CN102668144A - 用于制造光电子半导体构件的壳体的方法、壳体和光电子半导体构件 - Google Patents

用于制造光电子半导体构件的壳体的方法、壳体和光电子半导体构件 Download PDF

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Publication number
CN102668144A
CN102668144A CN2010800577362A CN201080057736A CN102668144A CN 102668144 A CN102668144 A CN 102668144A CN 2010800577362 A CN2010800577362 A CN 2010800577362A CN 201080057736 A CN201080057736 A CN 201080057736A CN 102668144 A CN102668144 A CN 102668144A
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CN
China
Prior art keywords
housing
plastic material
reflector parts
reflector
reflector part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010800577362A
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English (en)
Chinese (zh)
Inventor
格特鲁德·克劳特
贝恩德·巴克曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of CN102668144A publication Critical patent/CN102668144A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
CN2010800577362A 2009-12-16 2010-11-17 用于制造光电子半导体构件的壳体的方法、壳体和光电子半导体构件 Pending CN102668144A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009058421.8 2009-12-16
DE102009058421A DE102009058421A1 (de) 2009-12-16 2009-12-16 Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Halbleiterbauteil, Gehäuse und optoelektronisches Halbleiterbauteil
PCT/EP2010/067705 WO2011082876A1 (de) 2009-12-16 2010-11-17 Verfahren zur herstellung eines gehäuses für ein optoelektronisches halbleiterbauteil, gehäuse und optoelektronisches halbleiterbauteil

Publications (1)

Publication Number Publication Date
CN102668144A true CN102668144A (zh) 2012-09-12

Family

ID=43608617

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800577362A Pending CN102668144A (zh) 2009-12-16 2010-11-17 用于制造光电子半导体构件的壳体的方法、壳体和光电子半导体构件

Country Status (7)

Country Link
US (1) US9331255B2 (https=)
EP (1) EP2513985A1 (https=)
JP (1) JP2013514641A (https=)
KR (1) KR20120106808A (https=)
CN (1) CN102668144A (https=)
DE (1) DE102009058421A1 (https=)
WO (1) WO2011082876A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105261687A (zh) * 2014-07-08 2016-01-20 Lg伊诺特有限公司 发光器件封装
CN112816071A (zh) * 2021-01-06 2021-05-18 国家卫星气象中心(国家空间天气监测预警中心) 一种基于云顶高度算法的红外通道辐射稳定性监测方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2693677T3 (es) * 2011-11-17 2018-12-13 Lumens Co., Ltd. Paquete de un dispositivo emisor de luz y retroiluminación que incluye el mismo
CN103262269B (zh) * 2011-11-24 2018-06-19 惠州科锐半导体照明有限公司 Led封装件
TW201432949A (zh) * 2013-02-05 2014-08-16 隆達電子股份有限公司 發光模組及其製造方法
KR20140141227A (ko) * 2013-05-31 2014-12-10 제일모직주식회사 반사율 및 내변색성이 우수한 폴리아미드계 수지 조성물
WO2015157178A1 (en) * 2014-04-07 2015-10-15 Crystal Is, Inc. Ultraviolet light-emitting devices and methods
DE102014105839A1 (de) * 2014-04-25 2015-10-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
JP6671117B2 (ja) * 2014-07-08 2020-03-25 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
EP3306683A4 (en) 2015-06-01 2018-12-19 Mitsubishi Electric Corporation Light emitting device, display unit, and image display device
KR102509312B1 (ko) * 2016-02-24 2023-03-17 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
CN108633317B (zh) * 2016-02-12 2021-07-09 Lg 伊诺特有限公司 发光器件封装和包括该发光器件封装的照明设备
KR102562091B1 (ko) * 2016-02-12 2023-08-02 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
DE102016103059A1 (de) * 2016-02-22 2017-08-24 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
DE102016105243A1 (de) * 2016-03-21 2017-09-21 Infineon Technologies Ag Räumlich Selektives Aufrauen von Verkapselungsmasse, um eine Haftung mit einer Funktionsstruktur zu Fördern
JP7450466B2 (ja) * 2020-06-22 2024-03-15 スタンレー電気株式会社 発光装置及び発光装置の製造方法
WO2024235649A1 (en) * 2023-05-17 2024-11-21 Ams-Osram International Gmbh Optoelectronic semiconductor device and method for producing an optoelectronic semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101147270A (zh) * 2005-03-24 2008-03-19 京瓷株式会社 发光元件收纳用封装、发光装置以及照明装置
CN101150164A (zh) * 2006-09-22 2008-03-26 株式会社东芝 光半导体器件和光半导体器件的制造方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19829197C2 (de) 1998-06-30 2002-06-20 Siemens Ag Strahlungsaussendendes und/oder -empfangendes Bauelement
DE19945133C2 (de) * 1999-09-21 2002-06-27 Osram Opto Semiconductors Gmbh Oberflächenmontierbares Gehäuse für Detektorbauelemente mit Seitenlichtempfindlichkeit
CN1259732C (zh) * 2000-09-29 2006-06-14 欧姆龙株式会社 光学器件及其应用
JP2002374007A (ja) * 2001-06-15 2002-12-26 Toyoda Gosei Co Ltd 発光装置
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法
CN100338786C (zh) * 2002-06-19 2007-09-19 三垦电气株式会社 半导体发光装置及其制法和半导体发光装置用反射器
TWI292961B (en) * 2002-09-05 2008-01-21 Nichia Corp Semiconductor device and an optical device using the semiconductor device
EP1597764A1 (de) 2003-02-28 2005-11-23 Osram Opto Semiconductors GmbH Optoelektronisches bauteil mit strukturiert metallisiertem gehäusekörper, verfahren zur herstellung eines derartigen bauteils und verfahren zur strukturierten metallisierung eines kunststoff enthaltenden körpers
JP4182783B2 (ja) * 2003-03-14 2008-11-19 豊田合成株式会社 Ｌｅｄパッケージ
DE10323857A1 (de) * 2003-05-26 2005-01-27 Osram Opto Semiconductors Gmbh Gehäuse für ein Laserdiodenbauelement, Laserdiodenbauelement und Verfahren zum Herstellen eines Laserdiodenbauelements
DE10360943A1 (de) * 2003-12-23 2005-07-21 Engel, Hartmut S. Beleuchtungseinrichtung
JP2005243973A (ja) * 2004-02-26 2005-09-08 Kyocera Corp 発光装置および照明装置
DE102004053116A1 (de) * 2004-11-03 2006-05-04 Tridonic Optoelectronics Gmbh Leuchtdioden-Anordnung mit Farbkonversions-Material
JP2006186297A (ja) * 2004-12-03 2006-07-13 Toshiba Corp 半導体発光装置及びその製造方法
KR100580753B1 (ko) * 2004-12-17 2006-05-15 엘지이노텍 주식회사 발광소자 패키지
KR100631992B1 (ko) * 2005-07-19 2006-10-09 삼성전기주식회사 측면 방출형 이중 렌즈 구조 ｌｅｄ 패키지
EP1965128B1 (en) * 2005-12-22 2016-08-17 Panasonic Intellectual Property Management Co., Ltd. Lighting apparatus with leds
JP2007305785A (ja) * 2006-05-11 2007-11-22 Nichia Chem Ind Ltd 発光装置
US7637628B2 (en) * 2006-06-13 2009-12-29 Light-Pod, Inc. LED light pod with modular optics and heat dissipation structure
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
DE102006046678A1 (de) * 2006-09-29 2008-04-03 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zum Herstellen eines Gehäuses für ein optoelektronisches Bauelement
KR100801621B1 (ko) * 2007-06-05 2008-02-11 서울반도체 주식회사 Ｌｅｄ 패키지
JP2008305940A (ja) * 2007-06-07 2008-12-18 Showa Denko Kk 表示装置、キャップ、発光装置、およびこれらの製造方法
US8118451B2 (en) * 2008-03-13 2012-02-21 Fraen Corporation Reflective variable spot size lighting devices and systems
US20100032702A1 (en) * 2008-08-11 2010-02-11 E. I. Du Pont De Nemours And Company Light-Emitting Diode Housing Comprising Fluoropolymer
DE102008038748B4 (de) * 2008-08-12 2022-08-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Oberflächenmontierbares, optoelektronisches Halbleiterbauteil
DE102009033287A1 (de) * 2009-07-15 2011-01-20 Osram Opto Semiconductors Gmbh Leuchtdiode und Verfahren zur Herstellung einer Leuchtdiode
US8585253B2 (en) * 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101147270A (zh) * 2005-03-24 2008-03-19 京瓷株式会社 发光元件收纳用封装、发光装置以及照明装置
CN101150164A (zh) * 2006-09-22 2008-03-26 株式会社东芝 光半导体器件和光半导体器件的制造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105261687A (zh) * 2014-07-08 2016-01-20 Lg伊诺特有限公司 发光器件封装
CN105261687B (zh) * 2014-07-08 2019-02-01 Lg伊诺特有限公司 发光器件封装
CN112816071A (zh) * 2021-01-06 2021-05-18 国家卫星气象中心(国家空间天气监测预警中心) 一种基于云顶高度算法的红外通道辐射稳定性监测方法

Also Published As

Publication number Publication date
KR20120106808A (ko) 2012-09-26
EP2513985A1 (de) 2012-10-24
DE102009058421A1 (de) 2011-06-22
US9331255B2 (en) 2016-05-03
US20120280116A1 (en) 2012-11-08
WO2011082876A1 (de) 2011-07-14
JP2013514641A (ja) 2013-04-25

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Application publication date: 20120912