JPWO2022097533A1 - - Google Patents

Info

Publication number
JPWO2022097533A1
JPWO2022097533A1 JP2022560731A JP2022560731A JPWO2022097533A1 JP WO2022097533 A1 JPWO2022097533 A1 JP WO2022097533A1 JP 2022560731 A JP2022560731 A JP 2022560731A JP 2022560731 A JP2022560731 A JP 2022560731A JP WO2022097533 A1 JPWO2022097533 A1 JP WO2022097533A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022560731A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022097533A1 publication Critical patent/JPWO2022097533A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
JP2022560731A 2020-11-09 2021-10-26 Pending JPWO2022097533A1 (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020186408 2020-11-09
PCT/JP2021/039425 WO2022097533A1 (ja) 2020-11-09 2021-10-26 放電回路モジュール

Publications (1)

Publication Number Publication Date
JPWO2022097533A1 true JPWO2022097533A1 (enExample) 2022-05-12

Family

ID=81457746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022560731A Pending JPWO2022097533A1 (enExample) 2020-11-09 2021-10-26

Country Status (5)

Country Link
US (1) US20230411367A1 (enExample)
JP (1) JPWO2022097533A1 (enExample)
CN (1) CN116438646A (enExample)
DE (1) DE112021004775T5 (enExample)
WO (1) WO2022097533A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024116415A1 (de) * 2024-06-12 2025-12-18 Schaeffler Technologies AG & Co. KG Entladeeinrichtung zum aktiven oder passiven Entladen eines Leistungselektronikbauteils einer Leistungselektronik einer elektrischen Maschine und Leistungselektronikmodul

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09307366A (ja) * 1996-05-16 1997-11-28 Denso Corp 半導体モジュール及び同半導体モジュールを用いたパワー回路
JP2005318690A (ja) * 2004-04-27 2005-11-10 Sanyo Electric Co Ltd インバータモジュール
JP2011234481A (ja) * 2010-04-27 2011-11-17 Daikin Ind Ltd 放電装置及び空調機
WO2013002249A1 (ja) * 2011-06-27 2013-01-03 ローム株式会社 半導体モジュール
JP2016086578A (ja) * 2014-10-28 2016-05-19 株式会社デンソー 放電制御装置、及び、これを備える電力変換装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5523620A (en) * 1994-02-14 1996-06-04 Delco Electronics Corporation Coplanar linear dual switch module
US5901044A (en) * 1997-07-10 1999-05-04 Ilc Data Device Corporation Mini-module with upwardly directed leads
US6078501A (en) * 1997-12-22 2000-06-20 Omnirel Llc Power semiconductor module
US6166464A (en) * 1998-08-24 2000-12-26 International Rectifier Corp. Power module
DE10204200A1 (de) * 2002-02-01 2003-08-21 Conti Temic Microelectronic Leistungsmodul
JP4301096B2 (ja) * 2004-06-29 2009-07-22 富士電機デバイステクノロジー株式会社 半導体装置
JP2013158211A (ja) 2012-01-31 2013-08-15 Canon Inc 放電回路及び放電回路を備えた電源
JP5935672B2 (ja) * 2012-01-31 2016-06-15 アイシン・エィ・ダブリュ株式会社 スイッチング素子ユニット
JP6260702B2 (ja) * 2014-07-09 2018-01-17 三菱電機株式会社 半導体装置
JP7157046B2 (ja) * 2017-04-05 2022-10-19 ローム株式会社 パワーモジュール

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09307366A (ja) * 1996-05-16 1997-11-28 Denso Corp 半導体モジュール及び同半導体モジュールを用いたパワー回路
JP2005318690A (ja) * 2004-04-27 2005-11-10 Sanyo Electric Co Ltd インバータモジュール
JP2011234481A (ja) * 2010-04-27 2011-11-17 Daikin Ind Ltd 放電装置及び空調機
WO2013002249A1 (ja) * 2011-06-27 2013-01-03 ローム株式会社 半導体モジュール
JP2016086578A (ja) * 2014-10-28 2016-05-19 株式会社デンソー 放電制御装置、及び、これを備える電力変換装置

Also Published As

Publication number Publication date
CN116438646A (zh) 2023-07-14
US20230411367A1 (en) 2023-12-21
WO2022097533A1 (ja) 2022-05-12
DE112021004775T5 (de) 2023-08-31

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