JP2009173975A5 - - Google Patents
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- Publication number
- JP2009173975A5 JP2009173975A5 JP2008011801A JP2008011801A JP2009173975A5 JP 2009173975 A5 JP2009173975 A5 JP 2009173975A5 JP 2008011801 A JP2008011801 A JP 2008011801A JP 2008011801 A JP2008011801 A JP 2008011801A JP 2009173975 A5 JP2009173975 A5 JP 2009173975A5
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- metal
- particles according
- metal fine
- target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002184 metal Substances 0.000 claims 18
- 229910052751 metal Inorganic materials 0.000 claims 18
- 239000010419 fine particle Substances 0.000 claims 14
- 238000004519 manufacturing process Methods 0.000 claims 10
- 229910001111 Fine metal Inorganic materials 0.000 claims 6
- 239000002923 metal particle Substances 0.000 claims 6
- 238000000034 method Methods 0.000 claims 5
- 238000011084 recovery Methods 0.000 claims 3
- 238000004544 sputter deposition Methods 0.000 claims 3
- 239000010409 thin film Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000001755 magnetron sputter deposition Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008011801A JP2009173975A (ja) | 2008-01-22 | 2008-01-22 | 金属微粒子の生成方法、金属含有ペーストの製造方法及び金属薄膜配線の形成方法 |
| PCT/JP2009/050834 WO2009093596A1 (ja) | 2008-01-22 | 2009-01-21 | 金属微粒子の生成方法、金属含有ペーストの製造方法及び金属薄膜配線の形成方法 |
| US12/836,906 US20100276275A1 (en) | 2008-01-22 | 2010-07-15 | Method of generating fine metal particles, method of manufacturing metal-containing paste, and method of forming thin metal film interconnection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008011801A JP2009173975A (ja) | 2008-01-22 | 2008-01-22 | 金属微粒子の生成方法、金属含有ペーストの製造方法及び金属薄膜配線の形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009173975A JP2009173975A (ja) | 2009-08-06 |
| JP2009173975A5 true JP2009173975A5 (enExample) | 2009-09-17 |
Family
ID=40901104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008011801A Withdrawn JP2009173975A (ja) | 2008-01-22 | 2008-01-22 | 金属微粒子の生成方法、金属含有ペーストの製造方法及び金属薄膜配線の形成方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20100276275A1 (enExample) |
| JP (1) | JP2009173975A (enExample) |
| WO (1) | WO2009093596A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009157186A1 (ja) * | 2008-06-24 | 2009-12-30 | キヤノンアネルバ株式会社 | 磁場発生装置及びプラズマ処理装置 |
| GB2481860A (en) * | 2010-07-09 | 2012-01-11 | Mantis Deposition Ltd | Sputtering apparatus for producing nanoparticles |
| JP5802811B1 (ja) * | 2014-08-27 | 2015-11-04 | 株式会社ジーエル・マテリアルズホールディングス | ナノ粒子の製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0735564B2 (ja) * | 1989-08-24 | 1995-04-19 | ワイケイケイ株式会社 | 耐食性と密着性とに優れた金属表面薄膜の形成方法 |
| US6287435B1 (en) * | 1998-05-06 | 2001-09-11 | Tokyo Electron Limited | Method and apparatus for ionized physical vapor deposition |
| JP2003245540A (ja) * | 2002-02-25 | 2003-09-02 | Fuji Photo Film Co Ltd | 超微粒子の作製方法 |
| JP5324251B2 (ja) * | 2008-05-16 | 2013-10-23 | キヤノンアネルバ株式会社 | 基板保持装置 |
-
2008
- 2008-01-22 JP JP2008011801A patent/JP2009173975A/ja not_active Withdrawn
-
2009
- 2009-01-21 WO PCT/JP2009/050834 patent/WO2009093596A1/ja not_active Ceased
-
2010
- 2010-07-15 US US12/836,906 patent/US20100276275A1/en not_active Abandoned
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