JP2013070313A - 振動デバイス及び電子機器 - Google Patents
振動デバイス及び電子機器 Download PDFInfo
- Publication number
- JP2013070313A JP2013070313A JP2011208666A JP2011208666A JP2013070313A JP 2013070313 A JP2013070313 A JP 2013070313A JP 2011208666 A JP2011208666 A JP 2011208666A JP 2011208666 A JP2011208666 A JP 2011208666A JP 2013070313 A JP2013070313 A JP 2013070313A
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- JP
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- main surface
- vibration device
- vibrating
- surface side
- lid
- Prior art date
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- 238000005304 joining Methods 0.000 claims abstract description 29
- 238000003860 storage Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 230000010355 oscillation Effects 0.000 claims description 11
- 239000013078 crystal Substances 0.000 abstract description 90
- 230000004048 modification Effects 0.000 description 23
- 238000012986 modification Methods 0.000 description 23
- 239000010453 quartz Substances 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 238000010586 diagram Methods 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 10
- 230000005284 excitation Effects 0.000 description 8
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- 229920005989 resin Polymers 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
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- 239000000463 material Substances 0.000 description 4
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000001413 cellular effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
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- 238000010304 firing Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- PSHMSSXLYVAENJ-UHFFFAOYSA-N dilithium;[oxido(oxoboranyloxy)boranyl]oxy-oxoboranyloxyborinate Chemical compound [Li+].[Li+].O=BOB([O-])OB([O-])OB=O PSHMSSXLYVAENJ-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Images
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011208666A JP2013070313A (ja) | 2011-09-26 | 2011-09-26 | 振動デバイス及び電子機器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011208666A JP2013070313A (ja) | 2011-09-26 | 2011-09-26 | 振動デバイス及び電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013070313A true JP2013070313A (ja) | 2013-04-18 |
JP2013070313A5 JP2013070313A5 (enrdf_load_stackoverflow) | 2014-10-16 |
Family
ID=48475474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011208666A Withdrawn JP2013070313A (ja) | 2011-09-26 | 2011-09-26 | 振動デバイス及び電子機器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2013070313A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018026649A (ja) * | 2016-08-09 | 2018-02-15 | 新日本無線株式会社 | 発振装置及びその製造方法 |
US10009004B2 (en) | 2014-07-30 | 2018-06-26 | Seiko Epson Corporation | Resonator device, electronic device, and mobile object |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0669373A (ja) * | 1992-08-20 | 1994-03-11 | Ngk Spark Plug Co Ltd | 配線基板とその製造方法 |
US5422615A (en) * | 1992-09-14 | 1995-06-06 | Hitachi, Ltd. | High frequency circuit device |
JPH11145768A (ja) * | 1997-11-13 | 1999-05-28 | Toyo Commun Equip Co Ltd | チップ部品複合圧電デバイス |
JP2003163296A (ja) * | 2001-11-28 | 2003-06-06 | Kyocera Corp | 表面実装型電子部品 |
JP2004015118A (ja) * | 2002-06-03 | 2004-01-15 | Seiko Epson Corp | 圧電デバイス、及びこれを利用したicカード、携帯電話装置、電子機器、並びに圧電デバイスの実装構造 |
JP2004120481A (ja) * | 2002-09-27 | 2004-04-15 | Toyo Commun Equip Co Ltd | 圧電デバイスとそのパッケージ構造 |
JP2004135090A (ja) * | 2002-10-10 | 2004-04-30 | Toyo Commun Equip Co Ltd | 表面実装型圧電発振器 |
JP2005159575A (ja) * | 2003-11-21 | 2005-06-16 | Toyo Commun Equip Co Ltd | 表面実装型圧電発振器 |
JP2006339943A (ja) * | 2005-06-01 | 2006-12-14 | Seiko Epson Corp | 圧電デバイス |
JP2007043338A (ja) * | 2005-08-01 | 2007-02-15 | Epson Toyocom Corp | 温度補償水晶振動子、水晶発振器、及び温度補償水晶振動子の製造方法 |
JP2007060320A (ja) * | 2005-08-24 | 2007-03-08 | Epson Toyocom Corp | 表面実装型圧電発振器用パッケージ、表面実装型圧電発振器 |
JP2008278286A (ja) * | 2007-05-01 | 2008-11-13 | Epson Toyocom Corp | 圧電デバイスおよびその製造方法 |
JP2009038533A (ja) * | 2007-07-31 | 2009-02-19 | Kyocera Kinseki Corp | 圧電発振器 |
JP2009055545A (ja) * | 2007-08-29 | 2009-03-12 | Citizen Finetech Miyota Co Ltd | 圧電デバイスとこれの製造方法 |
JP2010183349A (ja) * | 2009-02-05 | 2010-08-19 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶発振器 |
-
2011
- 2011-09-26 JP JP2011208666A patent/JP2013070313A/ja not_active Withdrawn
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0669373A (ja) * | 1992-08-20 | 1994-03-11 | Ngk Spark Plug Co Ltd | 配線基板とその製造方法 |
US5422615A (en) * | 1992-09-14 | 1995-06-06 | Hitachi, Ltd. | High frequency circuit device |
JPH11145768A (ja) * | 1997-11-13 | 1999-05-28 | Toyo Commun Equip Co Ltd | チップ部品複合圧電デバイス |
JP2003163296A (ja) * | 2001-11-28 | 2003-06-06 | Kyocera Corp | 表面実装型電子部品 |
JP2004015118A (ja) * | 2002-06-03 | 2004-01-15 | Seiko Epson Corp | 圧電デバイス、及びこれを利用したicカード、携帯電話装置、電子機器、並びに圧電デバイスの実装構造 |
JP2004120481A (ja) * | 2002-09-27 | 2004-04-15 | Toyo Commun Equip Co Ltd | 圧電デバイスとそのパッケージ構造 |
JP2004135090A (ja) * | 2002-10-10 | 2004-04-30 | Toyo Commun Equip Co Ltd | 表面実装型圧電発振器 |
JP2005159575A (ja) * | 2003-11-21 | 2005-06-16 | Toyo Commun Equip Co Ltd | 表面実装型圧電発振器 |
JP2006339943A (ja) * | 2005-06-01 | 2006-12-14 | Seiko Epson Corp | 圧電デバイス |
JP2007043338A (ja) * | 2005-08-01 | 2007-02-15 | Epson Toyocom Corp | 温度補償水晶振動子、水晶発振器、及び温度補償水晶振動子の製造方法 |
JP2007060320A (ja) * | 2005-08-24 | 2007-03-08 | Epson Toyocom Corp | 表面実装型圧電発振器用パッケージ、表面実装型圧電発振器 |
JP2008278286A (ja) * | 2007-05-01 | 2008-11-13 | Epson Toyocom Corp | 圧電デバイスおよびその製造方法 |
JP2009038533A (ja) * | 2007-07-31 | 2009-02-19 | Kyocera Kinseki Corp | 圧電発振器 |
JP2009055545A (ja) * | 2007-08-29 | 2009-03-12 | Citizen Finetech Miyota Co Ltd | 圧電デバイスとこれの製造方法 |
JP2010183349A (ja) * | 2009-02-05 | 2010-08-19 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶発振器 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10009004B2 (en) | 2014-07-30 | 2018-06-26 | Seiko Epson Corporation | Resonator device, electronic device, and mobile object |
US10396754B2 (en) | 2014-07-30 | 2019-08-27 | Seiko Epson Corporation | Resonator device, electronic device, and moving object |
CN111600600A (zh) * | 2014-07-30 | 2020-08-28 | 精工爱普生株式会社 | 振动器件、电子设备以及移动体 |
CN111641408A (zh) * | 2014-07-30 | 2020-09-08 | 精工爱普生株式会社 | 振动器件、电子设备以及移动体 |
US11101785B2 (en) | 2014-07-30 | 2021-08-24 | Seiko Epson Corporation | Resonator device, electronic device, and moving object |
US11641186B2 (en) | 2014-07-30 | 2023-05-02 | Seiko Epson Corporation | Resonator device, electronic device, and moving object |
CN111600600B (zh) * | 2014-07-30 | 2023-10-20 | 精工爱普生株式会社 | 振动器件、电子设备以及移动体 |
CN111641408B (zh) * | 2014-07-30 | 2023-10-27 | 精工爱普生株式会社 | 振动器件、电子设备以及移动体 |
US11979138B2 (en) | 2014-07-30 | 2024-05-07 | Seiko Epson Corporation | Resonator device, electronic device, and moving object |
US12278615B2 (en) | 2014-07-30 | 2025-04-15 | Seiko Epson Corporation | Resonator device, electronic device, and moving object |
JP2018026649A (ja) * | 2016-08-09 | 2018-02-15 | 新日本無線株式会社 | 発振装置及びその製造方法 |
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