JP2013120805A5 - - Google Patents
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- Publication number
- JP2013120805A5 JP2013120805A5 JP2011267306A JP2011267306A JP2013120805A5 JP 2013120805 A5 JP2013120805 A5 JP 2013120805A5 JP 2011267306 A JP2011267306 A JP 2011267306A JP 2011267306 A JP2011267306 A JP 2011267306A JP 2013120805 A5 JP2013120805 A5 JP 2013120805A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- reactive functional
- adhesive
- polyrotaxane
- groups
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 125000000524 functional group Chemical group 0.000 claims description 30
- 239000002998 adhesive polymer Substances 0.000 claims description 25
- 239000003431 cross linking reagent Substances 0.000 claims description 9
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 14
- 125000004122 cyclic group Chemical group 0.000 description 7
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- -1 hydroxypropyl groups Chemical group 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920000858 Cyclodextrin Polymers 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- HFHDHCJBZVLPGP-UHFFFAOYSA-N schardinger α-dextrin Chemical compound O1C(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(O)C2O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC2C(O)C(O)C1OC2CO HFHDHCJBZVLPGP-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011267306A JP6018747B2 (ja) | 2011-12-06 | 2011-12-06 | ウエハ加工用粘着シート、該シートを用いた半導体ウエハの加工方法 |
| CN201280059971.2A CN103975421B (zh) | 2011-12-06 | 2012-12-05 | 半导体晶片加工用粘合片及使用了该粘合片的半导体晶片的加工方法 |
| PCT/JP2012/081543 WO2013084952A1 (ja) | 2011-12-06 | 2012-12-05 | 半導体ウエハ加工用粘着シート、該シートを用いた半導体ウエハの加工方法 |
| US14/362,933 US20140342531A1 (en) | 2011-12-06 | 2012-12-05 | Adhesive Sheet for Semiconductor Wafer Processing, Method for Processing of Semiconductor Wafer Using Sheet |
| KR1020147015566A KR102002536B1 (ko) | 2011-12-06 | 2012-12-05 | 반도체 웨이퍼 가공용 점착 시트, 이 시트를 이용한 반도체 웨이퍼의 가공 방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011267306A JP6018747B2 (ja) | 2011-12-06 | 2011-12-06 | ウエハ加工用粘着シート、該シートを用いた半導体ウエハの加工方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013120805A JP2013120805A (ja) | 2013-06-17 |
| JP2013120805A5 true JP2013120805A5 (enExample) | 2014-10-23 |
| JP6018747B2 JP6018747B2 (ja) | 2016-11-02 |
Family
ID=48773326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011267306A Active JP6018747B2 (ja) | 2011-12-06 | 2011-12-06 | ウエハ加工用粘着シート、該シートを用いた半導体ウエハの加工方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6018747B2 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101722137B1 (ko) * | 2014-01-03 | 2017-03-31 | 주식회사 엘지화학 | 다이싱 필름 및 다이싱 다이본딩 필름 |
| JP6264917B2 (ja) * | 2014-02-06 | 2018-01-24 | 日立化成株式会社 | ダイシングテープ |
| JP6188614B2 (ja) * | 2014-03-27 | 2017-08-30 | 富士フイルム株式会社 | 積層体、保護層形成用組成物、キット、および、半導体デバイスの製造方法 |
| JP2016192488A (ja) * | 2015-03-31 | 2016-11-10 | リンテック株式会社 | 半導体加工用粘着シート |
| JP6523098B2 (ja) * | 2015-08-10 | 2019-05-29 | リンテック株式会社 | 粘着性組成物、粘着剤、粘着シートおよび表示体 |
| JP6265296B2 (ja) * | 2017-07-20 | 2018-01-24 | 日立化成株式会社 | ダイシングテープ、ダイシング・ダイボンディング一体型テープ、及びダイシング・ダイボンディング一体型テープを用いた半導体装置の製造方法 |
| JP6871573B2 (ja) * | 2017-09-15 | 2021-05-12 | 協立化学産業株式会社 | チップの表面加工方法及びゲル状組成物 |
| JP2019104799A (ja) * | 2017-12-11 | 2019-06-27 | リンテック株式会社 | 剥離剤組成物及び剥離シート |
| JP7039984B2 (ja) * | 2017-12-14 | 2022-03-23 | 昭和電工マテリアルズ株式会社 | 回路接続用接着剤組成物及び回路接続構造体 |
| JP7017442B2 (ja) * | 2018-03-12 | 2022-02-08 | リンテック株式会社 | 感温性粘着シートおよび積層体 |
| JP7017464B2 (ja) * | 2018-04-27 | 2022-02-08 | リンテック株式会社 | 感温性粘着シートおよび積層体 |
| JP7570175B2 (ja) * | 2019-12-13 | 2024-10-21 | 日東電工株式会社 | ウエハ加工用粘着シート |
| JP7088388B1 (ja) | 2021-03-19 | 2022-06-21 | 住友ベークライト株式会社 | 粘着テープ |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE440870T1 (de) * | 2000-04-28 | 2009-09-15 | Toudai Tlo Ltd | Verbindung enthaltend vernetzte polyrotaxane |
| EP1734066B1 (en) * | 2004-03-31 | 2020-06-24 | The University of Tokyo | Polymeric material having polyrotaxane and process for producing the same |
| JP2006241396A (ja) * | 2005-03-07 | 2006-09-14 | Kaneka Corp | 架橋ポリロタキサン及びその製造方法 |
| JP5311530B2 (ja) * | 2006-02-23 | 2013-10-09 | リンテック株式会社 | 粘着シート |
| JP2009120759A (ja) * | 2007-11-16 | 2009-06-04 | Fujifilm Corp | ポリロタキサン化合物、それを含有する組成物及びゲル状材料の製造方法 |
| KR101593717B1 (ko) * | 2008-05-07 | 2016-02-12 | 아도반스토 소후토 마테리아루즈 가부시키가이샤 | 폴리로탁산, 및 폴리로탁산과 중합체의 가교체, 및 이들의 제조 방법 |
| US8785552B2 (en) * | 2008-09-01 | 2014-07-22 | Advanced Softmaterials Inc. | Solvent-free crosslinked polyrotaxane material and process for production of same |
| JP2010138258A (ja) * | 2008-12-10 | 2010-06-24 | Lintec Corp | 粘着剤組成物及び粘着シート |
-
2011
- 2011-12-06 JP JP2011267306A patent/JP6018747B2/ja active Active
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