JP2013156102A5 - - Google Patents

Claims (2)

A conductor substrate having a thickness of 2.0 mm or less having at least two groove (penetrating groove) spaces penetrating one or both of the upper surface and the lower surface, and an upper surface (first surface) of the conductor substrate An attached insulating substrate (first surface insulating substrate) having a thickness of 1.0 mm or less and an insulating substrate having a thickness of 1.0 mm or less (second surface) attached to the lower surface (second surface) of the conductive substrate. A capacitive pressure sensor comprising a surface insulator substrate),
One electrode (first side wall capacitor electrode) that separates two adjacent through grooves (first through groove and second through groove) in the lateral direction (substantially perpendicular to the thickness direction of the conductive substrate). )age,
The first side wall capacitor electrode is opposed to one of the adjacent through grooves (first through groove), and the other side wall of the conductor substrate that is not electrically connected to the first side wall capacitor electrode is opposed to the other. An electrode (second sidewall capacitor electrode), and a first through groove space between the first sidewall capacitor electrode and the second sidewall capacitor electrode is defined as a capacitance space, and the first through groove serving as the capacitance space is formed. Due to the pressure difference between the pressure of the space and the pressure of the space of the other through groove (second through groove) sandwiching the first side wall capacitive electrode, the first side wall electrode is displaced, so that the first through groove space The pressure is detected using a change in capacitance, and the first side wall capacitor electrode has an upper surface attached to the first surface insulator substrate and / or a lower surface thereof is a second surface insulator. The adhesion to the substrate and / or the second sidewall capacitance electrode Upper surface attached to the first surface insulating substrate, and / or that the lower surface is adhered to the second surface insulating substrate, and wherein,
Capacitive pressure sensor. An insulator substrate (second surface insulator substrate) having a thickness of 1.0 mm or less on the second surface of a conductor substrate having a thickness of 2.0 mm or less having a front surface (first surface) and a back surface (second surface). A process for producing a composite substrate to which
Forming a first surface through groove penetrating from the first surface of the conductor substrate to the second surface using the patterned photosensitive film on the first surface side of the conductor substrate and reaching the second surface insulator substrate; ,
A step of attaching an insulating substrate (first surface insulating substrate) having a thickness of 1.0 mm or less to the first surface side of the conductive substrate, and setting one or all of the first surface through grooves to be a closed space; ,
Using the photosensitive film patterned on the second surface insulator substrate of the composite substrate, the second surface insulator substrate and the second surface of the conductor substrate penetrate from the second surface to the first surface to reach the first surface insulator substrate. Forming a groove (second surface through groove);
A method of manufacturing a capacitive pressure sensor including:
The conductor side wall sandwiched between two adjacent through grooves (first surface through groove and second surface through groove) is used as an electrode of the capacitance element, and the pressure of the first surface through groove and the second surface through groove are A method for manufacturing a capacitance-type pressure sensor using a change in capacitance of a capacitance element caused by deformation of the conductor side wall electrode due to a pressure difference.