JP2013122445A5 - - Google Patents

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Publication number
JP2013122445A5
JP2013122445A5 JP2012232344A JP2012232344A JP2013122445A5 JP 2013122445 A5 JP2013122445 A5 JP 2013122445A5 JP 2012232344 A JP2012232344 A JP 2012232344A JP 2012232344 A JP2012232344 A JP 2012232344A JP 2013122445 A5 JP2013122445 A5 JP 2013122445A5
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JP
Japan
Prior art keywords
illumination
light
mask
collection
channel
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JP2012232344A
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English (en)
Japanese (ja)
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JP2013122445A (ja
JP5715610B2 (ja
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Priority claimed from US13/323,591 external-priority patent/US8614790B2/en
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Publication of JP2013122445A5 publication Critical patent/JP2013122445A5/ja
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Publication of JP5715610B2 publication Critical patent/JP5715610B2/ja
Expired - Fee Related legal-status Critical Current
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JP2012232344A 2011-12-12 2012-10-02 パターン化サンプルを検査するための光学システム及び方法 Expired - Fee Related JP5715610B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/323,591 2011-12-12
US13/323,591 US8614790B2 (en) 2011-12-12 2011-12-12 Optical system and method for inspection of patterned samples

Publications (3)

Publication Number Publication Date
JP2013122445A JP2013122445A (ja) 2013-06-20
JP2013122445A5 true JP2013122445A5 (enExample) 2014-07-17
JP5715610B2 JP5715610B2 (ja) 2015-05-07

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ID=48571710

Family Applications (1)

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JP2012232344A Expired - Fee Related JP5715610B2 (ja) 2011-12-12 2012-10-02 パターン化サンプルを検査するための光学システム及び方法

Country Status (4)

Country Link
US (1) US8614790B2 (enExample)
JP (1) JP5715610B2 (enExample)
KR (1) KR101460128B1 (enExample)
TW (1) TWI465714B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9194811B1 (en) 2013-04-01 2015-11-24 Kla-Tencor Corporation Apparatus and methods for improving defect detection sensitivity
US9696264B2 (en) * 2013-04-03 2017-07-04 Kla-Tencor Corporation Apparatus and methods for determining defect depths in vertical stack memory
US9709510B2 (en) * 2014-06-26 2017-07-18 Kla-Tencor Corp. Determining a configuration for an optical element positioned in a collection aperture during wafer inspection
US9958327B2 (en) 2014-10-01 2018-05-01 Nanometrics Incorporated Deconvolution to reduce the effective spot size of a spectroscopic optical metrology device
KR20170083678A (ko) * 2016-01-08 2017-07-19 삼성전자주식회사 기판 검사 방법
JP6738644B2 (ja) 2016-04-15 2020-08-12 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 撮像装置及び撮像方法
WO2018096526A1 (en) * 2016-11-23 2018-05-31 Nova Measuring Instruments Ltd. Optical system and method for measuring parameters of patterned structures in microelectronic devices
JP6969163B2 (ja) * 2017-05-31 2021-11-24 株式会社ニコン 検査装置及び検査方法、露光装置及び露光方法、並びに、デバイス製造方法
KR102680009B1 (ko) * 2018-09-07 2024-07-03 에스케이하이닉스 주식회사 반도체 패턴 계측 장치, 이를 이용한 반도체 패턴 계측 시스템 및 방법
JP7261903B2 (ja) 2019-05-06 2023-04-20 エーエスエムエル ネザーランズ ビー．ブイ． 暗視野顕微鏡
US20240272058A1 (en) * 2021-06-09 2024-08-15 Asml Netherlands B.V. Inspection system for reticle particle detection using a structural illumination with aperture apodization
JP7763106B2 (ja) * 2022-01-12 2025-10-31 東京エレクトロン株式会社 基板検査装置、基板検査方法、及び、基板検査プログラム
TW202530674A (zh) * 2023-09-01 2025-08-01 美商應用材料股份有限公司 用於混合式接合缺陷偵測之多向照明
US12092962B1 (en) 2023-10-26 2024-09-17 Onto Innovation Inc. Measurements of structures in presence of signal contaminations
WO2025101441A1 (en) * 2023-11-06 2025-05-15 Applied Materials Israel Ltd. Metrology using joint angle and wavelength scattering
US12306393B1 (en) * 2024-01-09 2025-05-20 Adam M. Hanninen Pixelated phase mask for chemical imaging

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0682373A (ja) * 1992-09-03 1994-03-22 Nikon Corp 欠陥検査方法
JP3936959B2 (ja) * 1994-10-07 2007-06-27 株式会社ルネサステクノロジ パターンの欠陥検査方法およびその装置
JP4560900B2 (ja) * 2000-06-19 2010-10-13 ソニー株式会社 検査装置
US6630996B2 (en) 2000-11-15 2003-10-07 Real Time Metrology, Inc. Optical method and apparatus for inspecting large area planar objects
US6686602B2 (en) 2002-01-15 2004-02-03 Applied Materials, Inc. Patterned wafer inspection using spatial filtering
US7130039B2 (en) 2002-04-18 2006-10-31 Kla-Tencor Technologies Corporation Simultaneous multi-spot inspection and imaging
JP2004170111A (ja) * 2002-11-18 2004-06-17 Matsushita Electric Ind Co Ltd 異物検査装置
JP4260587B2 (ja) * 2003-09-18 2009-04-30 株式会社日立ハイテクノロジーズ パターン欠陥検査装置
US7295303B1 (en) * 2004-03-25 2007-11-13 Kla-Tencor Technologies Corporation Methods and apparatus for inspecting a sample
KR20090072808A (ko) * 2007-12-28 2009-07-02 주식회사 하이닉스반도체 포토마스크의 검사 장치 및 이를 이용한 검사 방법
US7973921B2 (en) * 2008-06-25 2011-07-05 Applied Materials South East Asia Pte Ltd. Dynamic illumination in optical inspection systems
KR20100001215A (ko) * 2008-06-26 2010-01-06 주식회사 하이닉스반도체 반도체 소자의 패턴 검사방법
JP5237874B2 (ja) * 2009-04-24 2013-07-17 株式会社日立ハイテクノロジーズ 欠陥検査方法および欠陥検査装置
JP5320187B2 (ja) 2009-07-01 2013-10-23 株式会社日立ハイテクノロジーズ 欠陥検査方法及び欠陥検査装置
KR101272039B1 (ko) * 2009-11-05 2013-06-07 한양대학교 산학협력단 극자외선 노광 공정용 반사형 마스크 결함 검출 장치 및 방법
JP2011180145A (ja) * 2011-03-28 2011-09-15 Hitachi High-Technologies Corp 欠陥検査装置

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