JP2013111980A5 - - Google Patents
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- Publication number
- JP2013111980A5 JP2013111980A5 JP2012257455A JP2012257455A JP2013111980A5 JP 2013111980 A5 JP2013111980 A5 JP 2013111980A5 JP 2012257455 A JP2012257455 A JP 2012257455A JP 2012257455 A JP2012257455 A JP 2012257455A JP 2013111980 A5 JP2013111980 A5 JP 2013111980A5
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- insulating layer
- copper foil
- laminate
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims 25
- 229910052751 metal Inorganic materials 0.000 claims 25
- 239000011889 copper foil Substances 0.000 claims 16
- 238000004519 manufacturing process Methods 0.000 claims 5
- 229920001721 Polyimide Polymers 0.000 claims 3
- 239000004642 Polyimide Substances 0.000 claims 3
- 230000001070 adhesive Effects 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 230000000875 corresponding Effects 0.000 claims 2
- 239000011888 foil Substances 0.000 claims 2
- 238000009413 insulation Methods 0.000 claims 2
- 238000007731 hot pressing Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2011-0123536 | 2011-11-24 | ||
| KR1020110123536A KR20130057674A (ko) | 2011-11-24 | 2011-11-24 | 동박적층판 및 그 제조 방법 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013111980A JP2013111980A (ja) | 2013-06-10 |
| JP2013111980A5 true JP2013111980A5 (de) | 2015-12-17 |
| JP6043604B2 JP6043604B2 (ja) | 2016-12-14 |
Family
ID=48467127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012257455A Active JP6043604B2 (ja) | 2011-11-24 | 2012-11-26 | 銅箔積層板の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8911848B2 (de) |
| JP (1) | JP6043604B2 (de) |
| KR (1) | KR20130057674A (de) |
| CN (1) | CN103129049A (de) |
| TW (1) | TWI538578B (de) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103612464B (zh) * | 2013-11-11 | 2015-11-25 | 莱芜金鼎电子材料有限公司 | 一种双面挠性覆铜板及其制备方法 |
| CN106799885A (zh) * | 2017-01-14 | 2017-06-06 | 东莞市台信光电科技有限公司 | 铝基覆铜板的层压方法 |
| KR101856684B1 (ko) * | 2017-05-12 | 2018-05-14 | 주식회사 넥스트업 | 전기 구이기 |
| DE102017215048A1 (de) * | 2017-08-29 | 2019-02-28 | Conti Temic Microelectronic Gmbh | Schaltungsträger für Leistungselektronik und Leistungselektronikmodul mit einem Schaltungsträger |
| CN111787688A (zh) * | 2020-06-30 | 2020-10-16 | 江苏艾诺信电路技术有限公司 | 金属基覆铜板、其耐电压测试方法及其制造方法 |
| CN113950187A (zh) * | 2021-10-27 | 2022-01-18 | 杨晓战 | 平面导热覆铜板及封装多块平面导热覆铜板的封装基板 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6147246A (ja) * | 1984-08-11 | 1986-03-07 | 松下電工株式会社 | 金属ベ−ス金属張積層板 |
| JPH05304345A (ja) * | 1992-04-27 | 1993-11-16 | Sanken Electric Co Ltd | 金属製配線基板及びその製造方法 |
| JPH0645715A (ja) | 1992-07-22 | 1994-02-18 | Mitsui Toatsu Chem Inc | 配線基板 |
| JPH11204903A (ja) | 1998-01-14 | 1999-07-30 | Kobe Steel Ltd | 積層金属基板 |
| JP2001345472A (ja) | 2000-03-29 | 2001-12-14 | Canon Inc | 太陽電池モジュールの検査方法、検査装置及び製造方法、太陽光発電システムの点検方法及び点検装置、並びに絶縁抵抗測定器及び耐電圧試験器 |
| JP4240457B2 (ja) * | 2002-05-30 | 2009-03-18 | 三井金属鉱業株式会社 | 両面銅張積層板及びその製造方法 |
| JP4192870B2 (ja) * | 2004-09-13 | 2008-12-10 | 新神戸電機株式会社 | 積層板および配線板 |
| KR20080062285A (ko) | 2006-12-29 | 2008-07-03 | 에스케이케미칼주식회사 | 금속 베이스 동박적층판 |
| JP2009172996A (ja) * | 2007-12-26 | 2009-08-06 | Shin Etsu Chem Co Ltd | フレキシブル銅張積層板及びその製造方法 |
| JP5185066B2 (ja) * | 2008-10-23 | 2013-04-17 | Ｊｘ日鉱日石金属株式会社 | 屈曲性に優れた銅箔、その製造方法及びフレキシブル銅貼積層板 |
| CN101790278B (zh) * | 2010-02-10 | 2011-06-08 | 上海南亚覆铜箔板有限公司 | 一种具有全避光性能的覆铜箔层压板及其制备方法 |
-
2011
- 2011-11-24 KR KR1020110123536A patent/KR20130057674A/ko not_active Application Discontinuation
-
2012
- 2012-11-20 US US13/681,872 patent/US8911848B2/en active Active
- 2012-11-23 TW TW101143847A patent/TWI538578B/zh active
- 2012-11-26 JP JP2012257455A patent/JP6043604B2/ja active Active
- 2012-11-26 CN CN2012104875323A patent/CN103129049A/zh active Pending
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