JP2013179261A5 - - Google Patents
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- Publication number
- JP2013179261A5 JP2013179261A5 JP2012263052A JP2012263052A JP2013179261A5 JP 2013179261 A5 JP2013179261 A5 JP 2013179261A5 JP 2012263052 A JP2012263052 A JP 2012263052A JP 2012263052 A JP2012263052 A JP 2012263052A JP 2013179261 A5 JP2013179261 A5 JP 2013179261A5
- Authority
- JP
- Japan
- Prior art keywords
- switching element
- connection electrode
- switching
- arrangement surface
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012263052A JP5935672B2 (ja) | 2012-01-31 | 2012-11-30 | スイッチング素子ユニット |
| KR1020147014786A KR101691707B1 (ko) | 2012-01-31 | 2013-01-29 | 스위칭소자 유닛 |
| CN201380004115.1A CN104160501B (zh) | 2012-01-31 | 2013-01-29 | 开关元件单元 |
| EP13706754.2A EP2766930B1 (en) | 2012-01-31 | 2013-01-29 | Switching element unit |
| US14/359,486 US9177948B2 (en) | 2012-01-31 | 2013-01-29 | Switching element unit |
| PCT/JP2013/052429 WO2013115395A1 (en) | 2012-01-31 | 2013-01-29 | Switching element unit |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012019132 | 2012-01-31 | ||
| JP2012019132 | 2012-01-31 | ||
| JP2012263052A JP5935672B2 (ja) | 2012-01-31 | 2012-11-30 | スイッチング素子ユニット |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013179261A JP2013179261A (ja) | 2013-09-09 |
| JP2013179261A5 true JP2013179261A5 (enExample) | 2014-05-01 |
| JP5935672B2 JP5935672B2 (ja) | 2016-06-15 |
Family
ID=47754926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012263052A Expired - Fee Related JP5935672B2 (ja) | 2012-01-31 | 2012-11-30 | スイッチング素子ユニット |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9177948B2 (enExample) |
| EP (1) | EP2766930B1 (enExample) |
| JP (1) | JP5935672B2 (enExample) |
| KR (1) | KR101691707B1 (enExample) |
| CN (1) | CN104160501B (enExample) |
| WO (1) | WO2013115395A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014029944A (ja) * | 2012-07-31 | 2014-02-13 | Aisin Aw Co Ltd | スイッチング素子ユニット |
| JP2015060991A (ja) * | 2013-09-19 | 2015-03-30 | パナソニックIpマネジメント株式会社 | 半導体装置及びそれを用いた半導体リレー |
| JP2015191902A (ja) * | 2014-03-27 | 2015-11-02 | トヨタ自動車株式会社 | 半導体モジュール |
| DE102014111421A1 (de) * | 2014-08-11 | 2016-02-11 | Woodward Kempen Gmbh | Niederinduktive Schaltungsanordnung eines Umrichters |
| JP6361447B2 (ja) * | 2014-10-15 | 2018-07-25 | 住友電気工業株式会社 | 半導体モジュール |
| CN107078126B (zh) * | 2014-11-06 | 2020-10-02 | 三菱电机株式会社 | 半导体模块以及半导体模块用的导电构件 |
| US9681568B1 (en) * | 2015-12-02 | 2017-06-13 | Ge Energy Power Conversion Technology Ltd | Compact stacked power modules for minimizing commutating inductance and methods for making the same |
| DE102018124695A1 (de) * | 2017-11-15 | 2019-05-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrieren von Passivvorrichtungen in Package-Strukturen |
| WO2022097533A1 (ja) * | 2020-11-09 | 2022-05-12 | ローム株式会社 | 放電回路モジュール |
| DE102022208266A1 (de) * | 2022-08-09 | 2024-02-15 | Magna powertrain gmbh & co kg | Leistungsmodul mit flexibler Leiterplatte |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5961917A (ja) * | 1982-10-01 | 1984-04-09 | 松下電器産業株式会社 | 複合電子部品 |
| US5095402A (en) * | 1990-10-02 | 1992-03-10 | Rogers Corporation | Internally decoupled integrated circuit package |
| JPH05152161A (ja) * | 1992-02-10 | 1993-06-18 | Tdk Corp | 複合部品 |
| JPH08181445A (ja) | 1994-12-22 | 1996-07-12 | Sumitomo Metal Ind Ltd | セラミックス多層基板 |
| JPH11178353A (ja) | 1997-12-11 | 1999-07-02 | Hitachi Ltd | 共振形インバータ及びそれを用いた電気車 |
| US6373127B1 (en) * | 1998-09-29 | 2002-04-16 | Texas Instruments Incorporated | Integrated capacitor on the back of a chip |
| US6940164B1 (en) * | 2000-08-18 | 2005-09-06 | Mitsubishi Denki Kabushiki Kaisha | Power module |
| JP2002176128A (ja) * | 2000-12-06 | 2002-06-21 | Toyota Motor Corp | マルチチップモジュールの冷却構造 |
| JP3847676B2 (ja) * | 2002-07-15 | 2006-11-22 | 三菱電機株式会社 | パワー半導体装置 |
| US6987670B2 (en) * | 2003-05-16 | 2006-01-17 | Ballard Power Systems Corporation | Dual power module power system architecture |
| US7443692B2 (en) * | 2003-05-16 | 2008-10-28 | Continental Automotive Systems Us, Inc. | Power converter architecture employing at least one capacitor across a DC bus |
| JP4038455B2 (ja) * | 2003-08-21 | 2008-01-23 | 三菱電機株式会社 | 半導体装置 |
| JP2006190972A (ja) | 2004-12-08 | 2006-07-20 | Mitsubishi Electric Corp | 電力用半導体装置 |
| JP4661645B2 (ja) * | 2005-03-23 | 2011-03-30 | トヨタ自動車株式会社 | パワー半導体モジュール |
| JP4651653B2 (ja) * | 2007-10-15 | 2011-03-16 | 三菱電機株式会社 | 電力変換装置 |
| US8253241B2 (en) * | 2008-05-20 | 2012-08-28 | Infineon Technologies Ag | Electronic module |
-
2012
- 2012-11-30 JP JP2012263052A patent/JP5935672B2/ja not_active Expired - Fee Related
-
2013
- 2013-01-29 CN CN201380004115.1A patent/CN104160501B/zh not_active Expired - Fee Related
- 2013-01-29 EP EP13706754.2A patent/EP2766930B1/en not_active Not-in-force
- 2013-01-29 US US14/359,486 patent/US9177948B2/en not_active Expired - Fee Related
- 2013-01-29 WO PCT/JP2013/052429 patent/WO2013115395A1/en not_active Ceased
- 2013-01-29 KR KR1020147014786A patent/KR101691707B1/ko not_active Expired - Fee Related
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