KR20120115279A - 반도체 웨이퍼 운송 시스템 - Google Patents

반도체 웨이퍼 운송 시스템 Download PDF

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Publication number
KR20120115279A
KR20120115279A KR1020127016257A KR20127016257A KR20120115279A KR 20120115279 A KR20120115279 A KR 20120115279A KR 1020127016257 A KR1020127016257 A KR 1020127016257A KR 20127016257 A KR20127016257 A KR 20127016257A KR 20120115279 A KR20120115279 A KR 20120115279A
Authority
KR
South Korea
Prior art keywords
plate
wafer
outlets
gas
locator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020127016257A
Other languages
English (en)
Korean (ko)
Inventor
랜스 쥐. 헬위그
토마스 에이. 토랙
존 에이. 피트니
Original Assignee
엠이엠씨 일렉트로닉 머티리얼즈, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엠이엠씨 일렉트로닉 머티리얼즈, 인크. filed Critical 엠이엠씨 일렉트로닉 머티리얼즈, 인크.
Publication of KR20120115279A publication Critical patent/KR20120115279A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020127016257A 2009-12-23 2010-12-16 반도체 웨이퍼 운송 시스템 Withdrawn KR20120115279A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/645,565 US20110148128A1 (en) 2009-12-23 2009-12-23 Semiconductor Wafer Transport System
US12/645,565 2009-12-23

Publications (1)

Publication Number Publication Date
KR20120115279A true KR20120115279A (ko) 2012-10-17

Family

ID=43795168

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127016257A Withdrawn KR20120115279A (ko) 2009-12-23 2010-12-16 반도체 웨이퍼 운송 시스템

Country Status (7)

Country Link
US (1) US20110148128A1 (https=)
EP (1) EP2517236A1 (https=)
JP (1) JP2013516061A (https=)
KR (1) KR20120115279A (https=)
CN (1) CN102687262A (https=)
TW (1) TW201138015A (https=)
WO (1) WO2011077338A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201402399RA (en) * 2013-05-23 2014-12-30 Asm Tech Singapore Pte Ltd A transfer device for holding an object using a gas flow
DE102013021664A1 (de) 2013-12-19 2014-07-31 Daimler Ag Verbrennungskraftmaschine, insbesondere für einen Kraftwagen
JP6128050B2 (ja) * 2014-04-25 2017-05-17 トヨタ自動車株式会社 非接触型搬送ハンド
US9911640B2 (en) * 2015-09-01 2018-03-06 Boris Kesil Universal gripping and suction chuck
TWI565569B (zh) * 2016-02-05 2017-01-11 南京瀚宇彩欣科技有限責任公司 吸著裝置、吸著系統及其應用
CN107301964A (zh) * 2016-04-15 2017-10-27 上海新昇半导体科技有限公司 伯努利基座装置及沉积设备
CN108346607B (zh) * 2017-01-25 2020-11-03 上海新昇半导体科技有限公司 竖直插入式阻挡脚及伯努利吸盘
US10804133B2 (en) 2017-11-21 2020-10-13 Taiwan Semiconductor Manufacturing Co., Ltd. Article transferring method in semiconductor fabrication
CN108183084B (zh) * 2017-12-28 2019-03-22 英特尔产品（成都）有限公司 真空吸嘴组件
CN211605120U (zh) * 2020-03-16 2020-09-29 上海晶盟硅材料有限公司 半导体晶圆的持取装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0663254U (ja) * 1993-02-24 1994-09-06 新明和工業株式会社 非接触式チャック装置
US6183183B1 (en) * 1997-01-16 2001-02-06 Asm America, Inc. Dual arm linear hand-off wafer transfer assembly
WO1999033725A1 (en) * 1997-12-30 1999-07-08 Krytek Corporation Contactless wafer pick-up chuck
US6929299B2 (en) * 2002-08-20 2005-08-16 Asm America, Inc. Bonded structures for use in semiconductor processing environments
US7100954B2 (en) * 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
US20080025835A1 (en) * 2006-07-31 2008-01-31 Juha Paul Liljeroos Bernoulli wand
US20080129064A1 (en) * 2006-12-01 2008-06-05 Asm America, Inc. Bernoulli wand

Also Published As

Publication number Publication date
JP2013516061A (ja) 2013-05-09
US20110148128A1 (en) 2011-06-23
TW201138015A (en) 2011-11-01
EP2517236A1 (en) 2012-10-31
CN102687262A (zh) 2012-09-19
WO2011077338A1 (en) 2011-06-30

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Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000