31 Juha Paul Liljeroos Bernoulli wand
US20080129064A1 (en) * 2006-12-01 2008-06-05 Asm America, Inc. Bernoulli wand

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