JP2013110137A - 光デバイス層の移替装置およびレーザー加工機 - Google Patents

光デバイス層の移替装置およびレーザー加工機 Download PDF

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Publication number
JP2013110137A
JP2013110137A JP2011251358A JP2011251358A JP2013110137A JP 2013110137 A JP2013110137 A JP 2013110137A JP 2011251358 A JP2011251358 A JP 2011251358A JP 2011251358 A JP2011251358 A JP 2011251358A JP 2013110137 A JP2013110137 A JP 2013110137A
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JP
Japan
Prior art keywords
substrate
holding
optical device
holding means
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011251358A
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English (en)
Japanese (ja)
Inventor
Yoji Morikazu
洋司 森數
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2011251358A priority Critical patent/JP2013110137A/ja
Priority to TW101137696A priority patent/TW201322479A/zh
Priority to KR1020120124089A priority patent/KR20130054912A/ko
Priority to CN2012104680823A priority patent/CN103123946A/zh
Publication of JP2013110137A publication Critical patent/JP2013110137A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/427—Stripping or agents therefor using plasma means only

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Led Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2011251358A 2011-11-17 2011-11-17 光デバイス層の移替装置およびレーザー加工機 Pending JP2013110137A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011251358A JP2013110137A (ja) 2011-11-17 2011-11-17 光デバイス層の移替装置およびレーザー加工機
TW101137696A TW201322479A (zh) 2011-11-17 2012-10-12 光元件層之轉移裝置及雷射加工機
KR1020120124089A KR20130054912A (ko) 2011-11-17 2012-11-05 광디바이스층의 이체 장치 및 레이저 가공기
CN2012104680823A CN103123946A (zh) 2011-11-17 2012-11-19 光器件层的移换装置和激光加工机

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011251358A JP2013110137A (ja) 2011-11-17 2011-11-17 光デバイス層の移替装置およびレーザー加工機

Publications (1)

Publication Number Publication Date
JP2013110137A true JP2013110137A (ja) 2013-06-06

Family

ID=48454876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011251358A Pending JP2013110137A (ja) 2011-11-17 2011-11-17 光デバイス層の移替装置およびレーザー加工機

Country Status (4)

Country Link
JP (1) JP2013110137A (ko)
KR (1) KR20130054912A (ko)
CN (1) CN103123946A (ko)
TW (1) TW201322479A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018093021A (ja) * 2016-12-01 2018-06-14 Jsr株式会社 対象物の処理方法、および半導体装置の製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018098441A (ja) * 2016-12-16 2018-06-21 株式会社ディスコ ダイボンダー
JP6904810B2 (ja) * 2017-06-29 2021-07-21 コマツ産機株式会社 レーザ加工機
JP7109590B2 (ja) * 2018-12-21 2022-07-29 東京エレクトロン株式会社 基板処理装置及び基板処理方法
CN113394077B (zh) * 2021-06-15 2022-10-14 纬翔华创(山东)智能电子科技有限公司 一种led外延晶层生产工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002100595A (ja) * 2000-07-21 2002-04-05 Enya Systems Ltd ウエ−ハ剥離装置及び方法並びにこれを用いたウエ−ハ処理装置
JP2004079613A (ja) * 2002-08-12 2004-03-11 Disco Abrasive Syst Ltd 半導体ウェーハ移し替え装置
JP2005522875A (ja) * 2002-04-09 2005-07-28 オリオール， インク． 金属支持膜を使用した縦方向デバイスの製作方法
JP2009099675A (ja) * 2007-10-15 2009-05-07 Showa Denko Kk 発光ダイオードの製造方法及び発光ダイオード、並びにランプ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100665173B1 (ko) * 2005-04-26 2007-01-09 삼성전기주식회사 질화물층의 제조방법 및 이를 이용한 수직구조 질화물반도체 발광소자의 제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002100595A (ja) * 2000-07-21 2002-04-05 Enya Systems Ltd ウエ−ハ剥離装置及び方法並びにこれを用いたウエ−ハ処理装置
JP2005522875A (ja) * 2002-04-09 2005-07-28 オリオール， インク． 金属支持膜を使用した縦方向デバイスの製作方法
JP2004079613A (ja) * 2002-08-12 2004-03-11 Disco Abrasive Syst Ltd 半導体ウェーハ移し替え装置
JP2009099675A (ja) * 2007-10-15 2009-05-07 Showa Denko Kk 発光ダイオードの製造方法及び発光ダイオード、並びにランプ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018093021A (ja) * 2016-12-01 2018-06-14 Jsr株式会社 対象物の処理方法、および半導体装置の製造方法

Also Published As

Publication number Publication date
TW201322479A (zh) 2013-06-01
KR20130054912A (ko) 2013-05-27
CN103123946A (zh) 2013-05-29

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