JP2013060663A - Ald/cvdプロセスにおけるgst膜のためのアンチモン前駆体 - Google Patents
Ald/cvdプロセスにおけるgst膜のためのアンチモン前駆体 Download PDFInfo
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- 239000002243 precursor Substances 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 30
- 229910052787 antimony Inorganic materials 0.000 title claims abstract description 29
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 238000000231 atomic layer deposition Methods 0.000 claims abstract description 22
- KFMLSKLCIQLEQK-UHFFFAOYSA-N [SiH3].[Sb] Chemical compound [SiH3].[Sb] KFMLSKLCIQLEQK-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 13
- 239000000956 alloy Substances 0.000 claims abstract description 13
- 229910000618 GeSbTe Inorganic materials 0.000 claims abstract description 8
- 238000000277 atomic layer chemical vapour deposition Methods 0.000 claims abstract description 7
- 125000003118 aryl group Chemical group 0.000 claims description 27
- 125000003342 alkenyl group Chemical group 0.000 claims description 21
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 21
- 125000006165 cyclic alkyl group Chemical group 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 19
- 125000004122 cyclic group Chemical group 0.000 claims description 16
- 229910052714 tellurium Inorganic materials 0.000 claims description 16
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 16
- 125000000217 alkyl group Chemical group 0.000 claims description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 9
- 229910052732 germanium Inorganic materials 0.000 claims description 9
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- SFHJDYHBPMNNKO-UHFFFAOYSA-N antimony;trimethylsilicon Chemical group C[Si](C)(C)[Sb]([Si](C)(C)C)[Si](C)(C)C SFHJDYHBPMNNKO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- GMEFXBFKMIZRMO-UHFFFAOYSA-N aminogermanium Chemical compound [Ge]N GMEFXBFKMIZRMO-UHFFFAOYSA-N 0.000 claims description 3
- CMQHQXKOLLCVCB-UHFFFAOYSA-N N[Sb]([SiH3])[SiH3] Chemical compound N[Sb]([SiH3])[SiH3] CMQHQXKOLLCVCB-UHFFFAOYSA-N 0.000 claims 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 238000004821 distillation Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- -1 silylantimony compound Chemical class 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 5
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- NGKZLZJWIOWBBW-UHFFFAOYSA-N antimony;dimethyl-$l^{3}-silane Chemical compound C[SiH](C)[Sb]([SiH](C)C)[SiH](C)C NGKZLZJWIOWBBW-UHFFFAOYSA-N 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- QABCGOSYZHCPGN-UHFFFAOYSA-N chloro(dimethyl)silicon Chemical compound C[Si](C)Cl QABCGOSYZHCPGN-UHFFFAOYSA-N 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- SIAPCJWMELPYOE-UHFFFAOYSA-N lithium hydride Chemical compound [LiH] SIAPCJWMELPYOE-UHFFFAOYSA-N 0.000 description 2
- 229910000103 lithium hydride Inorganic materials 0.000 description 2
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 2
- 125000002524 organometallic group Chemical group 0.000 description 2
- 239000012782 phase change material Substances 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- GWFYHOXZOBEFTG-UHFFFAOYSA-N [GeH3]N Chemical compound [GeH3]N GWFYHOXZOBEFTG-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000004770 chalcogenides Chemical group 0.000 description 1
- 229910000078 germane Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 239000002052 molecular layer Substances 0.000 description 1
- JKUUTODNPMRHHZ-UHFFFAOYSA-N n-methyl-n-[tris(dimethylamino)germyl]methanamine Chemical compound CN(C)[Ge](N(C)C)(N(C)C)N(C)C JKUUTODNPMRHHZ-UHFFFAOYSA-N 0.000 description 1
- KAHVZNKZQFSBFW-UHFFFAOYSA-N n-methyl-n-trimethylsilylmethanamine Chemical compound CN(C)[Si](C)(C)C KAHVZNKZQFSBFW-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- IHBMMJGTJFPEQY-UHFFFAOYSA-N sulfanylidene(sulfanylidenestibanylsulfanyl)stibane Chemical compound S=[Sb]S[Sb]=S IHBMMJGTJFPEQY-UHFFFAOYSA-N 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/20—Silicates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B19/00—Selenium; Tellurium; Compounds thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G17/00—Compounds of germanium
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G30/00—Compounds of antimony
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
- C07F9/90—Antimony compounds
- C07F9/902—Compounds without antimony-carbon linkages
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/305—Sulfides, selenides, or tellurides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
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- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Vapour Deposition (AREA)
- Semiconductor Memories (AREA)
Abstract
【解決手段】原子層堆積及び化学気相成長からなる群より選択されるプロセスを用いてゲルマニウム−アンチモン−テルル合金膜を製造する方法であって、シリルアンチモン前駆体が該合金膜のためのアンチモン源として用いられる方法が提供される。新規のシリルアンチモン化合物もまた開示される。
【選択図】なし
Description
200メッシュのアンチモン粉末1.22g(0.01mol)、水素化リチウム0.72g(0.03mol)及びテトラヒドロフラン(THF)40mlを100mlのフラスコに入れた。撹拌しながら、この混合物を4時間還流した。アンチモンを構成する黒色粉末が全て消失し、濁った色の沈殿が生成した。次いで混合物を−20℃に冷却し、トリメチルクロロシラン3.3g(0.03mol)を加えた。混合物を室温まで温めた。4時間撹拌した後、混合物を不活性雰囲気下で濾過した。溶媒を蒸留によって除去した。トリス(トリメチルシリル)アンチモンを減圧蒸留により精製した。
200メッシュのアンチモン粉末1.22g(0.01mol)、水素化リチウム0.72g(0.03mol)及びテトラヒドロフラン(THF)40mlを100mlのフラスコに入れた。撹拌しながら、この混合物を4時間還流した。アンチモンを構成する黒色粉末が全て消失し、濁った色の沈殿が生成した。次いで混合物を−20℃に冷却し、ジメチルクロロシラン2.83g(0.03mol)を加えた。混合物を室温まで温めた。4時間撹拌した後、混合物を不活性雰囲気下で濾過した。溶媒を蒸留によって除去した。トリス(ジメチルシリル)アンチモンを減圧蒸留により精製した。
200メッシュのアンチモン粉末3.65g(0.03mol)、ナトリウム2.07g(0.09mol)、ナフタレン1.15g(0.009mol)及びTHF50mlを100mlのフラスコに入れた。混合物を室温で24時間撹拌した。アンチモンを構成する黒色粉末及びナトリウムが全て消失し、濁った色の沈殿が生成した。次いで混合物を−20℃に冷却し、ジメチルクロロシラン8.51g(0.09mol)を加えた。混合物を室温まで温めた。4時間撹拌した後、混合物を不活性雰囲気下で濾過した。溶媒を蒸留によって除去した。トリス(ジメチルシリル)アンチモンを減圧蒸留により精製した。
窒素を満たしゴムの隔壁を取り付けた100mlのパイレックス(登録商標)ガラスフラスコの底にトリス(ジメチルシリル)アンチモン0.05gを入れた。メタノール0.1gをシリンジでゆっくりと加えた。光沢のある黒色の膜がフラスコのガラス壁内部に堆積し始めた。数分後、フラスコ内部全体が暗灰色/黒色のアンチモン膜で被覆された。
Claims (9)
- 原子層堆積及び化学気相成長からなる群より選択されるプロセスを用いてゲルマニウム−アンチモン−テルル合金膜を製造する方法であって、シリルアンチモン前駆体が該合金膜のためのアンチモン源として用いられる、方法。
- 前記シリルアンチモン前駆体が、トリシリルアンチモン、ジシリルアンチモン、アルキルジシリルアンチモン、アミノジシリルアンチモン、及びそれらの混合物からなる群より選択される、請求項1に記載の方法。
- 前記シリルアンチモン前駆体がトリス(トリメチルシリル)アンチモンである、請求項1に記載の方法。
- 前記シリルアンチモン前駆体を堆積した後、ROH(式中、Rは1〜10個の炭素原子を直鎖、分岐若しくは環状の形態で有するアルキル基、又は芳香族基である)の一般式を有するアルコールと接触される、請求項1に記載の方法。
- 原子層堆積及び化学気相成長からなる群より選択されるプロセスを用いてゲルマニウム−アンチモン−テルル合金膜を製造する方法であって、シリルアンチモン前駆体が該合金膜のためのアンチモン源として用いられ、該シリルアンチモン前駆体が、以下の一般式、即ち、
- 以下の式、即ち、
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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US2398908P | 2008-01-28 | 2008-01-28 | |
US61/023,989 | 2008-01-28 | ||
US12/355,325 | 2009-01-16 | ||
US12/355,325 US8318252B2 (en) | 2008-01-28 | 2009-01-16 | Antimony precursors for GST films in ALD/CVD processes |
Related Parent Applications (1)
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JP2009016913A Division JP5350819B2 (ja) | 2008-01-28 | 2009-01-28 | ゲルマニウム−アンチモン−テルル合金膜を製造するための原子層堆積(ald)方法 |
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JP2013060663A true JP2013060663A (ja) | 2013-04-04 |
JP2013060663A5 JP2013060663A5 (ja) | 2014-04-24 |
JP5778648B2 JP5778648B2 (ja) | 2015-09-16 |
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JP2009016913A Expired - Fee Related JP5350819B2 (ja) | 2008-01-28 | 2009-01-28 | ゲルマニウム−アンチモン−テルル合金膜を製造するための原子層堆積(ald)方法 |
JP2012220284A Expired - Fee Related JP5778648B2 (ja) | 2008-01-28 | 2012-10-02 | シリルアンチモン前駆体及びそれを用いた原子層堆積(ald)方法 |
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US (1) | US8318252B2 (ja) |
EP (1) | EP2083096B1 (ja) |
JP (2) | JP5350819B2 (ja) |
KR (1) | KR101068013B1 (ja) |
CN (1) | CN101497999B (ja) |
TW (1) | TWI382104B (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
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EP2302094A1 (en) | 2006-05-12 | 2011-03-30 | Advanced Technology Materials, Inc. | Low temperature deposition of phase change memory materials |
CN101495672B (zh) | 2006-11-02 | 2011-12-07 | 高级技术材料公司 | 对于金属薄膜的cvd/ald有用的锑及锗复合物 |
US8834968B2 (en) | 2007-10-11 | 2014-09-16 | Samsung Electronics Co., Ltd. | Method of forming phase change material layer using Ge(II) source, and method of fabricating phase change memory device |
KR101458953B1 (ko) | 2007-10-11 | 2014-11-07 | 삼성전자주식회사 | Ge(Ⅱ)소오스를 사용한 상변화 물질막 형성 방법 및상변화 메모리 소자 제조 방법 |
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US8318252B2 (en) | 2012-11-27 |
CN101497999A (zh) | 2009-08-05 |
EP2083096B1 (en) | 2013-01-02 |
JP5778648B2 (ja) | 2015-09-16 |
JP5350819B2 (ja) | 2013-11-27 |
TWI382104B (zh) | 2013-01-11 |
KR20090082873A (ko) | 2009-07-31 |
KR101068013B1 (ko) | 2011-09-26 |
EP2083096A1 (en) | 2009-07-29 |
US20090191330A1 (en) | 2009-07-30 |
TW200934885A (en) | 2009-08-16 |
CN101497999B (zh) | 2012-08-08 |
JP2009215645A (ja) | 2009-09-24 |
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