CN116438646A - 放电电路模块 - Google Patents

放电电路模块 Download PDF

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Publication number
CN116438646A
CN116438646A CN202180072606.4A CN202180072606A CN116438646A CN 116438646 A CN116438646 A CN 116438646A CN 202180072606 A CN202180072606 A CN 202180072606A CN 116438646 A CN116438646 A CN 116438646A
Authority
CN
China
Prior art keywords
circuit module
discharge
discharge circuit
resistor
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180072606.4A
Other languages
English (en)
Chinese (zh)
Inventor
安武一平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN116438646A publication Critical patent/CN116438646A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Power Conversion In General (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inverter Devices (AREA)
  • Dc-Dc Converters (AREA)
CN202180072606.4A 2020-11-09 2021-10-26 放电电路模块 Pending CN116438646A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020186408 2020-11-09
JP2020-186408 2020-11-09
PCT/JP2021/039425 WO2022097533A1 (ja) 2020-11-09 2021-10-26 放電回路モジュール

Publications (1)

Publication Number Publication Date
CN116438646A true CN116438646A (zh) 2023-07-14

Family

ID=81457746

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180072606.4A Pending CN116438646A (zh) 2020-11-09 2021-10-26 放电电路模块

Country Status (5)

Country Link
US (1) US20230411367A1 (enExample)
JP (1) JPWO2022097533A1 (enExample)
CN (1) CN116438646A (enExample)
DE (1) DE112021004775T5 (enExample)
WO (1) WO2022097533A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024116415A1 (de) * 2024-06-12 2025-12-18 Schaeffler Technologies AG & Co. KG Entladeeinrichtung zum aktiven oder passiven Entladen eines Leistungselektronikbauteils einer Leistungselektronik einer elektrischen Maschine und Leistungselektronikmodul

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5523620A (en) * 1994-02-14 1996-06-04 Delco Electronics Corporation Coplanar linear dual switch module
JP3845899B2 (ja) * 1996-05-16 2006-11-15 株式会社デンソー 半導体モジュールを用いたパワー回路
US5901044A (en) * 1997-07-10 1999-05-04 Ilc Data Device Corporation Mini-module with upwardly directed leads
US6078501A (en) * 1997-12-22 2000-06-20 Omnirel Llc Power semiconductor module
US6166464A (en) * 1998-08-24 2000-12-26 International Rectifier Corp. Power module
DE10204200A1 (de) * 2002-02-01 2003-08-21 Conti Temic Microelectronic Leistungsmodul
JP2005318690A (ja) * 2004-04-27 2005-11-10 Sanyo Electric Co Ltd インバータモジュール
JP4301096B2 (ja) * 2004-06-29 2009-07-22 富士電機デバイステクノロジー株式会社 半導体装置
JP5511488B2 (ja) * 2010-04-27 2014-06-04 ダイキン工業株式会社 放電装置及び空調機
WO2013002249A1 (ja) * 2011-06-27 2013-01-03 ローム株式会社 半導体モジュール
JP2013158211A (ja) 2012-01-31 2013-08-15 Canon Inc 放電回路及び放電回路を備えた電源
JP5935672B2 (ja) * 2012-01-31 2016-06-15 アイシン・エィ・ダブリュ株式会社 スイッチング素子ユニット
JP6260702B2 (ja) * 2014-07-09 2018-01-17 三菱電機株式会社 半導体装置
JP6361466B2 (ja) * 2014-10-28 2018-07-25 株式会社デンソー 放電制御装置、及び、これを備える電力変換装置
JP7157046B2 (ja) * 2017-04-05 2022-10-19 ローム株式会社 パワーモジュール

Also Published As

Publication number Publication date
US20230411367A1 (en) 2023-12-21
JPWO2022097533A1 (enExample) 2022-05-12
WO2022097533A1 (ja) 2022-05-12
DE112021004775T5 (de) 2023-08-31

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