JP2013048302A - 電気的にポンピングされる半導体エバネッセント・レーザー - Google Patents
電気的にポンピングされる半導体エバネッセント・レーザー Download PDFInfo
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Abstract
【解決手段】能動半導体材料が、光導波路と能動半導体材料との間のエバネッセント結合界面を画定する光導波路の上に配置され、それにより、光導波路によって案内されるべき光モードは光導波路および能動半導体材料両方に重なる。電流注入経路が能動半導体材料を通じて画定され、光モードに少なくとも部分的に重なる。それにより、光モードに少なくとも部分的に重なる電流注入経路に沿った電流注入に応答した能動半導体材料の電気的ポンピングに応答して光が生成される。
【選択図】図1A
Description
本発明は、米国国防省によって授与された契約第W911NF-05-1-0175のもとでの政府支援を得てなされた。米国政府は本発明に一定の権利を有する。
本発明は、概括的には光学に関し、より詳細には本発明は光学的な相互接続および通信に関する。
本明細書を通じて「一つの実施形態」または「ある実施形態」の言及は、実施形態との関連で記載される特定の特徴、構造または特性が本発明の少なくとも一つの実施形態に含まれることを意味する。よって、本明細書を通じた随所に「一つの実施形態において」または「ある実施形態において」の句が現れることが、必ずしも同じ実施形態を指すのではない。さらに、特定の特徴、構造または特性は、一つまたは複数の実施形態において任意の好適な仕方で組み合わされてもよい。さらに、本明細書とともに与えられる図面は、当業者に対する説明のためであって、図面は必ずしも縮尺通りに描かれていないことは理解されるものである。
および545は、利得媒質材料523のN‐III-V層528に直接結合されている。よって、電子は接点543および545を通じてN‐III-V層528を通じて注入され、ホールは接点541を通じてP層525を通じて能動層526に注入される。こうして、電流注入経路は、接点541、543および545の間で、利得媒質材料523の能動層526を通じて画定され、図5の例に示されるような光モード519に重なるまたは少なくとも部分的に重なる。このように、本発明の教示に基づく、光ビーム519の光モードに重なるまたは少なくとも部分的に重なる電流注入経路に沿った電流注入に応答した利得媒質材料523の電気的ポンピングに応答して、光が生成される。図5に示した接点543および545が利得媒質材料523のN‐III-V層528に直接結合されている例では、電流注入経路はエバネッセント結合界面533を通過せず、したがって、利得媒質材料523内に残ることを注意しておく。
Claims (15)
- シリコン内に形成された光導波路と;
前記光導波路の上に配された能動半導体材料であって、前記能動半導体材料は、前記光導波路によって案内されるべき光モードが前記光導波路および前記能動半導体材料の両方に重なるよう、前記光導波路と前記能動半導体材料との間のエバネッセント結合界面を画定し、前記エバネッセント結合界面は前記光導波路と前記能動半導体材料との間のエピタキシャル成長界面を含む、能動半導体材料と;
完全に前記能動半導体材料内に画定され、前記光モードに少なくとも部分的に重なる電流注入経路とを有する装置であって、前記電流注入経路に沿った電流注入に応答した前記能動半導体材料の電気的ポンピングに応答して光が生成される、
装置。 - 前記能動半導体材料が電気的にポンピングされる光放出層を有する、請求項1記載の装置。
- 前記能動半導体材料が、前記光モードに重なる多重量子井戸(MQW)領域を有する、請求項2記載の装置。
- 前記能動半導体材料を通じた電流注入が前記光モードに重なるよう閉じ込めるのを助けるための、前記能動半導体材料の両横側に画定された電流注入閉じ込め領域をさらに有する、請求項1記載の装置。
- 前記電流注入閉じ込め領域が、前記能動半導体材料のプロトン・インプラントされた領域を有する、請求項4記載の装置。
- 前記電流注入閉じ込め領域が、前記能動半導体材料の両横側に配置された少なくとも半絶縁性の材料を有する、請求項4記載の装置。
- 前記電流注入経路の両端に画定される少なくとも第一および第二の接点をさらに有する、請求項1記載の装置。
- 前記第一および第二の接点が前記能動半導体材料に直接結合されている、請求項7記載の装置。
- 前記光導波路が複数の導波路のうちの一つであり、該複数の導波路にわたって前記能動半導体材料が配置されて複数のレーザーを形成する、請求項1記載の装置。
- 光モードを、シリコン内に配された光導波路で案内することと;
前記光導波路および該光導波路にエバネッセント結合された能動半導体材料の両方に、前記光導波路を通じて案内される前記光モードを重ならせ、ここで、前記エバネッセント結合界面は前記光導波路と前記能動半導体材料との間のエピタキシャル成長界面にまたがって現れる、ことと;
前記能動半導体材料を電気的にポンピングして、完全に前記能動半導体材料内においてかつ前記光モードを通って方向付けられる電流を注入することと;
注入された電流に応答して前記能動半導体材料中に光を発生させることとを含む、
方法。 - 前記注入された電流を前記光モードを通って方向付けするために、前記能動半導体材料中に画定された閉じ込め領域によって前記注入された電流を閉じ込めることをさらに含む、請求項10記載の方法。
- 前記光導波路を含む光空洞内で光をレーザー発振することをさらに含む、請求項10記載の方法。
- シリコン内に形成された光導波路と;
前記光導波路の上に配された能動半導体材料であって、前記能動半導体材料は、前記光導波路によって案内されるべき光モードが前記光導波路および前記能動半導体材料の両方に重なるよう、前記光導波路と前記能動半導体材料との間のエバネッセント結合界面を画定し、前記エバネッセント結合界面は前記光導波路と前記能動半導体材料との間のエピタキシャル成長界面を含む、能動半導体材料と;
完全に前記能動半導体材料内に画定され、前記光モードに少なくとも部分的に重なる電流注入経路とを有するレーザーを有するシステムであって、前記光モードに少なくとも部分的に重なる前記電流注入経路に沿った電流注入に応答した前記能動半導体材料の電気的ポンピングに応答して光が生成され、
当該システムはさらに、
前記レーザーによって発生された光を受光するよう光学的に結合された光受信器と;
前記レーザーによって発生された光を通し、前記レーザーから前記受光器に方向付けする光ファイバーとを有する、
システム。 - 前記レーザーによって発生された光を変調するために光学的に結合された光変調器をさらに有する、請求項13記載のシステム。
- 前記能動半導体材料が、前記光モードに重なる多重量子井戸(MQW)領域を有する、請求項13記載のシステム。
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US20080002929A1 (en) * | 2006-06-30 | 2008-01-03 | Bowers John E | Electrically pumped semiconductor evanescent laser |
JP2008198957A (ja) * | 2007-02-16 | 2008-08-28 | Hitachi Ltd | 半導体レーザ装置および光増幅装置 |
WO2008137369A1 (en) * | 2007-05-02 | 2008-11-13 | California Institute Of Technology | Hybrid waveguide systems and related methods |
US8299485B2 (en) * | 2008-03-19 | 2012-10-30 | Soitec | Substrates for monolithic optical circuits and electronic circuits |
US8111729B2 (en) * | 2008-03-25 | 2012-02-07 | Intel Corporation | Multi-wavelength hybrid silicon laser array |
CN101741007B (zh) * | 2008-11-04 | 2011-07-27 | 北京大学 | 金属键合硅基激光器的制备方法 |
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WO2010100738A1 (ja) * | 2009-03-05 | 2010-09-10 | 富士通株式会社 | 半導体レーザ、シリコン導波路基板、集積素子 |
US8217410B2 (en) * | 2009-03-27 | 2012-07-10 | Wisconsin Alumni Research Foundation | Hybrid vertical cavity light emitting sources |
US7961765B2 (en) | 2009-03-31 | 2011-06-14 | Intel Corporation | Narrow surface corrugated grating |
US8450186B2 (en) * | 2009-09-25 | 2013-05-28 | Intel Corporation | Optical modulator utilizing wafer bonding technology |
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TW200810302A (en) | 2008-02-16 |
US20080002929A1 (en) | 2008-01-03 |
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