JP2013255924A5 - - Google Patents

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Publication number
JP2013255924A5
JP2013255924A5 JP2012132094A JP2012132094A JP2013255924A5 JP 2013255924 A5 JP2013255924 A5 JP 2013255924A5 JP 2012132094 A JP2012132094 A JP 2012132094A JP 2012132094 A JP2012132094 A JP 2012132094A JP 2013255924 A5 JP2013255924 A5 JP 2013255924A5
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JP
Japan
Prior art keywords
solder
base material
molten solder
thin film
molten
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012132094A
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English (en)
Japanese (ja)
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JP5692170B2 (ja
JP2013255924A (ja
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Publication date
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Priority claimed from JP2012132094A external-priority patent/JP5692170B2/ja
Priority to JP2012132094A priority Critical patent/JP5692170B2/ja
Priority to EP13804275.9A priority patent/EP2859980B1/en
Priority to US14/407,040 priority patent/US9956634B2/en
Priority to KR1020157000397A priority patent/KR101591633B1/ko
Priority to CN201380030927.3A priority patent/CN104395029B/zh
Priority to PCT/JP2013/065953 priority patent/WO2013187362A1/ja
Priority to TW102120645A priority patent/TWI538757B/zh
Publication of JP2013255924A publication Critical patent/JP2013255924A/ja
Publication of JP2013255924A5 publication Critical patent/JP2013255924A5/ja
Publication of JP5692170B2 publication Critical patent/JP5692170B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012132094A 2012-06-11 2012-06-11 溶融はんだ薄膜被覆装置、薄膜はんだ被覆部材及びその製造方法 Active JP5692170B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2012132094A JP5692170B2 (ja) 2012-06-11 2012-06-11 溶融はんだ薄膜被覆装置、薄膜はんだ被覆部材及びその製造方法
CN201380030927.3A CN104395029B (zh) 2012-06-11 2013-06-10 熔融软钎料薄膜覆盖装置、薄膜软钎料覆盖构件及其制造方法
US14/407,040 US9956634B2 (en) 2012-06-11 2013-06-10 Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor
KR1020157000397A KR101591633B1 (ko) 2012-06-11 2013-06-10 용융 땜납 박막 피복 장치, 박막 땜납 피복 부재 및 그 제조 방법
EP13804275.9A EP2859980B1 (en) 2012-06-11 2013-06-10 Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor
PCT/JP2013/065953 WO2013187362A1 (ja) 2012-06-11 2013-06-10 溶融はんだ薄膜被覆装置、薄膜はんだ被覆部材及びその製造方法
TW102120645A TWI538757B (zh) 2012-06-11 2013-06-11 A molten solder film coating apparatus, a thin film solder coating member, and a method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012132094A JP5692170B2 (ja) 2012-06-11 2012-06-11 溶融はんだ薄膜被覆装置、薄膜はんだ被覆部材及びその製造方法

Publications (3)

Publication Number Publication Date
JP2013255924A JP2013255924A (ja) 2013-12-26
JP2013255924A5 true JP2013255924A5 (enExample) 2015-01-29
JP5692170B2 JP5692170B2 (ja) 2015-04-01

Family

ID=49758184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012132094A Active JP5692170B2 (ja) 2012-06-11 2012-06-11 溶融はんだ薄膜被覆装置、薄膜はんだ被覆部材及びその製造方法

Country Status (7)

Country Link
US (1) US9956634B2 (enExample)
EP (1) EP2859980B1 (enExample)
JP (1) JP5692170B2 (enExample)
KR (1) KR101591633B1 (enExample)
CN (1) CN104395029B (enExample)
TW (1) TWI538757B (enExample)
WO (1) WO2013187362A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITPD20130284A1 (it) * 2013-10-16 2015-04-17 Columbus Superconductors S P A Impianto di brasatura in continuo e processo di brasatura
EP3281739B1 (en) * 2015-03-30 2022-09-14 Senju Metal Industry Co., Ltd Flux coating device and solder
JP5884932B1 (ja) * 2015-05-27 2016-03-15 千住金属工業株式会社 液体塗布装置
US20170245404A1 (en) * 2016-02-19 2017-08-24 Alpha Assembly Solutions Inc. Rf shield with selectively integrated solder
KR101958992B1 (ko) * 2018-09-21 2019-03-18 (주)비전테크놀러지 코팅 및 건조 시스템
US11384419B2 (en) * 2019-08-30 2022-07-12 Micromaierials Llc Apparatus and methods for depositing molten metal onto a foil substrate
US11541472B2 (en) * 2020-01-29 2023-01-03 International Business Machines Corporation Ultrasonic-assisted solder transfer
CN120967276A (zh) * 2024-12-19 2025-11-18 湖州金钛导体技术有限公司 一种插针导体连续热浸镀模具

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3499418A (en) * 1966-12-01 1970-03-10 Nat Steel Corp Continuous metallic strip hot-dip metal coating apparatus
US3607366A (en) * 1968-11-14 1971-09-21 Yawata Iron & Steel Co Removal of excess molten metal coatings by gas blast without ripple formations on coated surfaces
US3865298A (en) * 1973-08-14 1975-02-11 Atomic Energy Commission Solder leveling
US4083323A (en) * 1975-08-07 1978-04-11 Xerox Corporation Pneumatic system for solder leveling apparatus
US4608941A (en) 1985-01-10 1986-09-02 Teledyne Electro-Mechanisms Apparatus for soldering printed circuit panels
JPH04308071A (ja) 1991-04-03 1992-10-30 Furukawa Electric Co Ltd:The 線材の溶融すずまたは半田めっき方法
JP2808200B2 (ja) * 1991-08-20 1998-10-08 住友特殊金属株式会社 半田または錫溶融めっき材のめっき表面平滑化方法
JPH06248408A (ja) * 1993-03-01 1994-09-06 Hitachi Cable Ltd めっきクラッド条の製造方法
JPH09214115A (ja) 1996-01-31 1997-08-15 Senju Metal Ind Co Ltd ファインピッチ部品のはんだコート方法
US5860575A (en) * 1996-09-30 1999-01-19 Akin; James Sherill Stability enhancement of molten solder droplets as ejected from a nozzle of droplet pump
JPH10178265A (ja) 1996-12-19 1998-06-30 Senju Metal Ind Co Ltd はんだコート方法
US6042648A (en) 1997-07-15 2000-03-28 Corey; Dave O. Vertical circuit board soldering apparatus
JP3767169B2 (ja) 1998-04-20 2006-04-19 千住金属工業株式会社 はんだコーティング材の製造方法
JP2000087204A (ja) 1998-09-17 2000-03-28 Totoku Electric Co Ltd 錫ー銅合金めっき線
JP2002184240A (ja) 2000-12-12 2002-06-28 Totoku Electric Co Ltd 錫めっき線及び錫合金はんだめっき線
EP2166124A1 (en) 2008-09-12 2010-03-24 Linde AG Method and apparatus for continuous hot-dip coating of metal strips
WO2010140375A1 (ja) * 2009-06-04 2010-12-09 パナソニック株式会社 噴流半田付け装置および半田付け方法
JP4665071B1 (ja) 2010-04-22 2011-04-06 ホライゾン技術研究所株式会社 錫またははんだプリコート皮膜の形成方法及びその装置
JPWO2013080910A1 (ja) 2011-11-28 2015-04-27 日立金属株式会社 めっき膜厚制御用ガスノズルおよびこれを用いた溶融めっき装置

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