JP2013511823A5 - - Google Patents

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Publication number
JP2013511823A5
JP2013511823A5 JP2012539080A JP2012539080A JP2013511823A5 JP 2013511823 A5 JP2013511823 A5 JP 2013511823A5 JP 2012539080 A JP2012539080 A JP 2012539080A JP 2012539080 A JP2012539080 A JP 2012539080A JP 2013511823 A5 JP2013511823 A5 JP 2013511823A5
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JP
Japan
Prior art keywords
workpiece
plasma
focusing plate
aperture
scanning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012539080A
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English (en)
Japanese (ja)
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JP2013511823A (ja
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Publication date
Priority claimed from US12/947,078 external-priority patent/US8461030B2/en
Application filed filed Critical
Publication of JP2013511823A publication Critical patent/JP2013511823A/ja
Publication of JP2013511823A5 publication Critical patent/JP2013511823A5/ja
Pending legal-status Critical Current

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JP2012539080A 2009-11-17 2010-11-17 ワークピースの注入処理を制御可能に実行する装置および方法 Pending JP2013511823A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US26198309P 2009-11-17 2009-11-17
US61/261,983 2009-11-17
US12/947,078 2010-11-16
US12/947,078 US8461030B2 (en) 2009-11-17 2010-11-16 Apparatus and method for controllably implanting workpieces
PCT/US2010/056952 WO2011062945A1 (en) 2009-11-17 2010-11-17 Apparatus and method for controllably implanting workpieces

Publications (2)

Publication Number Publication Date
JP2013511823A JP2013511823A (ja) 2013-04-04
JP2013511823A5 true JP2013511823A5 (enExample) 2013-11-21

Family

ID=43601664

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012539080A Pending JP2013511823A (ja) 2009-11-17 2010-11-17 ワークピースの注入処理を制御可能に実行する装置および方法

Country Status (7)

Country Link
US (2) US8461030B2 (enExample)
EP (1) EP2502254A1 (enExample)
JP (1) JP2013511823A (enExample)
KR (1) KR20120105469A (enExample)
CN (1) CN102971825A (enExample)
TW (1) TWI485743B (enExample)
WO (1) WO2011062945A1 (enExample)

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US20110027463A1 (en) * 2009-06-16 2011-02-03 Varian Semiconductor Equipment Associates, Inc. Workpiece handling system
US8749053B2 (en) 2009-06-23 2014-06-10 Intevac, Inc. Plasma grid implant system for use in solar cell fabrications
US8164068B2 (en) * 2009-07-30 2012-04-24 Varian Semiconductor Equipment Associates, Inc. Mask health monitor using a faraday probe
US8592230B2 (en) 2010-04-22 2013-11-26 Varian Semiconductor Equipment Associates, Inc. Method for patterning a substrate using ion assisted selective depostion
US8435727B2 (en) 2010-10-01 2013-05-07 Varian Semiconductor Equipment Associates, Inc. Method and system for modifying photoresist using electromagnetic radiation and ion implantation
KR101915753B1 (ko) * 2010-10-21 2018-11-07 삼성디스플레이 주식회사 이온 주입 시스템 및 이를 이용한 이온 주입 방법
DE102010060910A1 (de) * 2010-11-30 2012-05-31 Roth & Rau Ag Verfahren und Vorrichtung zur Ionenimplantation
US8907307B2 (en) * 2011-03-11 2014-12-09 Varian Semiconductor Equipment Associates, Inc. Apparatus and method for maskless patterned implantation
US8716682B2 (en) 2011-04-04 2014-05-06 Varian Semiconductor Equipment Associates, Inc. Apparatus and method for multiple slot ion implantation
US8288741B1 (en) * 2011-08-16 2012-10-16 Varian Semiconductor Equipment Associates, Inc. Apparatus and method for three dimensional ion processing
US9437392B2 (en) 2011-11-02 2016-09-06 Varian Semiconductor Equipment Associates, Inc. High-throughput ion implanter
WO2013070978A2 (en) 2011-11-08 2013-05-16 Intevac, Inc. Substrate processing system and method
US9297063B2 (en) 2012-04-26 2016-03-29 Varian Semiconductor Equipment Associates, Inc. Plasma potential modulated ion implantation system
JP2014045036A (ja) * 2012-08-24 2014-03-13 Amaya Corp 半導体装置の製造方法
TWI570745B (zh) * 2012-12-19 2017-02-11 因特瓦克公司 用於電漿離子植入之柵極
US9232628B2 (en) 2013-02-20 2016-01-05 Varian Semiconductor Equipment Associates, Inc. Method and system for plasma-assisted ion beam processing
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US20140360670A1 (en) * 2013-06-05 2014-12-11 Tokyo Electron Limited Processing system for non-ambipolar electron plasma (nep) treatment of a substrate with sheath potential
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US9711316B2 (en) 2013-10-10 2017-07-18 Varian Semiconductor Equipment Associates, Inc. Method of cleaning an extraction electrode assembly using pulsed biasing
US9520267B2 (en) * 2014-06-20 2016-12-13 Applied Mateirals, Inc. Bias voltage frequency controlled angular ion distribution in plasma processing
US9514912B2 (en) * 2014-09-10 2016-12-06 Varian Semiconductor Equipment Associates, Inc. Control of ion angular distribution of ion beams with hidden deflection electrode
US9287148B1 (en) * 2014-12-18 2016-03-15 Varian Semiconductor Equipment Associates, Inc. Dynamic heating method and system for wafer processing
US10730082B2 (en) * 2016-10-26 2020-08-04 Varian Semiconductor Equipment Associates, Inc. Apparatus and method for differential in situ cleaning
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US10276340B1 (en) * 2017-12-20 2019-04-30 Varian Semiconductor Equipment Associates, Inc. Low particle capacitively coupled components for workpiece processing
US10468226B1 (en) 2018-09-21 2019-11-05 Varian Semiconductor Equipment Associates, Inc. Extraction apparatus and system for high throughput ion beam processing
US11193198B2 (en) * 2018-12-17 2021-12-07 Applied Materials, Inc. Methods of forming devices on a substrate

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US8008176B2 (en) 2009-08-11 2011-08-30 Varian Semiconductor Equipment Associates, Inc. Masked ion implant with fast-slow scan
US8173527B2 (en) 2009-10-19 2012-05-08 Varian Semiconductor Equipment Associates, Inc. Stepped masking for patterned implantation

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