JP2013207247A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2013207247A5 JP2013207247A5 JP2012077643A JP2012077643A JP2013207247A5 JP 2013207247 A5 JP2013207247 A5 JP 2013207247A5 JP 2012077643 A JP2012077643 A JP 2012077643A JP 2012077643 A JP2012077643 A JP 2012077643A JP 2013207247 A5 JP2013207247 A5 JP 2013207247A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- electrode layer
- insulating layer
- protective film
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims 59
- 239000004065 semiconductor Substances 0.000 claims 16
- 230000001681 protective effect Effects 0.000 claims 12
- 238000005530 etching Methods 0.000 claims 10
- 238000004519 manufacturing process Methods 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 239000011241 protective layer Substances 0.000 claims 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012077643A JP5965696B2 (ja) | 2012-03-29 | 2012-03-29 | 半導体装置及び半導体装置の作製方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012077643A JP5965696B2 (ja) | 2012-03-29 | 2012-03-29 | 半導体装置及び半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013207247A JP2013207247A (ja) | 2013-10-07 |
| JP2013207247A5 true JP2013207247A5 (enExample) | 2015-04-30 |
| JP5965696B2 JP5965696B2 (ja) | 2016-08-10 |
Family
ID=49526005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012077643A Expired - Fee Related JP5965696B2 (ja) | 2012-03-29 | 2012-03-29 | 半導体装置及び半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5965696B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6237279B2 (ja) | 2014-01-31 | 2017-11-29 | 国立大学法人 奈良先端科学技術大学院大学 | 保護膜を具備する薄膜トランジスタ基板およびその製造方法 |
| CN116234296B (zh) * | 2022-01-18 | 2024-09-17 | 北京超弦存储器研究院 | 动态存储器以及soc芯片 |
| CN116209244B (zh) * | 2022-01-26 | 2024-02-23 | 北京超弦存储器研究院 | 动态存储器及存储装置 |
| CN116234298B (zh) * | 2022-01-26 | 2024-02-23 | 北京超弦存储器研究院 | 动态存储器及soc芯片 |
| CN116234299B (zh) * | 2022-01-27 | 2024-02-23 | 北京超弦存储器研究院 | 动态存储器及其制作方法、soc芯片 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06120499A (ja) * | 1992-10-05 | 1994-04-28 | Sharp Corp | 薄膜トランジスタ、液晶表示装置および薄膜トランジスタの製造方法 |
| JP3600712B2 (ja) * | 1997-06-25 | 2004-12-15 | 三菱電機株式会社 | 薄膜トランジスタおよびその製造方法ならびにこれを搭載した液晶表示装置 |
| JP4342826B2 (ja) * | 2003-04-23 | 2009-10-14 | 株式会社半導体エネルギー研究所 | 半導体素子の作製方法 |
| JP5255756B2 (ja) * | 2005-08-23 | 2013-08-07 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
-
2012
- 2012-03-29 JP JP2012077643A patent/JP5965696B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2011009719A5 (enExample) | ||
| JP2014042005A5 (enExample) | ||
| JP2016021562A5 (enExample) | ||
| JP2012015500A5 (enExample) | ||
| JP2017045989A5 (enExample) | ||
| JP2014158018A5 (enExample) | ||
| JP2013102149A5 (enExample) | ||
| JP2013016785A5 (enExample) | ||
| JP2015156515A5 (ja) | 半導体装置の作製方法 | |
| JP2012049514A5 (enExample) | ||
| JP2012256836A5 (ja) | 半導体装置 | |
| JP2011181917A5 (enExample) | ||
| JP2014199905A5 (ja) | 半導体装置の作製方法 | |
| JP2017017320A5 (enExample) | ||
| JP2014007388A5 (ja) | 半導体装置の作製方法 | |
| TW201613097A (en) | Semiconductor device and method of fabricating non-planar circuit device | |
| JP2013021317A5 (enExample) | ||
| JP2012160717A5 (ja) | トランジスタ | |
| JP2013110393A5 (enExample) | ||
| GB2524677A (en) | Deep gate-all-around semiconductor device having germanium or group III-V active layer | |
| JP2011139051A5 (ja) | 半導体装置の作製方法 | |
| JP2013149963A5 (ja) | 半導体装置の作製方法 | |
| JP2013168644A5 (ja) | 半導体装置 | |
| JP2012199527A5 (ja) | 半導体装置の作製方法 | |
| JP2012033911A5 (enExample) |