JP2013129897A5 - - Google Patents

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Publication number
JP2013129897A5
JP2013129897A5 JP2011281886A JP2011281886A JP2013129897A5 JP 2013129897 A5 JP2013129897 A5 JP 2013129897A5 JP 2011281886 A JP2011281886 A JP 2011281886A JP 2011281886 A JP2011281886 A JP 2011281886A JP 2013129897 A5 JP2013129897 A5 JP 2013129897A5
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JP
Japan
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dielectric window
plasma processing
slits
inductively coupled
coupled plasma
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JP2011281886A
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English (en)
Japanese (ja)
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JP2013129897A (ja
JP5822133B2 (ja
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Publication of JP2013129897A5 publication Critical patent/JP2013129897A5/ja
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JP2011281886A 2011-12-22 2011-12-22 誘導結合形プラズマ処理装置のマスク部材 Active JP5822133B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011281886A JP5822133B2 (ja) 2011-12-22 2011-12-22 誘導結合形プラズマ処理装置のマスク部材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011281886A JP5822133B2 (ja) 2011-12-22 2011-12-22 誘導結合形プラズマ処理装置のマスク部材

Publications (3)

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JP2013129897A JP2013129897A (ja) 2013-07-04
JP2013129897A5 true JP2013129897A5 (enExample) 2014-10-16
JP5822133B2 JP5822133B2 (ja) 2015-11-24

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JP2011281886A Active JP5822133B2 (ja) 2011-12-22 2011-12-22 誘導結合形プラズマ処理装置のマスク部材

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JP (1) JP5822133B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107393790A (zh) * 2017-07-20 2017-11-24 中国科学院电子学研究所 电真空器件介质窗片的金属化方法
JP7469625B2 (ja) * 2020-04-13 2024-04-17 日新電機株式会社 プラズマ源及びプラズマ処理装置
CN113223916B (zh) * 2021-06-09 2024-05-28 上海邦芯半导体科技有限公司 一种电感耦合等离子体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01184922A (ja) * 1988-01-20 1989-07-24 Canon Inc エッチング、アッシング及び成膜等に有用なプラズマ処理装置
JP3364675B2 (ja) * 1997-09-30 2003-01-08 東京エレクトロンエイ・ティー株式会社 プラズマ処理装置
JP4119547B2 (ja) * 1997-10-20 2008-07-16 東京エレクトロンＡｔ株式会社 プラズマ処理装置
JP4193255B2 (ja) * 1998-12-01 2008-12-10 株式会社日立製作所 プラズマ処理装置及びプラズマ処理方法
JP4469054B2 (ja) * 2000-03-10 2010-05-26 サムコ株式会社 誘導結合形プラズマ処理装置
JP2008133538A (ja) * 2006-10-27 2008-06-12 Mitsubishi Materials Corp ターゲット廃材とインジウムの分離回収方法。
JP4888076B2 (ja) * 2006-11-17 2012-02-29 パナソニック株式会社 プラズマエッチング装置

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