JP2013156102A5 - - Google Patents
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- Publication number
- JP2013156102A5 JP2013156102A5 JP2012016017A JP2012016017A JP2013156102A5 JP 2013156102 A5 JP2013156102 A5 JP 2013156102A5 JP 2012016017 A JP2012016017 A JP 2012016017A JP 2012016017 A JP2012016017 A JP 2012016017A JP 2013156102 A5 JP2013156102 A5 JP 2013156102A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- groove
- electrode
- side wall
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 28
- 239000004020 conductor Substances 0.000 claims 9
- 239000012212 insulator Substances 0.000 claims 9
- 239000003990 capacitor Substances 0.000 claims 7
- 230000000149 penetrating effect Effects 0.000 claims 3
- 239000002131 composite material Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012016017A JP6393930B2 (ja) | 2012-01-30 | 2012-01-30 | 半導体センサー・デバイスおよびその製造方法 |
| PCT/JP2013/052087 WO2013115270A1 (ja) | 2012-01-30 | 2013-01-30 | 半導体センサー・デバイスおよびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012016017A JP6393930B2 (ja) | 2012-01-30 | 2012-01-30 | 半導体センサー・デバイスおよびその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018007756A Division JP2018124275A (ja) | 2018-01-21 | 2018-01-21 | 半導体センサー・デバイスおよびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013156102A JP2013156102A (ja) | 2013-08-15 |
| JP2013156102A5 true JP2013156102A5 (enrdf_load_stackoverflow) | 2015-03-19 |
| JP6393930B2 JP6393930B2 (ja) | 2018-09-26 |
Family
ID=48905302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012016017A Expired - Fee Related JP6393930B2 (ja) | 2012-01-30 | 2012-01-30 | 半導体センサー・デバイスおよびその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6393930B2 (enrdf_load_stackoverflow) |
| WO (1) | WO2013115270A1 (enrdf_load_stackoverflow) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101467933B1 (ko) | 2013-12-02 | 2014-12-02 | 한국세라믹기술원 | 피에조 파이버 컴포지트 구조체 및 이를 이용한 소자 |
| KR101467934B1 (ko) | 2013-12-02 | 2014-12-02 | 한국세라믹기술원 | 피에조 파이버 컴포지트 구조체 및 이를 이용한 소자 |
| EP3118906B1 (en) | 2014-03-14 | 2018-08-22 | Japan Science and Technology Agency | Transistor using piezoresistor as channel, and electronic circuit |
| KR101971874B1 (ko) * | 2015-02-04 | 2019-04-25 | (주)엘지하우시스 | 광투과율 가변 필름, 이를 포함한 표시 장치 및 광투과율 가변 필름의 제조 방법 |
| DE102015210919A1 (de) | 2015-06-15 | 2016-12-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | MEMS-Wandler zum Interagieren mit einem Volumenstrom eines Fluids und Verfahren zum Herstellen desselben |
| CN105371878B (zh) * | 2015-12-04 | 2017-08-25 | 歌尔股份有限公司 | 一种环境传感器及其制造方法 |
| DE102017206766A1 (de) | 2017-04-21 | 2018-10-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mems-wandler zum interagieren mit einem volumenstrom eines fluids und verfahren zum herstellen desselben |
| JP6932536B2 (ja) * | 2017-04-21 | 2021-09-08 | 株式会社バルカー | 圧電積層体の製造方法および圧電積層体 |
| CN107994006A (zh) * | 2017-12-30 | 2018-05-04 | 颀中科技（苏州）有限公司 | 倒装芯片组件、倒装芯片封装结构及封装方法 |
| CN112335179A (zh) * | 2018-07-30 | 2021-02-05 | 京瓷株式会社 | 复合基板 |
| US11779232B2 (en) | 2019-04-30 | 2023-10-10 | Korea Advanced Institute Of Science And Technology | Flexible pressure sensor using multi-material 3D-printed microchannel mold and method for manufacturing the same |
| CN110545505A (zh) * | 2019-08-19 | 2019-12-06 | 歌尔股份有限公司 | 一种用于发声装置的导电膜以及发声装置 |
| EP4060018A4 (en) * | 2019-11-14 | 2023-03-01 | NOK Corporation | DEVICE FOR MEASURING EXTRACELLULAR POTENTIAL |
| JP7543641B2 (ja) * | 2019-11-20 | 2024-09-03 | 株式会社デンソー | 素子形成ウェハおよびその製造方法、チップの製造方法 |
| CN112781757B (zh) * | 2020-12-26 | 2023-10-31 | 重庆华知光环保科技有限责任公司 | 一种基于石墨烯的柔性电容式压力传感器及其制备方法 |
| WO2024018769A1 (ja) * | 2022-07-21 | 2024-01-25 | キヤノン株式会社 | ダイシング方法および記録素子製造方法 |
| JP7566979B2 (ja) * | 2022-07-21 | 2024-10-15 | キヤノン株式会社 | ダイシング方法および記録素子製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0746068B2 (ja) * | 1987-01-16 | 1995-05-17 | 日産自動車株式会社 | 圧力センサ |
| JPS6413158U (enrdf_load_stackoverflow) * | 1987-07-10 | 1989-01-24 | ||
| JPH11220137A (ja) * | 1998-02-02 | 1999-08-10 | Denso Corp | 半導体圧力センサ及びその製造方法 |
| JP5206726B2 (ja) * | 2010-04-12 | 2013-06-12 | 株式会社デンソー | 力学量検出装置およびその製造方法 |
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2012
- 2012-01-30 JP JP2012016017A patent/JP6393930B2/ja not_active Expired - Fee Related
-
2013
- 2013-01-30 WO PCT/JP2013/052087 patent/WO2013115270A1/ja active Application Filing