JP2013012592A - Package for housing elements and module including the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a package for housing elements having good durability.SOLUTION: A package for housing elements 1 includes: a substrate 5 having a mounting region 5a for mounting a semiconductor element 3 on an upper surface; a frame body 7 provided on an upper surface of the substrate 5 so as to enclose the mounting region 5a and having a pair of openings 7a opening on an inner peripheral surface and an outer peripheral surface; and a pair of input and output terminals 13 respectively inserted into the pair of openings 7a. The substrate 5 has: a pair of hole parts 15 formed on the upper surface so as to include a region in a region enclosed by the frame body 7 which overlaps with the pair of input and output terminals 13 in a plain view; and a groove part 17 formed on the upper surface so as to connect the pair of hole parts 15 with each other.

Description

  The present invention relates to an element storage package for storing an electronic component such as a semiconductor element and a module including the same. Such an element storage package is used in various electronic devices.

  As an element storage package for storing semiconductor elements, for example, an optical semiconductor element storage package described in Patent Document 1 is known. The package described in Patent Document 1 includes a base body, a frame body made of metal having a through hole formed in a side portion, and an input / output terminal fitted in the through hole. In the optical semiconductor device using such a package, high-frequency signals are input / output between the optical semiconductor element and the external electric circuit board through wiring conductors of the input / output terminals.

  However, in the package described in Patent Document 1, the base and the frame are made of a metal member, while the input / output terminals are made of a ceramic member. Therefore, a thermal stress caused by a difference between the thermal expansion coefficient of the frame and the thermal expansion coefficient of the input / output terminals is generated during the manufacture or use of the package. When this thermal stress is concentrated on a specific region of the base body or the frame body, the durability of the base body and the frame body may be lowered.

  Patent Document 2 describes an element storage container in which a groove is formed on the upper surface of a substrate along the inner surface of a frame. Since the base is easily deformed by having such grooves, it is possible to prevent the thermal stress from being dispersed over a wide range and concentrated in a specific region.

JP 2002-368322 A JP 2002-134763 A

  When the groove described in Patent Document 2 is used in the package described in Patent Document 1, since the groove is formed on the upper surface of the substrate along the input / output terminals, the substrate is aligned in a direction parallel to the attachment direction of the input / output terminals. Becomes easy to bend. However, since the groove is formed on the upper surface of the base body along the input / output terminals, the base body is unlikely to bend in a direction perpendicular to the attachment direction of the input / output terminals and parallel to the upper surface of the base body. Therefore, it is required to improve the durability of the substrate against the thermal stress applied in the latter direction.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an element storage package with improved durability by making the substrate easy to deform.

An element storage package according to an aspect of the present invention includes a base having a mounting region for mounting a semiconductor element on an upper surface, and an inner peripheral surface provided on the upper surface of the base so as to surround the mounting region. A frame having a pair of openings that open to the inner peripheral surface and the outer peripheral surface, respectively, and a first insulating member and an upper surface of the first insulating member respectively inserted into the pair of openings. And a pair of input / output terminals having at least one wiring conductor. A pair of holes formed on the upper surface so as to include at least a region overlapping with the pair of input / output terminals in a region surrounded by the frame when viewed in plan, It has the groove part formed in the upper surface so that a hole part may be connected, It is characterized by the above-mentioned.

  In the element housing package according to the above aspect, since the hole portion is provided, the base body is easily bent in a direction parallel to the insertion direction of the input / output terminals. Further, since the groove portion is provided in addition to the hole portion, the substrate is easily curved in a direction parallel to the upper surface of the substrate and perpendicular to the input / output terminal insertion direction. Thus, it is easy to bend in both the direction parallel to the upper surface of the substrate and parallel to the insertion direction of the input / output terminals and the direction perpendicular thereto. As a result, the base body is easily deformed in an arbitrary direction parallel to the upper surface, so that the durability of the package can be improved.

It is a disassembled perspective view which shows the element storage package and module concerning the 1st Embodiment of this invention. FIG. 2 is a plan view of the element storage package shown in FIG. 1. It is XX sectional drawing of the element storage package shown in FIG. It is an expanded sectional view which shows the area | region A of the element storage package shown in FIG.

  Hereinafter, an element storage package and a module including the same according to an embodiment of the present invention will be described in detail with reference to the drawings. However, each drawing referred to below shows only the main members necessary for explaining the present embodiment in a simplified manner for convenience of explanation. Therefore, the element storage package according to the present invention can include arbitrary constituent members not shown in the drawings referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

  As shown in FIGS. 1 to 4, an element storage package 1 (hereinafter also simply referred to as a package 1) according to the present embodiment includes a base 5 having a mounting area 5 a for mounting a semiconductor element 3 on the upper surface, and a mounting. A frame body 7 provided on the upper surface of the base 5 so as to surround the region 5a and having a pair of openings 7a that open to the inner peripheral surface and the outer peripheral surface at positions facing the inner peripheral surface, respectively, and a pair of openings 7a And a pair of input / output terminals 13 having at least one wiring conductor 11 disposed on the upper surface of the first insulating member 9. . When the base 5 is viewed in plan, a pair of hole portions 15 formed on the upper surface so as to include an area overlapping with at least the pair of input / output terminals 13 in the area surrounded by the frame body 7, and a pair of It has a groove portion 17 formed on the upper surface so as to connect the hole portion 15.

  Thus, since the package 1 of the present embodiment has the hole portion 15 described above, the base 5 is curved in a direction parallel to the insertion direction of the input / output terminal 13 (left and right direction in FIG. 3). Easy to do. Further, since the groove portion 17 is provided in addition to the hole portion 15, the groove portion 17 is also parallel to the upper surface of the base 5 and perpendicular to the insertion direction of the input / output terminal 13 (up and down direction in FIG. 3). The substrate 5 is easily bent. Thus, it is easy to bend in both the direction parallel to the upper surface of the substrate 5 and parallel to the insertion direction of the input / output terminal 13 and the direction perpendicular thereto. Therefore, the base body 5 is easily deformed in an arbitrary direction parallel to the upper surface, so that the durability of the package 1 can be improved.

  Further, the module 101 of this embodiment includes a lid for sealing the semiconductor element 3 bonded to the element housing package 1, the semiconductor element 3 mounted on the mounting region 5 a of the base 5, and the frame body 7. And a body 103. In the module 101 of the present embodiment, since the above-described highly durable package 1 is used, it can be made highly durable.

  The base body 5 in the present embodiment has a substantially square plate shape, and has a mounting area 5a on which the semiconductor element 3 is mounted on the main surface. Specifically, the base body 5 in this embodiment has a shape having a square plate-shaped portion and a portion in which the screw hole 19 is formed by being pulled out to the four corners of the square plate-shaped portion. It has become. The package 1 can be fixed to the mounting substrate by screwing the package 1 to the mounting substrate (not shown) with the screw holes 19.

  For example, when the package 1 is fixed to the mounting board by the screwing holes 19 as described above, the stress associated with the screwing is applied to the base 5. When the package 1 is difficult to deform, the stress may concentrate on a part of the base 5 and a crack may occur in the base 5. However, since the base body 5 in the present embodiment has the hole portion 15 and the groove portion 17, the base body 5 is easily deformed, and the possibility that the base body 5 is cracked can be reduced.

  When the base 5 has a flat plate shape, the size of the square plate portion can be set to, for example, 5 mm to 50 mm on a side. Moreover, as thickness of the base | substrate 5, it can set to 0.2 mm or more and 2 mm or less, for example.

  The base body 5 in the package 1 of the present embodiment has a pair of upper surfaces formed so as to include an area overlapping with at least the pair of input / output terminals 13 in the area surrounded by the frame body 7 in plan view. It has a hole 15. Since the hole portion 15 is provided, the base 5 can be easily bent in a direction parallel to the insertion direction of the input / output terminal 13.

  Further, as will be described later, the pair of input / output terminals 13 positioned above the pair of hole portions 15 can be joined to the base 5 via a brazing material. When joining to the base 5, the brazing material may protrude from the joint between the input / output terminal 13 and the base 5. However, even in such a case, the pair of hole portions 15 are formed on the upper surface of the base 5 so as to include a region overlapping at least the pair of input / output terminals 13 in the region surrounded by the frame body 7. Therefore, the hole 15 can be used as a brazing material reservoir. Thereby, it can suppress that a brazing material flows into the unexpected position.

  The shape of the hole 15 is not particularly limited as long as the base 5 is easily bent in a direction parallel to the insertion direction of the input / output terminal 13. For example, it can be set as the shape which has a side surface and a bottom face like the hole 15 of this embodiment. The depth of the hole 15 is preferably 10 to 50% with respect to the thickest portion of the substrate 5. By being 10% or more, the base body 5 can be easily bent in a direction parallel to the insertion direction of the input / output terminal 13. Moreover, when the depth of the hole 15 is 50% or less with respect to the thickness of the base body 5, a sufficient thickness of the base body 5 can be secured also in the hole portion 15. As a result, it is possible to suppress the durability of the base body 5 from being excessively lowered.

  In addition, in a cross section parallel to the insertion direction of the input / output terminal 13 and perpendicular to the upper surface of the base body 5, it is preferable that a concave curved surface is formed between the side surface and the bottom surface of the hole portion 15. As already shown, since the base body 5 has the hole 15, the base body 5 is easily bent in a direction parallel to the insertion direction of the input / output terminal 13, but the base body 5 is curved in this way. The stress is easily concentrated between the side surface and the bottom surface of the hole portion 15. However, in the case where the space between the side surface and the bottom surface of the hole portion 15 is a concave curved surface, the strength of the hole portion 15 can be increased, so that a crack may occur between the side surface and the bottom surface of the hole portion 15. It is because it can be made small.

In addition, regarding the pair of holes 15, it is preferable that the depth of each hole 15 and the width in the direction parallel to the insertion direction of the input / output terminal 13 are equal. If the variation in the depth and width of the hole 15 is large, stress tends to concentrate on a part of the base 5 when the base 5 is curved in a direction parallel to the insertion direction of the input / output terminal 13. This is because the above-described stress concentration can be suppressed when the depth and width of 15 are equal. As a result, the durability of the substrate 5 can be improved.

  Further, the package 1 in the present embodiment has a groove portion 17 formed on the upper surface so as to connect the pair of hole portions 15. By having such a groove portion 17, the base body 5 is easily curved in a direction parallel to the upper surface of the base body 5 and perpendicular to the insertion direction of the input / output terminals 13. The shape of the groove portion 17 is not particularly limited as long as it is a shape that is parallel to the upper surface of the base body 5 and is easily bent in the direction perpendicular to the insertion direction of the input / output terminals 13. For example, it can be made into the shape which has a side surface and a bottom face like the groove part 17 in this embodiment.

  The depth of the groove portion 17 is preferably 10 to 40% with respect to the thickest portion of the substrate 5. By being 10% or more, the base body 5 can be easily bent in a direction perpendicular to the insertion direction of the input / output terminal 13. Further, since the depth of the groove portion 17 is 40% or less with respect to the thickness of the base body 5, a sufficient thickness of the base body 5 can be secured also in the groove portion 17. As a result, it is possible to suppress the durability of the base body 5 from being excessively lowered.

  At this time, similarly to the hole 15 in the cross section perpendicular to the insertion direction of the input / output terminal 13 and perpendicular to the top surface of the substrate 5, the side surface and the bottom surface of the groove portion 17 in the cross section perpendicular to the insertion direction of the input / output terminal 13. The gap is preferably a concave curved surface shape. As already shown, since the base 5 has the groove portion 17, the base 5 is easily bent in a direction parallel to the insertion direction of the input / output terminal 13 and perpendicular to the upper surface of the base 5. When curved in this way, stress tends to concentrate between the side surface and the bottom surface of the groove portion 17. However, since the strength of the groove portion 17 can be increased when the space between the side surface and the bottom surface of the groove portion 17 is a concave curved surface, the possibility of occurrence of cracks between the side surface and the bottom surface of the groove portion 17 can be reduced. Because.

  Further, it is preferable that the thickness D1 of the base 5 at the bottom of the groove 17 is larger than the thickness D2 of the base 5 at the bottom of the hole 15 and the bottom of the groove 17 is higher than the bottom of the hole 15. As described above, when the pair of input / output terminals 13 are joined to the base body 5 via the brazing material, the hole 15 can be used as a brazing material reservoir. When the bottom portion of the groove portion 17 is lower than the bottom portion of the hole portion 15, the brazing material accumulated in the hole portion 15 may flow into the groove portion 17. When the brazing material flows into the groove portion 17, the brazing material spreads over a wide range, so that the bondability between the pair of input / output terminals 13 and the base body 5 may be lowered. However, when the bottom portion of the groove portion 17 is located higher than the bottom portion of the hole portion 15 as in the base body 5 in this embodiment, the possibility that the brazing material flows into the groove portion 17 can be reduced. The bondability between the output terminal 13 and the substrate 5 can be kept good.

  The thickness D1 is not particularly limited as long as it is larger than the thickness D2, but it is particularly preferable that the thickness D1 is 1.1 times or more the thickness D2. This is because the possibility that the brazing material flows into the groove portion 17 can be reduced more reliably. Moreover, it is preferable that thickness D1 is 2 times or less of thickness D2. If the difference between the thickness D1 and the thickness D2 becomes too large, the base body 5 tends to bend in a direction parallel to the insertion direction of the input / output terminal 13, while the base body 5 extends in a direction perpendicular to the insertion direction of the input / output terminal 13. It becomes difficult to bend. When the thickness D1 is less than or equal to twice the thickness D2, the base body 5 is likely to bend in a direction parallel to and perpendicular to the insertion direction of the input / output terminal 13, so that stress is concentrated on a specific region of the base body 5. Can be prevented.

Further, when the groove portion 17 and the hole portion 15 are configured as described above, the bondability between the pair of input / output terminals 13 and the base body 5 by the brazing material can be kept good, while at the bottom portion of the groove portion 17. Since the thickness D1 of the base body 5 is larger than the thickness D2 of the base body 5 at the bottom of the hole 15, the base body is parallel to the top surface of the base body 5 by the groove 17 and perpendicular to the insertion direction of the input / output terminal 13. The curvature of 5 may be reduced. Therefore, in such a case, it is preferable that two or more groove portions 17 are formed while two pairs of hole portions 15 are formed.

  Further, it is preferable that the width W1 of the groove portion 17 is smaller than the width W2 of the hole portion 15. In the present embodiment, the width of the groove portion 17 means a width in a direction perpendicular to the insertion direction of the input / output terminal 13. The width of the hole 15 means a width in a direction parallel to the insertion direction of the input / output terminal 13. As described above, when the brazing material flows into the groove portion 17, the brazing material spreads over a wide range, so that the bondability of the pair of input / output terminals 13 to the base body 5 may be reduced. However, when the width W1 of the groove portion 17 is smaller than the width W2 of the hole portion 15, even if the brazing material flows into the groove portion 17, the amount of brazing material flowing into the groove portion 17 can be reduced. The bondability of the output terminal 13 to the substrate 5 can be improved. Specifically, it is preferable that the largest portion in the width W2 of the hole portion 15 is about 1.2 to 5 times the largest portion in the width W1 of the groove portion 17.

  Further, as in the package 1 of the present embodiment, it is preferable that the base 5 has a plurality of groove portions 17 and each groove portion 17 is formed in a straight line parallel to each other. This is because the base body 5 has a plurality of groove portions 17 so that the base body 5 is more easily curved in a direction parallel to the upper surface of the base body 5 and perpendicular to the insertion direction of the input / output terminal 13. Furthermore, since each groove part 17 is formed in a straight line in parallel with each other, it is possible to suppress stress concentration in a specific region of the groove part 17, thereby suppressing the occurrence of cracks in the groove part 17 and the substrate 5. The durability of can be improved.

  Further, when a plurality of groove portions 17 are provided, it is preferable that the depth of each groove portion 17 and the width in the direction perpendicular to the insertion direction of the input / output terminal 13 are equal. If the variation in the depth and width of the groove portion 17 is large, stress tends to concentrate on a part of the base body 5 when the base body 5 is curved in a direction perpendicular to the insertion direction of the input / output terminal 13. This is because the stress concentration can be suppressed when the depth and the width are equal. As a result, the durability of the substrate 5 can be improved.

  In the present embodiment, the mounting region 5a means a region overlapping with the semiconductor element 3 when the base 5 is viewed in plan. In the package 1 of the present embodiment, the mounting region 5a is formed at the center of the main surface. However, since the region where the semiconductor element 3 is mounted is the mounting region 5a, for example, the end of the main surface of the base 5 There is no problem even if the mounting region 5a is formed in the part. Further, the base body 5 of the present embodiment has one mounting area 5a, but the base body 5 may have a plurality of mounting areas 5a, and the semiconductor element 3 may be mounted in each of the mounting areas 5a.

  When the mounting area 5a is located between the pair of input / output terminals 13, it is preferable that the plurality of groove portions 17 be formed so as to sandwich the mounting area 5a therebetween. In order to stably mount the semiconductor element 3 on the mounting area 5a of the base body 5, it is preferable that the mounting area 5a is as flat as possible. Since the base body 5 is easily curved in the groove portion 17, the portion of the upper surface of the base body 5 sandwiched between the groove portions 17 tends to be a relatively flat surface. When the plurality of groove portions 17 are formed so as to sandwich the mounting region 5a therebetween, in other words, when the mounting region 5a is positioned so as to be sandwiched between the plurality of groove portions 17, the mounting region 5a becomes a flat surface. Therefore, the semiconductor element 3 can be stably mounted on the mounting region 5a of the base body 5.

In the module 101 of the present embodiment, the semiconductor element 3 is disposed in the mounting region 5 a on the main surface of the base body 5. The semiconductor element 3 and an external electric circuit (via the input / output terminal 13 etc.
Signals can be input / output to / from (not shown). As the semiconductor element 3, for example, an optical semiconductor element 3, specifically, a light emitting element that emits light to an optical fiber, represented by an LD element, and a light that is emitted to an optical fiber, represented by a PD element. Examples include a light receiving element that receives light. When the optical semiconductor element 3 is used as the semiconductor element 3, the module 101 can be used as the optical module 101.

  When the semiconductor element 3 is disposed directly on the main surface of the base body 5, the base body 5 is required to have high insulation properties at least in a portion where the semiconductor element 3 is disposed. The base 5 according to the present embodiment includes an insulating substrate having high insulating properties. Then, the semiconductor element 3 is mounted on the mounting region 5 a of the base body 5. Examples of the insulating substrate include an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, a ceramic material such as an aluminum nitride sintered body and a silicon nitride sintered body, or a glass ceramic. Materials can be used.

  A mixing member is prepared by mixing the raw material powder containing these glass powder and ceramic powder, an organic solvent, and a binder. A plurality of ceramic green sheets are produced by forming the mixed member into a sheet. An insulating substrate is produced by integrally firing the produced ceramic green sheets at a temperature of about 1600 degrees. Note that the insulating substrate is not limited to the configuration formed by one insulating member. The structure by which the some insulating member was laminated | stacked may be sufficient.

  Further, the semiconductor element 3 may be directly mounted on the upper surface of the base body 5, but for mounting the semiconductor element 3 disposed on the mounting region 5 a of the base body 5 as in the package 1 of the present embodiment. The semiconductor element 3 may be mounted on the mounting substrate 21 as the module 101. As the mounting substrate 21, it is preferable to use a member having good insulating properties like the insulating member. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, and an aluminum nitride sintered body are used. A ceramic material such as a sintered body and a silicon nitride-based sintered body, or a glass ceramic material can be used.

  When such a mounting substrate 21 is provided, a metal member such as iron, copper, nickel, chromium, cobalt and tungsten, or an alloy made of these metals is used as the base 5 instead of an insulating member. You can also.

  In the case where the mounting substrate 21 is provided, in order to improve the bonding property of the mounting substrate 21 to the base body 5, the plurality of groove portions 17 are formed so as to sandwich the mounting substrate 21 therebetween. Is preferred. The plurality of groove portions 17 are formed so as to sandwich the mounting substrate 21 therebetween. In other words, when the mounting substrate 21 is positioned so as to be sandwiched between the plurality of groove portions 17, the mounting substrate 21 on the upper surface of the base 5 is Since the portion to be disposed can be a relatively flat surface, the mounting substrate 21 can be stably disposed on the upper surface of the base 5.

  The package 1 of this embodiment includes a frame body 7 provided on the upper surface of the base 5 so as to surround the mounting area 5a. As the frame 7, for example, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used. The metal member constituting the frame body 7 can be manufactured by subjecting such an ingot of the metal member to a metal processing method such as a rolling method or a punching method. Further, the frame body 7 may be composed of one member, but may have a structure formed by joining a plurality of members.

The element storage package 1 of this embodiment includes a joining member (not shown) that is located between the base body 5 and the frame body 7 and joins the base body 5 and the frame body 7. For example, a brazing material can be used as the joining member. An exemplary brazing material includes AuSn brazing. Moreover, when the base body 5 and the frame body 7 are made of metal members, they may be joined after being formed separately, but they may be integrally formed.

  Further, the frame body 7 has through holes that open to the inner and outer peripheral surfaces thereof. The through hole can be formed in the frame body 7 by, for example, drilling. A cylindrical fixing member 23 is fixed to the through hole. The fixing member 23 is fixed to the through hole by inserting one end portion into the through hole and joining to the surface of the through hole. The cylindrical fixing member 23 is a member for fixing the signal input / output member such as an optical fiber or the ferrule 25 for positioning. In addition, since the fixing member 23 is cylindrical, light can be transmitted between the semiconductor element 3 and the signal input / output member (optical fiber) through the cylindrical hollow portion.

  The fixing member 23 preferably has a strength sufficient to fix at least the signal input / output member. Specifically, metal members such as stainless steel, iron, copper, nickel, chromium, cobalt, and tungsten, or alloys made of these metals can be used. The cylindrical fixing member 23 can be produced by subjecting such an ingot of a metal member to a metal processing method such as a rolling method or a punching method.

  The fixing member 23 can be fixed to the frame body 7 by joining the frame body 7 with a brazing material. As the brazing material, for example, AuSn can be used. Further, the fixing member 23 may be fixed to the frame body 7 by welding the fixing member 23 to the frame body 7.

  When using the module 101 of this embodiment, the ferrule 25 is fixed to the other end of the fixing member 23. The ferrule 25 has a through hole whose one end opens to the inside of the cylinder of the fixing member 23. Then, an optical fiber is inserted and fixed in this through hole. Thus, the optical coupling between the optical fiber and the semiconductor element 3 can be performed by inserting and fixing the ferrule 25 to the fixing member 23.

  As the ferrule 25, for example, a ceramic material such as zirconia or alumina can be used. As the optical fiber, a light-transmitting material such as quartz glass can be used. In addition, although the ferrule 25 in this embodiment is being fixed to the internal peripheral surface of the cylindrical fixing member 23, it is not restricted to this. For example, you may fix by joining the ferrule 25 to the end surface of the other end part of the fixing member 23.

  Moreover, the frame 7 has a pair of opening part 7a opened to an internal peripheral surface and an outer peripheral surface in the position which an internal peripheral surface opposes, respectively. The opening 7a may have a shape penetrating so as to open to the inner peripheral surface and the outer peripheral surface in the same manner as the above-described through-hole, but as shown in FIGS. In addition, a shape that partially opens between the substrate and the frame body 7 on the inner peripheral side and the outer peripheral side of the frame body 7 may be employed. And between the base | substrate 5 and the frame 7, a pair of input / output terminal 13 is each inserted in said pair of opening part 7a. The input / output terminal 13 has a plurality of wiring conductors 11 disposed on the top surfaces of the insulating member 9 and the first insulating member 9.

  A plurality of wiring conductors 11 are disposed on the upper surface of the first insulating member 9. Signals can be input / output between the semiconductor element 3 and external wiring (not shown) via these wiring conductors 11. Thus, since the wiring conductor 11 is disposed on the upper surface of the first insulating member 9, the first insulating member 9 is required to have high insulation properties. As the first insulating member 9, for example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body are used as in the case of the insulating substrate. Ceramic materials such as the body or glass ceramic materials can be used.

When the base 5 is made of an insulating material typified above, the first insulating member 9 is preferably made of the same material as the base 5. This is because a deviation between the thermal expansion coefficient of the base 5 and the thermal expansion coefficient of the first insulating member 9 can be suppressed. Thereby, since it can suppress that a big stress is added to the junction part of the base | substrate 5 and the input / output terminal 13, durability of the package 1 can be improved. As the first insulating member 9, for example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body are used as in the case of the insulating substrate. Ceramic materials such as the body or glass ceramic materials can be used.

  In the case where the frame body 7 is made of a metal member, in order to ensure insulation between the frame body 7 and the wiring conductor 11 of the input / output terminal 13, a second gap is formed between the wiring conductor 11 and the frame body 7. It is preferable that an insulating member 27 is provided. As the second insulating member 27, for example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and silicon nitride are used as in the first insulating member 9. A ceramic material such as a quality sintered body or a glass ceramic material can be used.

  The plurality of wiring conductors 11 are located from the inside to the outside of the region surrounded by the frame body 7. Thereby, electrical connection can be achieved between the inside and the outside of the region surrounded by the frame body 7. The plurality of wiring conductors 11 are arranged at a predetermined interval so as not to be electrically short-circuited with each other. As the wiring conductor 11, a member having good conductivity is preferably used. Specifically, a metal material such as tungsten, molybdenum, nickel, copper, silver, and gold can be used as the wiring conductor 11. The above metal materials may be used alone or as an alloy.

  The wiring conductor 11 is a member for electrically connecting an external wiring (not shown) and the semiconductor element 3 via the lead terminal 29 or the like. Therefore, although the wiring conductor 11 in this embodiment is arrange | positioned on the upper surface of the 1st insulating member 9, it is not restricted to this in particular. For example, a part of the wiring conductor 11 may be embedded in the first insulating member 9. In particular, when a part of the wiring conductor 11 is embedded in the first insulating member 9, the first insulating member 9 made of an insulating material is interposed between the plurality of wiring conductors 11 in the embedded portion. Will exist. Therefore, the insulation between the plurality of wiring conductors 11 can be improved.

  Further, when a part of the wiring conductor 11 is embedded in the first insulating member 9, the wiring conductor 11 is pulled out from the side surface of the first insulating member 9 and is exposed on the side surface of the first insulating member 9. You may electrically connect with the lead terminal 29 in the part. The wiring conductor 11 can be electrically connected to the semiconductor element 3 through, for example, the bonding wire 105.

  As the lead terminal 29, it is preferable to use a member having good conductivity like the wiring conductor 11. Specifically, a metal material such as tungsten, molybdenum, nickel, copper, silver, and gold can be used as the lead terminal 29. The above metal materials may be used alone or as an alloy.

  The module 101 of this embodiment includes a lid body 103 joined to the frame body 7. The lid 103 is provided so as to seal the semiconductor element 3. Specifically, the lid body 103 is joined to the upper surface of the frame body 7. The semiconductor element 3 is sealed in a space surrounded by the base body 5, the frame body 7, and the lid body 103. By sealing the semiconductor element 3 in this way, it is possible to suppress the deterioration of the semiconductor element 3 due to the long-term use of the package 1. As the lid 103, for example, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used.

As mentioned above, although the element storage package and the module provided with the same according to each embodiment of the present invention have been described, the present invention is not limited to the above-described embodiment. In other words, various modifications and combinations of embodiments may be made without departing from the scope of the present invention. For example, in the above embodiment, an optical fiber is used as a signal input / output member, but there is no problem even if a connector for inputting / outputting a high-frequency electrical signal having a wavelength longer than that of visible light is used as the signal input / output member. .

1 ... Package for element storage (package)
DESCRIPTION OF SYMBOLS 3 ... Semiconductor element 5 ... Base | substrate 5a ... Mounting area 7 ... Frame body 7a ... Opening part 9 ... 1st insulating member 11 ... Wiring conductor 13 ... Input / output Terminal 15 ... Hole 17 ... Groove 19 ... Screw hole 21 ... Mounting board 23 ... Fixing member 25 ... Ferrule 27 ... Second insulating member 29 ... Lead Terminal 101 ... Module 103 ... Lid 105 ... Bonding wire

Claims (7)

A substrate having a mounting region for mounting a semiconductor element on the upper surface;
A frame body provided on the upper surface of the base so as to surround the mounting area, and having a pair of openings that open to the inner peripheral surface and the outer peripheral surface, respectively, at positions facing the inner peripheral surface;
A pair of input / output terminals each having an insulating member and at least one wiring conductor disposed on an upper surface of the insulating member, each inserted into the pair of openings;
A pair of holes formed on the upper surface so as to include at least a region overlapping with the pair of input / output terminals in a region surrounded by the frame when the base is viewed in plan, and the pair of holes And a groove formed on the upper surface so as to connect the two.   The thickness of the base at the bottom of the groove is larger than the thickness of the base at the bottom of the hole, and the bottom of the groove is higher than the bottom of the hole. The device storage package according to 1.   The element housing package according to claim 1, wherein the base has a plurality of the groove portions, and each of the groove portions is linearly formed in parallel with each other.   The element according to claim 3, wherein the mounting region is located between the pair of input / output terminals, and the plurality of grooves are formed so as to sandwich the mounting region therebetween. Storage package.   2. The element storage package according to claim 1, wherein a width of the groove is smaller than a width of the hole.   The element storage package according to claim 1, wherein a concave curved surface is formed between a bottom surface and a side surface of the groove portion. The device storage package according to any one of claims 1 to 6,
A semiconductor element mounted in the mounting region;
A module comprising: a lid body that is bonded to the frame body and seals the semiconductor element.

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