JP2013229489A5 - - Google Patents

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Publication number
JP2013229489A5
JP2013229489A5 JP2012101297A JP2012101297A JP2013229489A5 JP 2013229489 A5 JP2013229489 A5 JP 2013229489A5 JP 2012101297 A JP2012101297 A JP 2012101297A JP 2012101297 A JP2012101297 A JP 2012101297A JP 2013229489 A5 JP2013229489 A5 JP 2013229489A5
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JP
Japan
Prior art keywords
circuit board
printed circuit
wire
flat cable
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012101297A
Other languages
English (en)
Japanese (ja)
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JP2013229489A (ja
JP5660076B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2012101297A priority Critical patent/JP5660076B2/ja
Priority claimed from JP2012101297A external-priority patent/JP5660076B2/ja
Priority to US13/828,142 priority patent/US9125308B2/en
Priority to DE102013204565.4A priority patent/DE102013204565B4/de
Priority to CN201310147145.XA priority patent/CN103379735B/zh
Publication of JP2013229489A publication Critical patent/JP2013229489A/ja
Publication of JP2013229489A5 publication Critical patent/JP2013229489A5/ja
Application granted granted Critical
Publication of JP5660076B2 publication Critical patent/JP5660076B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012101297A 2012-04-26 2012-04-26 半導体装置とその製造方法 Active JP5660076B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012101297A JP5660076B2 (ja) 2012-04-26 2012-04-26 半導体装置とその製造方法
US13/828,142 US9125308B2 (en) 2012-04-26 2013-03-14 Semiconductor device and method of manufacturing thereof
DE102013204565.4A DE102013204565B4 (de) 2012-04-26 2013-03-15 Halbleitervorrichtung und Verfahren zum Herstellen derselben
CN201310147145.XA CN103379735B (zh) 2012-04-26 2013-04-25 半导体装置及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012101297A JP5660076B2 (ja) 2012-04-26 2012-04-26 半導体装置とその製造方法

Publications (3)

Publication Number Publication Date
JP2013229489A JP2013229489A (ja) 2013-11-07
JP2013229489A5 true JP2013229489A5 (OSRAM) 2014-10-09
JP5660076B2 JP5660076B2 (ja) 2015-01-28

Family

ID=49323389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012101297A Active JP5660076B2 (ja) 2012-04-26 2012-04-26 半導体装置とその製造方法

Country Status (4)

Country Link
US (1) US9125308B2 (OSRAM)
JP (1) JP5660076B2 (OSRAM)
CN (1) CN103379735B (OSRAM)
DE (1) DE102013204565B4 (OSRAM)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022127941A1 (de) * 2022-10-21 2024-05-02 Vega Grieshaber Kg Feldgerät und Verfahren zur kompakten Anordnung von elektronischen Baugruppen einer Elektronikschaltung

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4860075U (OSRAM) * 1971-11-12 1973-07-31
JPS5340476U (OSRAM) * 1976-09-10 1978-04-07
JPS5943593A (ja) 1982-09-06 1984-03-10 富士通株式会社 電子回路モジユ−ルの製造方法
DE8413336U1 (de) 1984-05-02 1984-08-23 Gossen Gmbh, 8520 Erlangen Flachbandkabel
US5288950A (en) * 1991-02-15 1994-02-22 Sumitomo Metal Mining Company Limited Flexible wiring board and method of preparing the same
US5428190A (en) * 1993-07-02 1995-06-27 Sheldahl, Inc. Rigid-flex board with anisotropic interconnect and method of manufacture
JP3286104B2 (ja) * 1995-01-24 2002-05-27 ヒロセ電機株式会社 保持体付同軸セミリジッドケーブル組立体
JP3430192B2 (ja) * 1996-11-12 2003-07-28 株式会社日立産機システム インバータ装置
JPH10209594A (ja) * 1997-01-17 1998-08-07 Fuji Photo Optical Co Ltd フレキシブルプリント回路基板と硬質プリント回路基板との接続構造
WO2000065888A1 (fr) 1999-04-22 2000-11-02 Rohm Co., Ltd. Carte de circuit imprime, bloc batterie et procede de fabrication de carte de circuit imprime
JP3667176B2 (ja) * 1999-11-12 2005-07-06 平河ヒューテック株式会社 フラットケーブルおよびその製造方法
JP4667652B2 (ja) * 2001-06-12 2011-04-13 ローム株式会社 電池パック、およびその製造方法
JP4330294B2 (ja) 2001-08-10 2009-09-16 三菱電機株式会社 電力用半導体装置
JP2003100156A (ja) 2001-09-26 2003-04-04 Canon Inc ケーブル及び電子機器
JP2004297972A (ja) * 2003-03-28 2004-10-21 Toyota Industries Corp 半導体装置
JP4265394B2 (ja) * 2003-12-17 2009-05-20 株式会社日立製作所 電力変換装置
US7148428B2 (en) 2004-09-27 2006-12-12 Intel Corporation Flexible cable for high-speed interconnect
JP4673211B2 (ja) * 2005-12-27 2011-04-20 日立オートモティブシステムズ株式会社 電力変換装置
CN101803475B (zh) 2007-09-21 2012-03-21 三菱电机株式会社 柔性布线基板的固定构造
JP2010105640A (ja) 2008-10-31 2010-05-13 Nsk Ltd 電動パワーステアリング装置
JP2010165914A (ja) 2009-01-16 2010-07-29 Toshiba Carrier Corp インバータ装置及びインバータ装置の製造方法
JP5153706B2 (ja) 2009-03-26 2013-02-27 京セラ株式会社 Ｅｃｕ用混成集積回路装置
JP5375408B2 (ja) * 2009-07-24 2013-12-25 住友電気工業株式会社 同軸線ハーネス
US9363894B2 (en) 2010-09-24 2016-06-07 Semiconductor Components Industries, Llc Circuit device
JP5579576B2 (ja) 2010-11-08 2014-08-27 サンドビック株式会社 無端ベルトの製造方法及び装着方法

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