JP2013124379A5 - - Google Patents

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Publication number
JP2013124379A5
JP2013124379A5 JP2011272742A JP2011272742A JP2013124379A5 JP 2013124379 A5 JP2013124379 A5 JP 2013124379A5 JP 2011272742 A JP2011272742 A JP 2011272742A JP 2011272742 A JP2011272742 A JP 2011272742A JP 2013124379 A5 JP2013124379 A5 JP 2013124379A5
Authority
JP
Japan
Prior art keywords
backing plate
target device
target
plate
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011272742A
Other languages
English (en)
Japanese (ja)
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JP5779491B2 (ja
JP2013124379A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011272742A priority Critical patent/JP5779491B2/ja
Priority claimed from JP2011272742A external-priority patent/JP5779491B2/ja
Priority to US13/710,775 priority patent/US9139899B2/en
Publication of JP2013124379A publication Critical patent/JP2013124379A/ja
Publication of JP2013124379A5 publication Critical patent/JP2013124379A5/ja
Application granted granted Critical
Publication of JP5779491B2 publication Critical patent/JP5779491B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011272742A 2011-12-13 2011-12-13 ターゲット装置、スパッタリング装置、ターゲット装置の製造方法 Active JP5779491B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011272742A JP5779491B2 (ja) 2011-12-13 2011-12-13 ターゲット装置、スパッタリング装置、ターゲット装置の製造方法
US13/710,775 US9139899B2 (en) 2011-12-13 2012-12-11 Target device, sputtering apparatus and method for manufacturing a target device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011272742A JP5779491B2 (ja) 2011-12-13 2011-12-13 ターゲット装置、スパッタリング装置、ターゲット装置の製造方法

Publications (3)

Publication Number Publication Date
JP2013124379A JP2013124379A (ja) 2013-06-24
JP2013124379A5 true JP2013124379A5 (enExample) 2014-12-18
JP5779491B2 JP5779491B2 (ja) 2015-09-16

Family

ID=48775834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011272742A Active JP5779491B2 (ja) 2011-12-13 2011-12-13 ターゲット装置、スパッタリング装置、ターゲット装置の製造方法

Country Status (2)

Country Link
US (1) US9139899B2 (enExample)
JP (1) JP5779491B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105331937B (zh) * 2014-07-30 2018-04-13 合肥江丰电子材料有限公司 靶材加工装置以及加工方法
US20160053365A1 (en) * 2014-08-20 2016-02-25 Honeywell International Inc. Encapsulated composite backing plate
CN115612990A (zh) * 2022-10-28 2023-01-17 光洋新材料科技(昆山)有限公司 一种蒸镀坩埚的防黏处理方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5282943A (en) * 1992-06-10 1994-02-01 Tosoh Smd, Inc. Method of bonding a titanium containing sputter target to a backing plate and bonded target/backing plate assemblies produced thereby
US5879524A (en) * 1996-02-29 1999-03-09 Sony Corporation Composite backing plate for a sputtering target
JP3629578B2 (ja) * 1997-09-26 2005-03-16 株式会社小松製作所 Ｔｉ系材料とＣｕ系の接合方法
US6858102B1 (en) * 2000-11-15 2005-02-22 Honeywell International Inc. Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets
JP4820508B2 (ja) 2000-08-30 2011-11-24 株式会社東芝 スパッタリングターゲットとその製造方法、スパッタリング装置、薄膜の製造方法、電子部品の製造方法
US6376281B1 (en) * 2000-10-27 2002-04-23 Honeywell International, Inc. Physical vapor deposition target/backing plate assemblies
CN100526499C (zh) * 2002-10-21 2009-08-12 卡伯特公司 形成溅射靶组件的方法及由此制成的组件
US7431195B2 (en) * 2003-09-26 2008-10-07 Praxair S.T. Technology, Inc. Method for centering a sputter target onto a backing plate and the assembly thereof
US7476289B2 (en) * 2006-06-29 2009-01-13 Applied Materials, Inc. Vacuum elastomer bonding apparatus and method
US8342383B2 (en) * 2006-07-06 2013-01-01 Praxair Technology, Inc. Method for forming sputter target assemblies having a controlled solder thickness
KR20120106950A (ko) * 2009-11-13 2012-09-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 스퍼터링 타겟 및 그 제작 방법 및 트랜지스터

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