JP2013030640A - Package for housing optical semiconductor element and optical semiconductor device including the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for housing an optical semiconductor element capable of improving operativity of an optical semiconductor element by suppressing deviation of a through hole in the axial direction at a cylindrical fixing member.SOLUTION: In a package 1 for housing an optical semiconductor element, an optical fiber holding member 9 includes a cylindrical body part which is inserted in an opening and a plurality of body supporting parts which are positioned below the body part and whose lower end is jointed to an upper surface of a base body 5 by a jointing member, inside a region surrounded with a frame 7. The width at the lower end of the body supporting part in the direction vertical to a penetration direction of a through hole is narrower than the width of the body part in the direction vertical to the penetration direction of the through hole.

Description

  The present invention relates to an optical semiconductor element accommodation package for accommodating an optical semiconductor element typified by LD (laser diode) and PD (photodiode), and an optical semiconductor device provided with the same.

  As an optical semiconductor element storage package for storing an optical semiconductor element, for example, a package described in Patent Document 1 is known. The package described in Patent Document 1 includes a frame having an opening at a side portion and a cylindrical fixing member having a through hole attached to an outer surface around the opening. By fixing the optical fiber or the ferrule into which the optical fiber is inserted to the fixing member, the optical fiber can be optically coupled to the optical semiconductor element housed in the package.

JP 2000-106445 A

  When manufacturing or using the package described in Patent Document 1, thermal stress may be transmitted to the fixing member. In such a case, there is a possibility that desired optical coupling of the optical fiber to the optical semiconductor element cannot be obtained because the axial direction of the through hole in the cylindrical fixing member is shifted. By inserting and fixing the cylindrical fixing member into the opening of the frame body, the above-described shift of the through hole in the cylindrical fixing member can be reduced, but better optical coupling of the optical fiber to the optical semiconductor element Is required.

  The present invention has been made in view of the above problems, and an optical semiconductor capable of improving the operability of an optical semiconductor element by suppressing axial displacement of a through hole in a cylindrical fixing member. An object is to provide a package for element storage.

  An optical semiconductor element storage package according to an aspect of the present invention includes a base body having a mounting area for mounting an optical semiconductor element on an upper surface, and an inner circumference provided on the upper surface of the base body so as to surround the mounting area. And an optical fiber holding member having through holes that are inserted into the opening and are respectively opened inside and outside a region surrounded by the frame. ing.

  The optical fiber holding member is a cylindrical main body portion inserted into the opening, and is positioned below the main body portion. A lower end of the optical fiber holding member is joined to an upper surface of the base body in an area surrounded by the frame body. A plurality of main body support portions joined together by each other. And the width | variety of the direction perpendicular | vertical to the penetration direction of the said through-hole in the said lower end of the said main body support part is smaller than the width | variety of the direction perpendicular | vertical to the penetration direction of the said through-hole in the said main body part, It is characterized by the above-mentioned.

In the optical semiconductor element storage package according to the above aspect, the optical fiber holding member is located inside the region surrounded by the frame body, which is positioned below the cylindrical main body portion inserted into the opening and the main body portion. The lower end has a plurality of main body support portions joined to the upper surface of the base body by a joining member. Since the plurality of main body support portions are thus provided, the optical fiber holding member can be fixed to the base.

  Furthermore, the width in the direction perpendicular to the penetration direction of the through hole at the lower end of the main body support portion is smaller than the width in the direction perpendicular to the penetration direction of the through hole in the main body portion. Thereby, it becomes easy for the joining member that joins the plurality of main body support portions to the upper surface of the base body to spread out in the overlapping region when the main body portion is seen through in plan view. Therefore, the optical fiber holding member can be stably fixed to the base, and the axial displacement of the through hole in the optical fiber holding member can be suppressed. As a result, when the optical fiber is fixed to the optical fiber holding member, the optical coupling to the optical semiconductor element can be improved.

1 is an exploded perspective view showing an optical semiconductor element housing package and an optical semiconductor device according to an embodiment of the present invention. It is an expansion perspective view of the optical fiber holding member in the optical semiconductor element accommodation package shown in FIG. (A) is a top view from the lower surface side of the optical fiber holding member shown in FIG. (B) is XX sectional drawing of the optical fiber holding member shown to Fig.3 (a). It is an expansion perspective view which shows the 1st modification of the optical fiber holding member shown in FIG. (A) is a top view from the lower surface side of the optical fiber holding member shown in FIG. (B) is XX sectional drawing of the optical fiber holding member shown to Fig.5 (a). It is an expansion perspective view which shows the 2nd modification of the optical fiber holding member shown in FIG. (A) is a top view from the lower surface side of the optical fiber holding member shown in FIG. (B) is XX sectional drawing of the optical fiber holding member shown to Fig.7 (a). It is an expansion perspective view which shows the 3rd modification of the optical fiber holding member shown in FIG. (A) is a top view from the lower surface side of the optical fiber holding member shown in FIG. (B) is XX sectional drawing of the optical fiber holding member shown to Fig.9 (a).

  Hereinafter, a package for housing an optical semiconductor element according to each embodiment (hereinafter also simply referred to as a package) and an optical semiconductor device including the package will be described in detail with reference to the drawings. However, in the drawings referred to below, for convenience of explanation, among the constituent members of the embodiment, only the main members necessary for explaining the present invention are shown in a simplified manner. Therefore, the package and the optical semiconductor device of the present invention can include arbitrary constituent members not shown in the drawings referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

  As shown in FIGS. 1 to 3, the optical semiconductor element housing package 1 of the present embodiment includes a base 5 having a mounting area for mounting an optical semiconductor element 3 (hereinafter also simply referred to as an optical element 3) on the upper surface. A frame body 7 provided on the upper surface of the base 5 so as to surround the mounting area and having openings on the inner and outer peripheral surfaces and an area surrounded by the frame body 7 inserted in the opening And an optical fiber holding member 9 (hereinafter, also simply referred to as holding member 9) having through-holes opened on the inner side and the outer side, respectively.

  The holding member 9 is positioned below the cylindrical main body 11 inserted into the opening and the main body 11, and the lower end is bonded to the upper surface of the base body 5 by a bonding member inside the region surrounded by the frame body 7. A plurality of main body support portions 13 are provided. The width D1 in the direction perpendicular to the penetration direction of the through hole at the lower end of the main body support portion 13 is smaller than the width D2 in the direction perpendicular to the penetration direction of the through hole in the main body portion 11.

  In the package 1 of the present embodiment, the holding member 9 has the plurality of main body support portions 13 described above. Since there are a plurality of main body support portions 13 instead of one, the holding member 9 can be fixed to a plurality of locations on the base 5. Therefore, it is possible to stably position the holding member 9 with respect to the base body 5.

  In particular, when optically coupling with the optical element 3, the positioning of the end portion located inside the region surrounded by the frame body 7 in the holding member 9 is important. In the package 1 of the present embodiment, since the plurality of main body support portions 13 are respectively inside the region surrounded by the frame body 7, the end portion of the holding member 9 described above can be positioned stably. .

  Further, in the package 1 of the present embodiment, the width D1 in the direction perpendicular to the through direction of the through hole at the lower end of the main body support portion 13 is larger than the width D2 in the direction perpendicular to the through direction of the through hole in the main body portion 11. small. By bonding the main body support portion 13 to the upper surface of the base body 5 using a bonding member, the position of the main body support portion 13 relative to the base body 5 can be fixed.

  On the other hand, when the plurality of main body support portions 13 are joined to the base body 5 by the joining member, there is a possibility that stress concentrates on the joint portion of the main body support portion 13 to the base body 5. This is because when the joining member is biased to a part of the region and the amount of the joining member in this specific region becomes excessive, the joining member is caused by the difference in thermal expansion coefficients of the base 5, the holding member 9 and the joining member. This is because there is a possibility that a large thermal stress is concentrated in the excessive region.

  Therefore, it is required to make the joining member easily wet and spread on the upper surface of the substrate 5. In the package 1 of the present embodiment, the width D1 in the direction perpendicular to the through direction of the through hole at the lower end of the main body support portion 13 is smaller than the width D2 in the direction perpendicular to the through direction of the through hole in the main body portion 11.

  When the width D1 in the direction perpendicular to the penetrating direction of the through hole at the lower end of the main body support portion 13 is larger than the width D2 in the direction perpendicular to the penetrating direction of the through hole in the main body portion 11, The support part 13 itself becomes an obstacle. Therefore, for example, the joining member existing near one of the plurality of main body support portions 13 spreads wet near the other main body support portion 13, and greatly spreads around the former main body support portion 13. It will be. Therefore, it becomes difficult for the joining member to spread and spread to the other body support portion 13 of the latter.

  On the other hand, in the package 1 of the present embodiment, as described above, the width D1 in the direction perpendicular to the through direction of the through hole at the lower end of the main body support portion 13 is in the direction perpendicular to the through direction of the through hole of the main body portion 11. It is smaller than the width D2. For this reason, the joining member can spread wet without largely detouring around the body support portion 13. Thereby, when the main body part 11 on the upper surface of the base body 5 is seen through in plane, it becomes easy to spread in the overlapping region. As a result, since it is suppressed that a joining member deviates to a specific area | region, the holding member 9 can be fixed to the base | substrate 5 stably.

  The base body 5 in the present embodiment has a plate shape, and has a mounting area for mounting the optical element 3 on the upper surface. Specifically, the base body 5 in this embodiment has a shape having a square plate-shaped portion and a portion in which the screw holes are formed by being pulled out to the four corners of the square plate-shaped portion. ing. The package 1 can be fixed to the mounting substrate 25 by screwing the package 1 to the mounting substrate 25 with the screw holes. In the present embodiment, the mounting area means an area overlapping with the optical element 3 when the substrate 5 is viewed in plan.

As an exemplary size of the base body 5, a square plate-shaped portion, for example, a side of 5 mm or more and 50 m
m or less can be set. Moreover, as thickness of the base | substrate 5, it can set to 0.2 mm or more and 2 mm or less, for example.

  In the present embodiment, the mounting area is formed at the center of the upper surface. However, since the area where the optical element 3 is mounted is used as the mounting area, for example, the mounting area is formed at the end of the upper surface of the base 5. No problem. Moreover, although the base | substrate 5 of this embodiment has one mounting area | region, the base | substrate 5 may have a some mounting area | region and the optical element 3 may be mounted in each mounting area | region.

  The optical element 3 is disposed in the mounting region on the upper surface of the base 5. Signals can be input / output between the optical element 3 and an external electric circuit (not shown) via the input / output terminal 15 or the like. As described above, since the optical element 3 is disposed on the upper surface of the base body 5, the base body 5 is required to have high insulation properties at least in a portion where the optical element 3 is disposed. . The substrate 5 in the present embodiment is manufactured by laminating a plurality of insulating members. Then, the optical element 3 is mounted on the mounting region of the substrate 5. Examples of the insulating member include a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body, or a glass ceramic. Materials can be used.

  A mixing member is prepared by mixing the raw material powder containing these glass powder and ceramic powder, an organic solvent, and a binder. A plurality of ceramic green sheets are produced by forming the mixed member into a sheet. A plurality of laminated bodies are produced by laminating the produced ceramic green sheets. The base body 5 is produced by integrally firing a plurality of laminated bodies at a temperature of about 1600 degrees. The base 5 is not limited to a configuration in which a plurality of insulating members are stacked. The base 5 may be composed of one insulating member.

  In addition, the optical element 3 may be directly mounted on the upper surface of the base 5, but for mounting the optical element 3 disposed on the mounting region of the base 5 as in the package 1 of the present embodiment. A mounting substrate 17 may be provided, and the optical element 3 may be mounted on the mounting substrate 17. As the mounting substrate 17, it is preferable to use a member having good insulating properties like the insulating member. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, and an aluminum nitride sintered body are used. A ceramic material such as a sintered body and a silicon nitride-based sintered body, or a glass ceramic material can be used.

  The package 1 of the present embodiment includes a frame body 7 provided on the upper surface of the base body 5 so as to surround the mounting region. As the frame body 7, for example, in the same manner as the base body 5, for example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body are used. Such ceramic materials or glass ceramic materials can be used.

  In addition to a member having good insulating properties, for example, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used. The metal member constituting the frame body 7 can be manufactured by subjecting such an ingot of the metal member to a metal processing method such as a rolling method or a punching method. Further, the frame body 7 may be composed of one member, but may be a laminated structure of a plurality of members.

  The package 1 of this embodiment includes a bonding material that is positioned between the base body 5 and the frame body 7 and that bonds the base body 5 and the frame body 7. As the bonding material, for example, a brazing material can be used. Exemplary brazing materials include silver brazing.

  The frame 7 in the present embodiment has an opening (first opening) that opens to the inner peripheral surface and the outer peripheral surface. The first opening has a shape of a through hole that opens on the inner peripheral surface and the outer peripheral surface of the frame body 7. A holding member 9 is inserted and fixed in the first opening. More specifically, the holding member 9 is fixed to the frame body 7 so that one end is located inside the frame body 7 and the other end is located outside the frame body 7.

  The holding member 9 has through holes that open to the inside and the outside of the region surrounded by the frame body 7. The holding member 9 is a member for holding and fixing the optical fiber. The holding member 9 in the present embodiment fixes and positions the optical fiber, and is cylindrical so that light can be transmitted between the optical semiconductor element 3 and the optical fiber by the cylindrical hollow portion. It can be carried out.

  The holding member 9 is located below the cylindrical main body 11 inserted into the first opening and the main body 11, and the lower end is joined to the upper surface of the base 5 inside the area surrounded by the frame body 7. It has the some main body support part 13 joined by the member. The plurality of main body support portions 13 are arranged side by side so that at least a part of each of the main body support portions 13 overlaps along the penetration direction of the through hole. Each main body support portion 13 has a shape that is longer in the direction perpendicular to the through direction than in the direction parallel to the through direction of the through hole when viewed in plan. Since the plurality of main body support portions 13 arranged side by side are provided in this manner, as described above, it is possible to stably position the end portions located inside the region surrounded by the frame body 7. .

  Furthermore, since the width D1 in the direction perpendicular to the penetration direction of the through hole at the lower end of the main body support portion 13 is smaller than the width D2 in the direction perpendicular to the penetration direction of the through hole in the main body portion 11, the body support portion 13 is By bonding the upper surface of the base body 5 using a bonding member, the position of the main body support portion 13 relative to the base body 5 can be fixed. Exemplary sizes of the main body 11 include an inner diameter of about 1.5 to 8 mm, an outer diameter D2 of about 3 to 10 mm, and a length in a direction parallel to the through direction of the through hole of about 2 to 25 mm. It can be. Exemplary sizes of the main body support 13 include a width in the direction parallel to the through direction of the through hole of about 1 to 3 mm, and a width D1 in the direction perpendicular to the through direction of the through hole of about 2.5 to 9 mm. can do.

  The main body 11 may have a cylindrical shape as shown in FIG. 2, or an inner peripheral surface may have a cylindrical shape and an outer peripheral surface may have a quadrangular prism shape as shown in FIGS. The main body support portion 13 only needs to be positioned between the main body portion 11 and the base body 5 to support the main body portion 11. For this reason, it is not necessary that the entire main body support portion 13 is positioned strictly below the lower end of the main body portion 11.

  For example, when the main body 11 has a cylindrical shape as shown in FIG. 2, if the main body 11 is supported by being positioned between the main body 11 and the base body 5, a part of the main body support 13 is the main body. It may be located on the side of the part 11. Moreover, it is preferable that the lower end of the main body support part 13 is a flat surface as shown in the figure. This is because when the lower end of the main body support portion 13 is a flat surface, the main body support portion 13 can be more stably fixed to the base body 5.

  As shown in FIG. 3, it is preferable that at least a part of each of the plurality of main body support portions 13 is located below the central axis Y of the through hole. Since the main body support portion 13 supports the main body portion 11, the holding member 9 is stably positioned with respect to the base body 5. Thereby, when the optical fiber is fixed to the optical fiber holding member 9, the optical coupling to the optical element 3 can be improved. In order to achieve good optical coupling by aligning the optical axes of the optical fiber and the optical element 3, at least each of the plurality of main body support portions 13 below the central axis Y of the through hole corresponding to the position of the optical axis. It is preferable that a part is located.

  More specifically, the plurality of main body support portions 13 can be stably positioned with respect to the base body 5 as described above by being positioned so as to sandwich the central axis Y of the through hole therebetween. Therefore, as shown in FIGS. 4 to 7, even if the plurality of main body support portions 13 are not located below the central axis Y of the through-holes, these main body support portions 13 have the central axis Y of the through-holes therebetween. When they are positioned so as to be sandwiched, they can be stably positioned with respect to the base 5.

  In addition, when at least a part of each is located below the central axis Y of the through hole, as shown in FIG. 3, one of the plurality of main body support portions 13 serves as the central axis of the through hole in the main body portion 11. It is preferable that one side of two side surfaces parallel to each other does not overlap vertically and the other one of the plurality of main body support portions 13 does not overlap vertically with the other side of the two side surfaces.

  As described above, when the plurality of main body support portions 13 are arranged so as to be staggered with respect to two side surfaces parallel to the central axis of the through hole in the main body portion 11, the upper surface of the base body 5. When seen in a plan view, the joining member can be easily spread out on the diagonal line of the portion that is vertically overlapped with the region surrounded by the main body support portion 13 and the two side surfaces. Therefore, it becomes easy to fix the plurality of main body support portions 13 to the base body 5 more stably.

  Moreover, it is preferable that one of the plurality of main body support portions 13 is located below an end portion located inside the region surrounded by the frame body 7 in the main body portion 11. As described above, the optical fiber and the optical element 3 are optically coupled by fixing the optical fiber to the optical fiber holding member 9. In order to make this optical coupling highly accurate, it is particularly required to suppress a positional shift of the optical fiber holding member 9 at a position closest to the optical element 3.

  As shown in FIGS. 4 and 5, one of the plurality of main body support portions 13 is formed below the end portion located inside the region surrounded by the frame body 7 in the main body portion 11, thereby The positional shift of the optical fiber holding member 9 closest to the optical element 3 can be further suppressed.

  As shown in FIGS. 2 and 3, the main body support portion 13 may have a constant width in the direction perpendicular to the through direction of the through hole. However, as shown in FIGS. Also, it is preferable that the width in the direction perpendicular to the penetrating direction of the through hole is reduced from the upper end to the lower end in the lower portion. A joining member that joins the main body support portion 13 to the base 5 is joined to the lower end portion including the lower surface of the main body support portion 13.

  At this time, as the width in the direction perpendicular to the through direction of the through hole at the lower end of the main body support portion 13 is smaller, it becomes easier for the joining member to spread out. When the main body support portion 13 has the above-described configuration, the surface of the main body support portion 13 to the main body portion 11 can be enlarged so that the main body portion 11 can be stably held by the main body support portion 13. It is possible to further facilitate the spreading of the member. Furthermore, the stress caused by the difference in thermal expansion coefficient between the base 5 and the main body support portion 13 can be reduced as the width in the direction perpendicular to the through direction of the through hole at the lower end of the main body support portion 13 is reduced. Cracks and peeling at the joint between the substrate 5 and the main body support 13 can be suppressed.

  The holding member 9 preferably has a strength at least enough to fix the optical fiber. Specifically, metal members such as iron, copper, nickel, chromium, cobalt, and tungsten, or alloys made of these metals can be used. The cylindrical holding member 9 can be produced by subjecting such an ingot of a metal member to a metal processing method such as a rolling method or a punching method.

In particular, the frame body 7 and the holding member 9 are preferably formed using the same metal member. This is because the difference in thermal expansion between the frame body 7 and the holding member 9 can be reduced, so that the stress generated between the frame body 7 and the holding member 9 can be reduced.

  The joining member is a member for joining the input / output terminal 15 to the base 5. As the joining member, for example, a metal member such as a brazing material can be used. Exemplary brazing materials include silver brazing.

  When using the package 1 of the present embodiment, the ferrule is fixed to the other end of the holding member 9. The ferrule has a through hole whose one end opens with respect to the through hole of the holding member 9. An optical fiber is inserted and fixed in the through hole of the ferrule. As described above, the ferrule is inserted and fixed to the holding member 9 so that the optical coupling between the optical fiber and the semiconductor element can be performed.

  As the ferrule, for example, a ceramic material such as zirconia or alumina can be used. As the optical fiber, a light-transmitting material such as quartz glass can be used. In addition, although the ferrule in this embodiment is being fixed to the internal peripheral surface of the cylindrical holding member 9, it is not restricted to this. For example, you may fix by joining a ferrule to the end surface of the other end part of the holding member 9.

  The frame body 7 in the package 1 of the present embodiment has a second opening separately from the first opening. An input / output terminal 15 is inserted and fixed in the second opening. Similar to the first opening, the second opening may have a shape of a through-hole penetrating from the inner peripheral surface to the outer peripheral surface. However, the second opening is on the lower surface side where the frame 7 is joined to the base body 5. In addition, a shape that partially opens between the substrate and the frame body 7 on the inner peripheral side and the outer peripheral side of the frame body 7 may be employed.

  The input / output terminal 15 includes an insulating member 19 and a plurality of wiring conductors 21 disposed on the upper surface of the insulating member 19. Signals can be input and output between the optical semiconductor element 3 and an external electric circuit (not shown) via these wiring conductors 21. Thus, since the wiring conductor 21 is disposed on the upper surface of the insulating member 19, the insulating member 19 is required to have high insulating properties. As an exemplary size of the insulating member 19, a square plate-shaped member having a side of about 1 to 20 mm and a thickness of about 0.5 to 2 mm when viewed in plan can be used.

  As the insulating member 19, like the insulating substrate, for example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body are used. A ceramic material or a glass ceramic material can be used. As the wiring conductor 21, it is preferable to use a member having good conductivity. Specifically, a metal material such as tungsten, molybdenum, nickel, copper, silver, and gold can be used as the wiring conductor 21. The above metal materials may be used alone or as an alloy.

  The optical semiconductor device 101 according to the present embodiment seals the optical semiconductor element 3 bonded to the package 1, the optical semiconductor element 3 mounted on the mounting region of the base body 5, and the frame body 7 as represented by the above-described form. And a lid 23 made of metal for stopping. Further, in the optical semiconductor device 101 of the present embodiment, the package 1 is fixed to the mounting substrate 25 with screws in the screw holes provided in the base 5.

The package 1 is screwed and fixed to the mounting substrate 25 in the screwing holes of the base 5. In the semiconductor device of this embodiment, the optical element 3 is mounted in the mounting region of the substrate. The optical element 3 is connected to the wiring conductor 21 by a bonding wire 27. A desired output can be obtained from the optical element 3 by inputting an external signal to the optical element 3 from an external electric circuit (not shown). Examples of the optical element 3 include a light emitting element 3 that emits light to an optical fiber, represented by an LD element, and a light receiving element 3 that receives light to the optical fiber, represented by a PD element. .

  The lid body 23 is bonded to the frame body 7 and is provided so as to seal the optical element 3. The lid body 23 is joined to the upper surface of the frame body 7. The optical element 3 is sealed in a space surrounded by the base body 5, the frame body 7, and the lid body 23. By sealing the optical element 3 in this way, deterioration of the optical element 3 due to the long-term use of the package 1 can be suppressed.

  As the lid 23, for example, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used. The frame body 7 and the lid body 23 can be joined by, for example, a seam welding method. Further, the frame body 7 and the lid body 23 may be joined using, for example, gold-tin solder.

  The optical semiconductor element housing package 1 and the optical semiconductor device 101 including the optical semiconductor element storage package 1 according to an embodiment of the present invention have been described above, but the present invention is not limited to the above-described embodiment. In other words, various modifications and combinations of embodiments may be made without departing from the scope of the present invention.

1 ... Package for optical semiconductor element storage (package)
DESCRIPTION OF SYMBOLS 101 ... Optical semiconductor device 3 ... Optical semiconductor element (optical element)
5 ... Base 7 ... Frame 9 ... Optical fiber holding member (holding member)
DESCRIPTION OF SYMBOLS 11 ... Main-body part 13 ... Main-body support part 15 ... Input / output terminal 17 ... Mounting board 19 ... Insulating member 21 ... Wiring conductor 23 ... Cover 25 ... Mounting board 27: Bonding wire

Claims (6)

A substrate having a mounting region for mounting an optical semiconductor element on the upper surface;
A frame body provided on the upper surface of the base body so as to surround the mounting region, and having an opening that opens to an inner peripheral surface and an outer peripheral surface;
An optical fiber holding member inserted into the opening, and having through holes that open to the inside and outside of the region surrounded by the frame,
The optical fiber holding member is a cylindrical main body portion inserted into the opening, and is positioned below the main body portion, and a lower end of the optical fiber holding member is joined to the upper surface of the base body in an area surrounded by the frame body. Having a plurality of body support parts joined by
The optical semiconductor element housing, wherein a width of the main body support portion in a direction perpendicular to the through direction of the through hole is smaller than a width of the main body portion in a direction perpendicular to the through direction of the through hole. For package.   2. The optical semiconductor element storage package according to claim 1, wherein at least a part of each of the plurality of main body support portions is located below a central axis of the through hole.   2. The optical semiconductor according to claim 1, wherein one of the plurality of main body support portions is located below an end portion of the main body portion that is located inside a region surrounded by the frame body. Package for element storage.   The width of the main body support portion in a direction perpendicular to the penetrating direction of the through hole decreases from an upper end to a lower end in a portion located below the lower end portion of the main body portion. The package for storing an optical semiconductor element according to 1.   The package for housing an optical semiconductor element according to claim 1, wherein the lower end of the main body support portion is a flat surface. A package for housing an optical semiconductor element according to any one of claims 1 to 5;
An optical semiconductor element mounted in the mounting region;
An optical semiconductor device comprising: a lid made of metal and encapsulating the optical semiconductor element joined to the frame.

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