JP2013190252A5 - - Google Patents

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Publication number
JP2013190252A5
JP2013190252A5 JP2012055362A JP2012055362A JP2013190252A5 JP 2013190252 A5 JP2013190252 A5 JP 2013190252A5 JP 2012055362 A JP2012055362 A JP 2012055362A JP 2012055362 A JP2012055362 A JP 2012055362A JP 2013190252 A5 JP2013190252 A5 JP 2013190252A5
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JP
Japan
Prior art keywords
image
light
sample surface
sample
scattered
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Granted
Application number
JP2012055362A
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English (en)
Japanese (ja)
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JP2013190252A (ja
JP5865738B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2012055362A priority Critical patent/JP5865738B2/ja
Priority claimed from JP2012055362A external-priority patent/JP5865738B2/ja
Priority to PCT/JP2012/077250 priority patent/WO2013136574A1/ja
Priority to US14/377,753 priority patent/US9513228B2/en
Publication of JP2013190252A publication Critical patent/JP2013190252A/ja
Publication of JP2013190252A5 publication Critical patent/JP2013190252A5/ja
Application granted granted Critical
Publication of JP5865738B2 publication Critical patent/JP5865738B2/ja
Priority to US15/299,662 priority patent/US9976966B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012055362A 2012-03-13 2012-03-13 欠陥検査方法及びその装置 Expired - Fee Related JP5865738B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012055362A JP5865738B2 (ja) 2012-03-13 2012-03-13 欠陥検査方法及びその装置
PCT/JP2012/077250 WO2013136574A1 (ja) 2012-03-13 2012-10-22 欠陥検査方法及びその装置
US14/377,753 US9513228B2 (en) 2012-03-13 2012-10-22 Defect inspection method and its device
US15/299,662 US9976966B2 (en) 2012-03-13 2016-10-21 Defect inspection method and its device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012055362A JP5865738B2 (ja) 2012-03-13 2012-03-13 欠陥検査方法及びその装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015198636A Division JP6067083B2 (ja) 2015-10-06 2015-10-06 欠陥検査方法及びその装置

Publications (3)

Publication Number Publication Date
JP2013190252A JP2013190252A (ja) 2013-09-26
JP2013190252A5 true JP2013190252A5 (enExample) 2014-08-21
JP5865738B2 JP5865738B2 (ja) 2016-02-17

Family

ID=49160528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012055362A Expired - Fee Related JP5865738B2 (ja) 2012-03-13 2012-03-13 欠陥検査方法及びその装置

Country Status (3)

Country Link
US (2) US9513228B2 (enExample)
JP (1) JP5865738B2 (enExample)
WO (1) WO2013136574A1 (enExample)

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CN104034508B (zh) * 2013-03-08 2017-01-11 佳能株式会社 光学检查设备和光学检查系统
ITMI20130692A1 (it) * 2013-04-26 2014-10-27 Copan Italia Spa Dispositivo e procedimento per il processamento automatico di piastre di coltura per campioni microbiologici
TWI504912B (zh) * 2014-08-07 2015-10-21 Utechzone Co Ltd 光源設備
US10444160B2 (en) 2014-09-18 2019-10-15 Zhejiang University Surface defects evaluation system and method for spherical optical components
US9915524B2 (en) * 2015-05-11 2018-03-13 Kla-Tencor Corporation Optical metrology with small illumination spot size
US10482551B2 (en) * 2015-08-10 2019-11-19 Google Llc Systems and methods of automatically estimating restaurant wait times using wearable devices
US10444162B2 (en) 2017-04-03 2019-10-15 Samsung Electronics Co., Ltd. Method of testing an object and apparatus for performing the same
US10429315B2 (en) 2017-07-18 2019-10-01 Samsung Electronics Co., Ltd. Imaging apparatus and imaging method
JP2019090625A (ja) * 2017-11-10 2019-06-13 ミツミ電機株式会社 測距カメラ
KR102632562B1 (ko) 2018-08-22 2024-02-02 삼성전자주식회사 Si 기반 검사 장치와 검사 방법, 및 그 검사 방법을 포함한 반도체 소자 제조방법
JP6639746B1 (ja) * 2019-01-08 2020-02-05 三菱電機株式会社 レーザ増幅器
US11112691B2 (en) 2019-01-16 2021-09-07 Kla Corporation Inspection system with non-circular pupil
WO2021205650A1 (ja) * 2020-04-10 2021-10-14 株式会社日立ハイテク 照明光学系および基板検査装置
KR102840033B1 (ko) * 2020-09-04 2025-07-29 삼성전자주식회사 멀티 스케일의 스펙트럼 이미징 장치 및 방법, 및 그 방법을 이용한 반도체 소자 제조방법
KR102260167B1 (ko) * 2020-09-29 2021-06-03 케이맥(주) 디스플레이 패널의 다층 경계면 불량 검사 시스템 및 방법
DE102021201690A1 (de) 2021-02-23 2022-08-25 Carl Zeiss Smt Gmbh Optisches System, insbesondere für die EUV-Lithographie
WO2022215179A1 (ja) * 2021-04-06 2022-10-13 株式会社日立ハイテク 表面検査装置および形状計測ソフトウェア
CN114280080A (zh) * 2021-12-10 2022-04-05 华虹半导体(无锡)有限公司 一种透明薄片状缺陷的检测方法

Family Cites Families (15)

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JPH05209841A (ja) 1992-01-13 1993-08-20 Hitachi Ltd 異物検出方法およびその装置
JP3599630B2 (ja) * 1993-03-09 2004-12-08 株式会社ルネサステクノロジ 欠陥検査方法及び欠陥検査装置
JP3211538B2 (ja) * 1994-01-13 2001-09-25 キヤノン株式会社 検査装置及びそれを用いた半導体デバイスの製造方法
JPH09269295A (ja) * 1996-04-02 1997-10-14 Nikon Corp 異物検査装置
JPH10123060A (ja) * 1996-10-17 1998-05-15 Olympus Optical Co Ltd 欠陥検査装置
US6608676B1 (en) * 1997-08-01 2003-08-19 Kla-Tencor Corporation System for detecting anomalies and/or features of a surface
JP2002055059A (ja) * 2000-08-10 2002-02-20 Nikon Corp 異物検査装置、露光装置、及び露光方法
EP1546691A1 (en) * 2002-09-30 2005-06-29 Applied Materials Israel Ltd. Inspection system with oblique viewing angle
US7199946B2 (en) 2005-06-06 2007-04-03 Kla-Tencor Technologies Corp. Systems configured to provide illumination of a specimen during inspection
JP5132982B2 (ja) * 2007-05-02 2013-01-30 株式会社日立ハイテクノロジーズ パターン欠陥検査装置および方法
JP2009053132A (ja) * 2007-08-29 2009-03-12 Hitachi High-Technologies Corp 欠陥検査方法および欠陥検査装置
JP2009236791A (ja) * 2008-03-28 2009-10-15 Hitachi High-Technologies Corp 欠陥検査方法及び欠陥検査装置
JP2010025713A (ja) * 2008-07-18 2010-02-04 Hitachi High-Technologies Corp 欠陥検査方法及び欠陥検査装置
JP5171744B2 (ja) 2009-07-01 2013-03-27 株式会社日立ハイテクノロジーズ 欠陥検査方法およびその装置
JP5520737B2 (ja) * 2010-07-30 2014-06-11 株式会社日立ハイテクノロジーズ 欠陥検査装置および欠陥検査方法

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