JP2013514641A - オプトエレクトロニクス半導体部品のハウジングの製造方法、ハウジング、およびオプトエレクトロニクス半導体部品 - Google Patents

オプトエレクトロニクス半導体部品のハウジングの製造方法、ハウジング、およびオプトエレクトロニクス半導体部品 Download PDF

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Publication number
JP2013514641A
JP2013514641A JP2012543566A JP2012543566A JP2013514641A JP 2013514641 A JP2013514641 A JP 2013514641A JP 2012543566 A JP2012543566 A JP 2012543566A JP 2012543566 A JP2012543566 A JP 2012543566A JP 2013514641 A JP2013514641 A JP 2013514641A
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Prior art keywords
reflector
housing
plastic material
inner region
electromagnetic radiation
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Japanese (ja)
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JP2013514641A5 (https=
Inventor
ゲルトルート クラウター
ベルント バーチマン
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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Publication of JP2013514641A publication Critical patent/JP2013514641A/ja
Publication of JP2013514641A5 publication Critical patent/JP2013514641A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP2012543566A 2009-12-16 2010-11-17 オプトエレクトロニクス半導体部品のハウジングの製造方法、ハウジング、およびオプトエレクトロニクス半導体部品 Withdrawn JP2013514641A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009058421.8 2009-12-16
DE102009058421A DE102009058421A1 (de) 2009-12-16 2009-12-16 Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Halbleiterbauteil, Gehäuse und optoelektronisches Halbleiterbauteil
PCT/EP2010/067705 WO2011082876A1 (de) 2009-12-16 2010-11-17 Verfahren zur herstellung eines gehäuses für ein optoelektronisches halbleiterbauteil, gehäuse und optoelektronisches halbleiterbauteil

Publications (2)

Publication Number Publication Date
JP2013514641A true JP2013514641A (ja) 2013-04-25
JP2013514641A5 JP2013514641A5 (https=) 2013-12-12

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JP2012543566A Withdrawn JP2013514641A (ja) 2009-12-16 2010-11-17 オプトエレクトロニクス半導体部品のハウジングの製造方法、ハウジング、およびオプトエレクトロニクス半導体部品

Country Status (7)

Country Link
US (1) US9331255B2 (https=)
EP (1) EP2513985A1 (https=)
JP (1) JP2013514641A (https=)
KR (1) KR20120106808A (https=)
CN (1) CN102668144A (https=)
DE (1) DE102009058421A1 (https=)
WO (1) WO2011082876A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016019000A (ja) * 2014-07-08 2016-02-01 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
JP2016019001A (ja) * 2014-07-08 2016-02-01 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
KR20170094859A (ko) * 2016-02-12 2017-08-22 엘지이노텍 주식회사 발광 소자 패키지 및 이를 포함하는 조명 장치
JPWO2016194120A1 (ja) * 2015-06-01 2017-08-24 三菱電機株式会社 発光装置、表示ユニット、及び映像表示装置
KR20170099557A (ko) * 2016-02-24 2017-09-01 엘지이노텍 주식회사 발광 소자 패키지 및 이를 포함하는 조명 장치
CN108633317A (zh) * 2016-02-12 2018-10-09 Lg 伊诺特有限公司 发光器件封装和包括该发光器件封装的照明设备

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ES2693677T3 (es) * 2011-11-17 2018-12-13 Lumens Co., Ltd. Paquete de un dispositivo emisor de luz y retroiluminación que incluye el mismo
CN103262269B (zh) * 2011-11-24 2018-06-19 惠州科锐半导体照明有限公司 Led封装件
TW201432949A (zh) * 2013-02-05 2014-08-16 隆達電子股份有限公司 發光模組及其製造方法
KR20140141227A (ko) * 2013-05-31 2014-12-10 제일모직주식회사 반사율 및 내변색성이 우수한 폴리아미드계 수지 조성물
WO2015157178A1 (en) * 2014-04-07 2015-10-15 Crystal Is, Inc. Ultraviolet light-emitting devices and methods
DE102014105839A1 (de) * 2014-04-25 2015-10-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
DE102016103059A1 (de) * 2016-02-22 2017-08-24 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
DE102016105243A1 (de) * 2016-03-21 2017-09-21 Infineon Technologies Ag Räumlich Selektives Aufrauen von Verkapselungsmasse, um eine Haftung mit einer Funktionsstruktur zu Fördern
JP7450466B2 (ja) * 2020-06-22 2024-03-15 スタンレー電気株式会社 発光装置及び発光装置の製造方法
CN112816071B (zh) * 2021-01-06 2021-12-28 国家卫星气象中心(国家空间天气监测预警中心) 一种基于云顶高度算法的红外通道辐射稳定性监测方法
WO2024235649A1 (en) * 2023-05-17 2024-11-21 Ams-Osram International Gmbh Optoelectronic semiconductor device and method for producing an optoelectronic semiconductor device

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DE19945133C2 (de) * 1999-09-21 2002-06-27 Osram Opto Semiconductors Gmbh Oberflächenmontierbares Gehäuse für Detektorbauelemente mit Seitenlichtempfindlichkeit
CN1259732C (zh) * 2000-09-29 2006-06-14 欧姆龙株式会社 光学器件及其应用
JP2002374007A (ja) * 2001-06-15 2002-12-26 Toyoda Gosei Co Ltd 発光装置
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法
CN100338786C (zh) * 2002-06-19 2007-09-19 三垦电气株式会社 半导体发光装置及其制法和半导体发光装置用反射器
TWI292961B (en) * 2002-09-05 2008-01-21 Nichia Corp Semiconductor device and an optical device using the semiconductor device
EP1597764A1 (de) 2003-02-28 2005-11-23 Osram Opto Semiconductors GmbH Optoelektronisches bauteil mit strukturiert metallisiertem gehäusekörper, verfahren zur herstellung eines derartigen bauteils und verfahren zur strukturierten metallisierung eines kunststoff enthaltenden körpers
JP4182783B2 (ja) * 2003-03-14 2008-11-19 豊田合成株式会社 Ｌｅｄパッケージ
DE10323857A1 (de) * 2003-05-26 2005-01-27 Osram Opto Semiconductors Gmbh Gehäuse für ein Laserdiodenbauelement, Laserdiodenbauelement und Verfahren zum Herstellen eines Laserdiodenbauelements
DE10360943A1 (de) * 2003-12-23 2005-07-21 Engel, Hartmut S. Beleuchtungseinrichtung
JP2005243973A (ja) * 2004-02-26 2005-09-08 Kyocera Corp 発光装置および照明装置
DE102004053116A1 (de) * 2004-11-03 2006-05-04 Tridonic Optoelectronics Gmbh Leuchtdioden-Anordnung mit Farbkonversions-Material
JP2006186297A (ja) * 2004-12-03 2006-07-13 Toshiba Corp 半導体発光装置及びその製造方法
KR100580753B1 (ko) * 2004-12-17 2006-05-15 엘지이노텍 주식회사 발광소자 패키지
KR100924474B1 (ko) 2005-03-24 2009-11-03 쿄세라 코포레이션 발광장치
KR100631992B1 (ko) * 2005-07-19 2006-10-09 삼성전기주식회사 측면 방출형 이중 렌즈 구조 ｌｅｄ 패키지
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JP2007305785A (ja) * 2006-05-11 2007-11-22 Nichia Chem Ind Ltd 発光装置
US7637628B2 (en) * 2006-06-13 2009-12-29 Light-Pod, Inc. LED light pod with modular optics and heat dissipation structure
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
JP4846498B2 (ja) * 2006-09-22 2011-12-28 株式会社東芝 光半導体装置及び光半導体装置の製造方法
DE102006046678A1 (de) * 2006-09-29 2008-04-03 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zum Herstellen eines Gehäuses für ein optoelektronisches Bauelement
KR100801621B1 (ko) * 2007-06-05 2008-02-11 서울반도체 주식회사 Ｌｅｄ 패키지
JP2008305940A (ja) * 2007-06-07 2008-12-18 Showa Denko Kk 表示装置、キャップ、発光装置、およびこれらの製造方法
US8118451B2 (en) * 2008-03-13 2012-02-21 Fraen Corporation Reflective variable spot size lighting devices and systems
US20100032702A1 (en) * 2008-08-11 2010-02-11 E. I. Du Pont De Nemours And Company Light-Emitting Diode Housing Comprising Fluoropolymer
DE102008038748B4 (de) * 2008-08-12 2022-08-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Oberflächenmontierbares, optoelektronisches Halbleiterbauteil
DE102009033287A1 (de) * 2009-07-15 2011-01-20 Osram Opto Semiconductors Gmbh Leuchtdiode und Verfahren zur Herstellung einer Leuchtdiode
US8585253B2 (en) * 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016019000A (ja) * 2014-07-08 2016-02-01 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
JP2016019001A (ja) * 2014-07-08 2016-02-01 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
JPWO2016194120A1 (ja) * 2015-06-01 2017-08-24 三菱電機株式会社 発光装置、表示ユニット、及び映像表示装置
US10256383B2 (en) 2015-06-01 2019-04-09 Mitsubishi Electric Corporation Light emitting device with dark area and greater reflectance light area, display unit, and image display device
KR20170094859A (ko) * 2016-02-12 2017-08-22 엘지이노텍 주식회사 발광 소자 패키지 및 이를 포함하는 조명 장치
CN108633317A (zh) * 2016-02-12 2018-10-09 Lg 伊诺特有限公司 发光器件封装和包括该发光器件封装的照明设备
JP2019505097A (ja) * 2016-02-12 2019-02-21 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及びこれを含む照明装置
KR102562091B1 (ko) 2016-02-12 2023-08-02 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
KR20170099557A (ko) * 2016-02-24 2017-09-01 엘지이노텍 주식회사 발광 소자 패키지 및 이를 포함하는 조명 장치
KR102509312B1 (ko) * 2016-02-24 2023-03-17 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지

Also Published As

Publication number Publication date
KR20120106808A (ko) 2012-09-26
EP2513985A1 (de) 2012-10-24
DE102009058421A1 (de) 2011-06-22
US9331255B2 (en) 2016-05-03
US20120280116A1 (en) 2012-11-08
WO2011082876A1 (de) 2011-07-14
CN102668144A (zh) 2012-09-12

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