JP2013105784A5 - - Google Patents

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Publication number
JP2013105784A5
JP2013105784A5 JP2011246671A JP2011246671A JP2013105784A5 JP 2013105784 A5 JP2013105784 A5 JP 2013105784A5 JP 2011246671 A JP2011246671 A JP 2011246671A JP 2011246671 A JP2011246671 A JP 2011246671A JP 2013105784 A5 JP2013105784 A5 JP 2013105784A5
Authority
JP
Japan
Prior art keywords
glass
substrate
glass substrate
optical sensor
conductive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011246671A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013105784A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011246671A priority Critical patent/JP2013105784A/ja
Priority claimed from JP2011246671A external-priority patent/JP2013105784A/ja
Priority to TW101141001A priority patent/TW201340300A/zh
Priority to US13/669,858 priority patent/US8933386B2/en
Publication of JP2013105784A publication Critical patent/JP2013105784A/ja
Publication of JP2013105784A5 publication Critical patent/JP2013105784A5/ja
Pending legal-status Critical Current

Links

JP2011246671A 2011-11-10 2011-11-10 光センサ装置およびその製造方法 Pending JP2013105784A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011246671A JP2013105784A (ja) 2011-11-10 2011-11-10 光センサ装置およびその製造方法
TW101141001A TW201340300A (zh) 2011-11-10 2012-11-05 光感測器裝置及其製造方法
US13/669,858 US8933386B2 (en) 2011-11-10 2012-11-06 Optical sensor device and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011246671A JP2013105784A (ja) 2011-11-10 2011-11-10 光センサ装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2013105784A JP2013105784A (ja) 2013-05-30
JP2013105784A5 true JP2013105784A5 (enExample) 2014-10-30

Family

ID=48465943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011246671A Pending JP2013105784A (ja) 2011-11-10 2011-11-10 光センサ装置およびその製造方法

Country Status (3)

Country Link
US (1) US8933386B2 (enExample)
JP (1) JP2013105784A (enExample)
TW (1) TW201340300A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9374923B2 (en) * 2013-11-27 2016-06-21 Honeywell Federal Manufacturing & Technologies, Llc Monolithic LTCC seal frame and lid
KR102004797B1 (ko) * 2014-10-31 2019-10-01 삼성전기주식회사 센서 패키지 및 그 제조 방법
US9755105B2 (en) * 2015-01-30 2017-09-05 Nichia Corporation Method for producing light emitting device
CN105117074B (zh) * 2015-08-19 2018-06-29 业成光电（深圳）有限公司 光感测结构及其制造方法
KR102733549B1 (ko) * 2016-11-28 2024-11-26 엘지이노텍 주식회사 광 신호 측정 모듈 및 이를 포함하는 광 신호 감지 장치
US10919473B2 (en) 2017-09-13 2021-02-16 Corning Incorporated Sensing system and glass material for vehicles
EP3681764A4 (en) * 2017-09-13 2021-10-20 Corning Incorporated DETECTION SYSTEM AND GLASS MATERIAL FOR VEHICLES
US10712197B2 (en) 2018-01-11 2020-07-14 Analog Devices Global Unlimited Company Optical sensor package
DE102018207955B4 (de) * 2018-05-22 2023-05-17 Schweizer Electronic Ag Leiterplattenmodul mit integriertem leistungselektronischen Metall-Keramik-Modul sowie Verfahren zu dessen Herstellung
KR102276278B1 (ko) * 2019-11-05 2021-07-12 주식회사 이큐셀 반도체 공정 진단을 위한 플라즈마 센서 장치 및 이의 제조 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61214565A (ja) 1985-03-20 1986-09-24 Toshiba Corp 半導体光センサ装置
JPS62109357A (ja) * 1985-11-08 1987-05-20 Matsushita Electric Ind Co Ltd 密着型イメ−ジセンサとその組立方法
JPH01163352U (enExample) * 1988-04-30 1989-11-14
JPH0258356U (enExample) * 1988-10-21 1990-04-26
JP3311914B2 (ja) * 1995-12-27 2002-08-05 株式会社シチズン電子 チップ型発光ダイオード
JP2002124845A (ja) * 2000-08-07 2002-04-26 Nippon Sheet Glass Co Ltd 水晶振動子パッケージ及びその製造方法
JP2007036264A (ja) 2003-01-20 2007-02-08 Sharp Corp 光センサ用透光性樹脂組成物
JP2006013264A (ja) * 2004-06-28 2006-01-12 Kyocera Corp 光半導体素子収納用パッケージおよび光半導体装置
JP2007299929A (ja) * 2006-04-28 2007-11-15 Matsushita Electric Ind Co Ltd 光学デバイス装置とそれを用いた光学デバイスモジュール
JP4219943B2 (ja) * 2006-07-03 2009-02-04 パナソニック株式会社 固体撮像装置
JP2009064839A (ja) * 2007-09-04 2009-03-26 Panasonic Corp 光学デバイス及びその製造方法
JP4799542B2 (ja) * 2007-12-27 2011-10-26 株式会社東芝 半導体パッケージ
JP5189378B2 (ja) * 2008-02-18 2013-04-24 セイコーインスツル株式会社 圧電振動子の製造方法
JP4794615B2 (ja) * 2008-11-27 2011-10-19 パナソニック株式会社 半導体装置

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