JP2013143507A - 搬送機構 - Google Patents
搬送機構 Download PDFInfo
- Publication number
- JP2013143507A JP2013143507A JP2012003573A JP2012003573A JP2013143507A JP 2013143507 A JP2013143507 A JP 2013143507A JP 2012003573 A JP2012003573 A JP 2012003573A JP 2012003573 A JP2012003573 A JP 2012003573A JP 2013143507 A JP2013143507 A JP 2013143507A
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- JP
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- Prior art keywords
- plate
- grinding
- holding
- holding part
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 230000007246 mechanism Effects 0.000 title claims abstract description 13
- 230000007062 hydrolysis Effects 0.000 claims abstract description 29
- 238000006460 hydrolysis reaction Methods 0.000 claims abstract description 29
- 239000000126 substance Substances 0.000 claims abstract description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000001514 detection method Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 4
- 230000007723 transport mechanism Effects 0.000 description 25
- 238000004140 cleaning Methods 0.000 description 24
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 10
- -1 hydroxide ions Chemical class 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000003513 alkali Substances 0.000 description 4
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010494 dissociation reaction Methods 0.000 description 2
- 230000005593 dissociations Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 125000005462 imide group Chemical group 0.000 description 2
- 125000001841 imino group Chemical group [H]N=* 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 150000008040 ionic compounds Chemical class 0.000 description 2
- 229910001416 lithium ion Inorganic materials 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- 239000005750 Copper hydroxide Substances 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- AEJIMXVJZFYIHN-UHFFFAOYSA-N copper;dihydrate Chemical compound O.O.[Cu] AEJIMXVJZFYIHN-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- WPCMRGJTLPITMF-UHFFFAOYSA-I niobium(5+);pentahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[Nb+5] WPCMRGJTLPITMF-UHFFFAOYSA-I 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Manipulator (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】搬送機構1は、常温の状態で加水分解を引き起こす板状物Wに研削水を供給しながら研削加工処理を施した後である加工後の板状物Wに当接して板状物Wを吸引保持する保持部2と、保持部2を移動させる駆動部3とを備える。保持部2には、板状物Wに当接する面側に配設され、板状物Wの存在を検出する板状物検出センサ4,5を備える。板状物と当接する面(各吸引部24,25および板状物検出センサ4,5)は、耐加水分解性を有する物質で形成されている。
【選択図】図2
Description
図1は、実施形態に係る搬送機構を備える研削装置の構成例を示す図である。図2は、搬送機構の構成例を示す図である。図3は、加水分解を説明するための模式図である。
2 保持部
24 第1吸引部
25 第2吸引部
3 駆動部
4,5 板状物検出センサ
100 研削装置
111,112 カセット
120 中心合わせテーブル
130 ターンテーブル
140,150 研削手段
160,170 研削ホイール移動手段
180 洗浄手段
191 第1搬送手段
192 第2搬送手段
Claims (1)
- 常温の状態で加水分解を引き起こす板状物に加工水を供給しながら加工処理を施した後である加工後の前記板状物に当接して前記板状物を吸引保持する保持部と、前記保持部を移動させる駆動部とを備え、
前記保持部には、前記板状物に当接する面側に配設され、前記板状物の存在を検出する板状物検出センサを備え、
前記板状物と当接する面は、少なくとも耐加水分解性を有する物質で形成されていること
を特徴とする搬送機構。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012003573A JP5989994B2 (ja) | 2012-01-11 | 2012-01-11 | 搬送機構 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012003573A JP5989994B2 (ja) | 2012-01-11 | 2012-01-11 | 搬送機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013143507A true JP2013143507A (ja) | 2013-07-22 |
JP5989994B2 JP5989994B2 (ja) | 2016-09-07 |
Family
ID=49039903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012003573A Active JP5989994B2 (ja) | 2012-01-11 | 2012-01-11 | 搬送機構 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5989994B2 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08300255A (ja) * | 1995-05-09 | 1996-11-19 | Sumitomo Metal Mining Co Ltd | 単結晶加工方法 |
JP2002270674A (ja) * | 2001-03-14 | 2002-09-20 | Disco Abrasive Syst Ltd | 搬出装置 |
JP2003068824A (ja) * | 2001-08-28 | 2003-03-07 | Seiko Epson Corp | 吸着保持器、搬送装置、基板の搬送方法、及び、電気光学装置の製造方法 |
JP2007048984A (ja) * | 2005-08-10 | 2007-02-22 | Nishiyama:Kk | ワーク搬送用ハンドプレート及びその製造方法 |
-
2012
- 2012-01-11 JP JP2012003573A patent/JP5989994B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08300255A (ja) * | 1995-05-09 | 1996-11-19 | Sumitomo Metal Mining Co Ltd | 単結晶加工方法 |
JP2002270674A (ja) * | 2001-03-14 | 2002-09-20 | Disco Abrasive Syst Ltd | 搬出装置 |
JP2003068824A (ja) * | 2001-08-28 | 2003-03-07 | Seiko Epson Corp | 吸着保持器、搬送装置、基板の搬送方法、及び、電気光学装置の製造方法 |
JP2007048984A (ja) * | 2005-08-10 | 2007-02-22 | Nishiyama:Kk | ワーク搬送用ハンドプレート及びその製造方法 |
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JP5989994B2 (ja) | 2016-09-07 |
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