JP2012008265A - Element housing package, and optical module and optical semiconductor device equipped with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To address the possibility that brazing metal oozing out of joints between a substrate and a frame or joints between a fixed member or members and the frame causes the fixed member or members and the upper face of the substrate to be directly joined, which might invite displacement of the fixed member or members by the difference in thermal expansion between the brazing metal and the frame.SOLUTION: An element housing package comprises a substrate having on its upper face a mounting area to be mounted with an optical semiconductor element, a frame so arranged over the main face of the substrate as to surround the mounting area and having a throughhole opening in the inner circumferential face and the outer circumferential face, a joining member positioned between the substrate and the frame to join the substrate and the frame, and a cylindrical fixed member to fix an optical fiber inserted into and fixed in the throughhole, wherein the substrate has a recess in the peripheral part of an area in which the substrate is joined with the frame and where the substrate overlaps the fixed member in a planar view.

Description

  The present invention relates to an element storage package for storing an optical semiconductor element typified by an LD (laser diode) or PD (photodiode), an optical module and an optical semiconductor device including the same.

  As an element storage package for storing an optical semiconductor element, for example, an optical module described in Patent Document 1 is known. The optical module described in Patent Document 1 is provided with a through-hole on the side surface of the package, and a fixing member for fixing the optical fiber is inserted and fixed in the through-hole, which includes a ferrule, a ferrule holder, and an airtight sealing window. Yes. The optical fiber fixed by the fixing member is optically coupled to the optical semiconductor element housed in the package.

JP 2003-204107 A

  When the substrate constituting the package main body and the frame are joined, and when the fixing member is inserted and fixed in the through hole, these members are joined via a joining member such as a brazing material. In recent years, the element storage packages have been increasingly miniaturized and integrated, and the height of the element storage packages has been reduced. Therefore, the distance between the fixing member and the upper surface of the substrate is small in the element storage package.

  Therefore, there is a possibility that the fixing member and the upper surface of the substrate are directly joined by the joining member that protrudes from the joining portion. In such a case, a compressive stress or a tensile stress is applied to the fixing member between the fixing member and the substrate due to a difference in thermal expansion between the joining member and the frame. When such a force is applied to the fixing member, the fixing member is displaced, and the optical coupling between the optical fiber and the optical semiconductor element may be less accurate.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an element storage package that can perform high-precision optical coupling even when the height of the element storage package is reduced. And

  An element storage package according to one aspect of the present invention includes a substrate having a mounting region on which an optical semiconductor element is mounted on an upper surface, and a surrounding region on the main surface of the substrate. Further, a frame having a through hole that opens to the inner peripheral surface and the outer peripheral surface, a bonding member that is positioned between the substrate and the frame, and joins the substrate and the frame, and is inserted into the through hole And a cylindrical fixing member to which the optical fiber is fixed. And the said board | substrate is a peripheral part of the area | region where the said frame is joined, Comprising: When the said board | substrate is planarly viewed, it has a recessed part in the part which overlaps with the said fixing member, It is characterized by the above-mentioned.

In the element storage package according to one aspect of the present invention, the substrate has a recess in a peripheral portion of a region to which the frame body is bonded, and overlaps with the fixing member when the substrate is viewed in plan. Yes. Therefore, in the portion where the fixing member and the substrate overlap, the distance between the fixing member and the upper surface of the substrate can be increased. The possibility of being joined to each other via the joining member can be reduced.

  Further, when the substrate and the frame are joined, or when the fixing member is inserted and fixed in the through hole, even if the joining member that joins these members protrudes from the joining portion, the joining member accumulates in the recess. Therefore, it can suppress that a joining member flows into an unexpected position.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an element storage package according to a first embodiment, an optical module including the same, and an optical semiconductor device. FIG. 2 is a plan view of the element storage package shown in FIG. 1. It is an expanded sectional view of the vicinity of the fixing member in the AA cross section of the element storage package shown in FIG. FIG. 10 is an enlarged cross-sectional view showing a first modification of the element storage package shown in FIG. 3. FIG. 10 is an enlarged cross-sectional view showing a second modification of the element storage package shown in FIG. 3. FIG. 10 is an enlarged cross-sectional view showing a third modification of the element storage package shown in FIG. 3. It is a perspective view which shows the element storage package concerning 2nd Embodiment, an optical module provided with the same, and an optical semiconductor device. FIG. 6 is a plan view of the element storage package shown in FIG. 5.

  Hereinafter, an element storage package according to an embodiment of the present invention, and an optical module and an optical semiconductor device including the same will be described in detail with reference to the drawings. However, in the drawings referred to below, for convenience of explanation, among the constituent members of the embodiment, only the main members necessary for explaining the present invention are shown in a simplified manner. Therefore, the element storage package according to the present invention can include arbitrary constituent members not shown in the drawings referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

  As shown in FIGS. 1 to 3, the element storage package 1 according to the first embodiment includes a substrate 5 having a placement region 5 a on which an optical semiconductor element 3 is placed on an upper surface, and a main surface of the substrate 5. Is disposed between the substrate 5 and the frame body 9, and has a through hole 7 that opens to the inner peripheral surface and the outer peripheral surface, and is disposed between the substrate 5 and the frame body 9. A joining member 11a (hereinafter also referred to as a first joining member 11a) for joining the body 9 and a cylindrical fixing member 15 inserted and fixed in the through hole 7 to which the optical fiber 13 is fixed are provided. And the board | substrate 5 has the recessed part 17 in the peripheral part of the area | region inside the area | region where the frame 9 is joined, Comprising: When the board | substrate 5 is planarly viewed, it overlaps with the fixing member 15. FIG.

  As described above, since the concave portion 17 is provided in the portion overlapping the fixing member 15 when the substrate 5 is viewed in plan, the upper surface of the fixing member 15 and the substrate 5 is provided in the portion where the fixing member 15 and the substrate 5 overlap. The interval between and can be increased. Therefore, it is possible to reduce the possibility that the fixing member 15 and the upper surface of the substrate 5 are directly joined via the joining member 11 while reducing the height of the element housing package 1.

Further, when the substrate 5 and the frame body 9 are joined via the first joining member 11a, or when the fixing member 15 is inserted and fixed into the through hole 7 via the second joining member 11b described later, these Even if the first joining member 11a or the second joining member 11b that joins these members protrudes from the joining portion, these joining members 11 can be stored in the concave portion 17, so that the joining member 11 is located at an unexpected position. Can be prevented from flowing.

  The substrate 5 in the present embodiment has a square plate shape and has a placement region 5a on which the optical semiconductor element 3 is placed on the main surface. In the present embodiment, the placement region 5a means a region that overlaps the optical semiconductor element 3 when the substrate 5 is viewed in plan.

  In the present embodiment, the placement region 5a is formed at the center of the main surface. However, since the region where the optical semiconductor element 3 is placed is the placement region 5a, for example, the main surface of the substrate 5 is formed. There is no problem even if the placement area 5a is formed at the end. Further, the substrate 5 of the present embodiment has one placement region 5a, but the substrate 5 has a plurality of placement regions 5a, and the optical semiconductor element 3 is placed in each placement region 5a. It may be.

  The substrate 5 in the element storage package 1 of the present embodiment has a concave portion 17 in a peripheral portion of a region to which the frame body 9 is joined and overlaps with the fixing member 15 when the substrate 5 is viewed in plan view. is doing. As described above, by having such a concave portion 17, the interval between the fixing member 15 and the upper surface of the substrate 5 can be increased in the portion where the fixing member 15 and the substrate 5 overlap. Moreover, since the joining member 11 accumulates in this recessed part 17, it can suppress that the joining member 11 flows into an unexpected position.

  The shape of the concave portion 17 may be any shape that can increase the distance between the fixing member 15 and the upper surface of the substrate 5, and the substrate 5 and the frame body 9 are joined via the first joining member 11 a. Or when the fixing member 15 is inserted and fixed in the through hole 7 via the second bonding member 11b, even if the bonding member 11 protrudes from the respective bonding portions, the protruding bonding members 11 are Any shape that can be stored may be used. Specifically, for example, as illustrated in FIG. 3, when the concave portion 17 is viewed in cross section, the bottom surface and two side surfaces positioned so as to sandwich the bottom surface may be used. At this time, as shown in FIG. 4A, the boundary between the bottom surface and the side surface is preferably curved. This is because when the bonding member 11 accumulates in the recess 17, it is possible to suppress local concentration of stress applied to the substrate 5 due to the expansion and contraction of the bonding member 11.

  Moreover, as a shape of the recessed part 17, as shown to FIG. 4B, it is a V shape comprised from two side surfaces, or as shown to FIG. 4C, trapezoid shape whose opening part width is larger than the width | variety in a bottom face. There may be. When the concave portion 17 has these shapes, the two side surfaces are not parallel, and the width increases toward the opening. Therefore, when the bonding member 11 accumulates in the concave portion 17, the bonding member 11. The influence of the stress applied to the substrate 5 due to the expansion and contraction of the substrate can be reduced. Specifically, when the joining member 11 is accumulated in the recess 17 so as to be in contact with both side surfaces, the joining member 11 is easily expanded and contracted above the substrate 5. Therefore, the stress applied in the direction parallel to the upper surface of the substrate 5 due to the expansion and contraction of the bonding member 11 can be dispersed in the direction perpendicular to the upper surface of the substrate 5.

  The depth D of the concave portion 17 is preferably larger than the thickness T of the first bonding member 11a. Thereby, even when a part of the first bonding member 11 a protrudes from between the substrate 5 and the frame body 9, the first bonding member 11 a can be stably stored in the recess 17. Therefore, the possibility that the fixing member 15 and the upper surface of the substrate 5 are directly joined via the joining member 11 can be further reduced.

Further, the depth D of the concave portion 17 is preferably 10 to 50% with respect to the thickness of the substrate 5. By being 10% or more, the 1st joining member 11a can be stored in the recessed part 17 stably. In addition, the portion of the substrate 5 located below the recess 17 is relatively small in thickness, but the depth D of the recess 17 is 50% or less with respect to the thickness of the substrate 5. Even in a portion having a relatively small thickness, a sufficient thickness of the substrate 5 can be secured. As a result, it can suppress that durability of the board | substrate 5 falls excessively.

  The thickness is preferably larger than the thickness T of the first bonding member 11a. Thereby, even when a part of the first bonding member 11 a protrudes from between the substrate 5 and the frame body 9, the first bonding member 11 a can be stably stored in the recess 17. Therefore, the possibility that the fixing member 15 and the upper surface of the substrate 5 are directly joined via the joining member 11 can be further reduced.

  When the first direction is a direction perpendicular to the direction in which the fixing member 15 is inserted into the through-hole 7 and parallel to the upper surface of the substrate 5, the width W1 of the recess 17 in the first direction. Is preferably larger than the width W2 of the fixing member 15 in the first direction. Since at least a part of the recess 17 is also located in a portion that does not overlap with the fixing member 15 when the substrate 5 is viewed in plan view, even when the bonding member 11 flows into the recess 17, The possibility that the upper surface of the substrate 5 is directly bonded via the bonding member 11 can be further reduced.

  In addition, when the substrate 5 is viewed in plan, it is preferable that a part of the bonding member 11 overlaps the concave portion 17. By positioning at least a part of the joining member 11 so as to overlap with the recess 17, even if the joining member 11 protrudes from the joining portion, the joining member 11 flows more reliably into the recess 17 and accumulates in the recess 17. be able to. Therefore, the possibility that the fixing member 15 and the upper surface of the substrate 5 are directly joined via the joining member 11 can be further reduced.

  In addition, when the substrate 5 is viewed in plan, it is preferable that a part of the recess 17 overlaps the frame body 9. Even if the first joining member 11 a that joins the substrate 5 and the frame body 9 protrudes from the joining portion, the first joining member 11 a can flow more reliably into the recess 17 and can be stored in the recess 17. Therefore, the possibility that the fixing member 15 and the upper surface of the substrate 5 are directly joined via the joining member 11 can be further reduced.

  As already described, the fixing member 15 and the upper surface of the substrate 5 may be directly joined via the joining member 11, so that the fixing member 15 may be misaligned. The case where the fixing member 15 and the upper surface of the substrate 5 are directly bonded to each other in a portion near the frame body 9 is more than the case where the fixing member 15 and the upper surface of the substrate 5 are directly bonded to each other. A large misalignment tends to occur in the fixing member 15. However, when a part of the recess 17 overlaps the frame body 9 when the substrate 5 is viewed in plan view, the recess 17 is present immediately below the frame member 9 of the fixing member 15. Become. For this reason, the large displacement of the fixing member 15 described above can be stably suppressed.

  A plurality of wiring conductors 19 are disposed on the main surface of the substrate 5. Signals can be input / output between the optical semiconductor element 3 and external wiring (not shown) via these wiring conductors 19. Thus, since the wiring conductor 19 is disposed on the main surface of the substrate 5, the substrate 5 is required to have high insulation at least in a portion where the wiring conductor 19 is disposed. It is done. The substrate 5 according to this embodiment is manufactured by stacking a plurality of insulating substrates. A wiring conductor 19 is disposed on the insulating substrate. Examples of the insulating substrate include an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, a ceramic material such as an aluminum nitride sintered body and a silicon nitride sintered body, or a glass ceramic. Materials can be used.

  A mixing member is prepared by mixing the raw material powder containing these glass powder and ceramic powder, an organic solvent, and a binder. A plurality of ceramic green sheets are produced by forming the mixed member into a sheet. A plurality of laminated bodies are produced by laminating the produced ceramic green sheets. The substrate 5 is manufactured by integrally firing the plurality of laminated bodies at a temperature of about 1600 degrees.

  The substrate 5 is not limited to a configuration in which a plurality of insulating substrates are stacked. The substrate 5 may be constituted by one insulating substrate. Moreover, since it is calculated | required that the board | substrate 5 has high insulation in the part by which the wiring conductor 19 is arrange | positioned at least, it is good also as a structure which laminated | stacked the insulating board | substrate on the metal board | substrate, for example. In particular, when high heat dissipation is required for the substrate 5, the substrate 5 preferably has the above-described configuration. This is because the metal member has high heat dissipation. By adopting a configuration in which an insulating substrate is laminated on a metal substrate, the heat dissipation of the substrate 5 can be enhanced.

  Specifically, metal members such as iron, copper, nickel, chromium, cobalt, and tungsten, or alloys made of these metals can be used. A metal substrate constituting the substrate 5 can be manufactured by subjecting such an ingot of a metal member to a metal processing method such as a rolling method or a punching method.

  By partially cutting a portion of the upper surface of the substrate 5 thus manufactured, which is a peripheral portion of the region to which the frame body 9 is joined, and overlaps with the fixing member 15 when the substrate 5 is viewed in plan view, A recess 17 can be formed. The concave portion 17 may be formed by partially cutting the substrate 5 as described above. For example, when the ceramic green sheet to be the substrate 5 is stacked, the concave portion 17 is formed on the uppermost ceramic green sheet. The recess 17 may be formed by providing the through hole 7.

  The plurality of wiring conductors 19 are located from the inside to the outside of the region surrounded by the frame body 9. Thereby, electrical connection can be achieved between the inside and the outside of the region surrounded by the frame body 9. The plurality of wiring conductors 19 are arranged at a predetermined interval so as not to be electrically short-circuited with each other. As the wiring conductor 19, it is preferable to use a member having good conductivity. Specifically, a metal material such as tungsten, molybdenum, nickel, copper, silver, and gold can be used as the wiring conductor 19. The above metal materials may be used alone or as an alloy.

  The wiring conductor 19 is a member for electrically connecting an external wiring (not shown) and the optical semiconductor element 3 via the lead terminal 21 or the like. Therefore, the wiring conductor 19 in the present embodiment is disposed only on the main surface of the substrate 5, but is not particularly limited thereto. For example, a part of the wiring conductor 19 may be embedded in the substrate 5. In particular, when a part of the wiring conductor 19 is embedded in the substrate 5, the substrate 5 made of an insulating member exists between the plurality of wiring conductors 19 in the embedded portion. Therefore, the insulation between the plurality of wiring conductors 19 can be improved. Further, when a part of the wiring conductor 19 is embedded in the substrate 5, the wiring conductor 19 is pulled out from the side surface of the substrate 5 and is electrically connected to the lead terminal 21 at the exposed portion on the side surface of the substrate 5. May be.

  As the lead terminal 21, it is preferable to use a member having good conductivity like the wiring conductor 19. Specifically, a metal material such as tungsten, molybdenum, nickel, copper, silver, and gold can be used as the lead terminal 21. The above metal materials may be used alone or as an alloy.

  The element storage package 1 of this embodiment includes a mounting substrate 23 on which the optical semiconductor element 3 is mounted, which is disposed on the mounting area 5a. Although the optical semiconductor element 3 may be directly mounted on the substrate 5, the optical semiconductor element 3 is provided with a mounting substrate 23 as in the element housing package 1 of the present embodiment, and the optical semiconductor is mounted on the mounting substrate 23. It is preferable that the element 3 is mounted. This is because the difference in height between the optical semiconductor element 3 and the fixing member 15 can be reduced, so that the optical coupling between the optical semiconductor element 3 and the optical fiber 13 can be facilitated.

  In the element storage package 1 of the present embodiment, a fixing member 15 is inserted and fixed in the through hole 7 provided in the frame body 9. Therefore, the fixing member 15 is separated from the substrate 5 by a predetermined distance. When the optical semiconductor element 3 is placed directly on the substrate 5, a deviation in the height direction tends to occur between the optical semiconductor element 3 and the fixing member 15. On the other hand, in the case where the mounting substrate 23 is provided and the optical semiconductor element 3 is mounted on the mounting substrate 23, this height deviation can be reduced. Therefore, the optical coupling can be performed stably between the optical semiconductor element 3 and the optical fiber 13.

  As the mounting substrate 23, it is preferable to use a member having good insulation like the insulating substrate 5. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, and aluminum nitride are used. Ceramic materials such as quality sintered bodies and silicon nitride based sintered bodies, or glass ceramic materials can be used.

  The frame body 9 is provided on the main surface of the substrate 5 so as to surround the placement area 5a when viewed in plan. The frame 9 has a through hole 7 that opens to the inner and outer peripheral surfaces. A cylindrical fixing member 15 to which the optical fiber 13 is fixed is inserted and fixed in the through hole 7. The through hole 7 can be formed in the frame body 9 by, for example, drilling.

  As the frame 9, for example, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used. The metal substrate 5 constituting the substrate 5 can be manufactured by subjecting such an ingot of a metal member to a metal processing method such as a rolling method or a punching method. A ceramic member may be used as the frame body 9. Further, the frame body 9 may be composed of one member, but may be a laminated structure of a plurality of members.

  In the case where the frame body 9 made of a metal member is provided, an opening is provided in the frame body 9 and the wiring conductor 19 and the frame are provided in the opening to ensure insulation between the frame body 9 and the wiring conductor 19. It is preferable that an insulating member is disposed between the body 9.

  The element storage package 1 of the present embodiment includes a first joining member 11 a that is located between the substrate 5 and the frame body 9 and joins the substrate 5 and the frame body 9. As the first joining member 11a, for example, a brazing material can be used. Exemplary brazing materials include silver brazing.

  As shown in FIG. 3, the width W3 of the first bonding member 11a is larger than the thickness W4 of the frame 9 in order to improve the bondability between the substrate 5 and the frame 9 and the airtightness of the element storage package 1. Larger is preferred. When the width W3 of the first bonding member 11a is larger than the thickness W4 of the frame body 9, it is possible to improve the bondability between the substrate 5 and the frame body 9 and the airtightness of the element housing package 1, There is a possibility that the fixing member 15 and the upper surface of the substrate 5 are directly bonded via the bonding member 11. However, in the element storage package 1 of the present embodiment, since the substrate 5 has the concave portion 17, there is a possibility that the fixing member 15 and the upper surface of the substrate 5 are directly bonded via the bonding member 11. Can be reduced.

  The element storage package 1 of this embodiment includes a cylindrical fixing member 15 to which the optical fiber 13 is fixed. More specifically, as shown in FIGS. 1 to 3, the fixing member 15 is fixed to the frame body 9 so that one end is located inside the frame body 9 and the other end is located outside the frame body 9. Has been. The fixing member 15 in the present embodiment fixes and positions the optical fiber 13 and has a cylindrical shape so that light between the optical semiconductor element 3 and the optical fiber 13 can be transmitted through the cylindrical hollow portion. Can communicate.

  The fixing member 15 preferably has a strength that can fix at least the optical fiber 13. Specifically, metal members such as iron, copper, nickel, chromium, cobalt, and tungsten, or alloys made of these metals can be used. The cylindrical fixing member 15 can be produced by subjecting such an ingot of a metal member to a metal processing method such as a rolling method or a punching method.

  In particular, the frame body 9 and the fixing member 15 are preferably formed using the same metal member. This is because the difference in thermal expansion between the frame body 9 and the fixing member 15 can be reduced, so that the stress generated between the frame body 9 and the fixing member 15 can be reduced.

  The element storage package 1 according to the present embodiment includes a second joining member 11 b that is located between the frame body 9 and the fixing member 15 and joins the frame body 9 and the fixing member 15. The fixing member 15 may be fitted into the through-hole 7 by making the inner diameter of the through-hole 7 formed in the frame body 9 equal to the outer diameter of the fixing member 15, but between the frame body 9 and the fixing member 15. It is preferable to join the frame body 9 and the fixing member 15 using the second joining member 11b positioned at the position.

  When the fixing member 15 is fitted into the through-hole 7, in order to fix the fixing member 15 to the through-hole 7, high-precision processing is required for the inner diameter of the through-hole 7 and the outer diameter of the fixing member 15. The fixing member 15 can be easily fixed to the through hole 7 by bonding the frame body 9 and the fixing member 15 using the bonding member 11b. For example, a brazing material can be used as the second bonding member 11b. Exemplary brazing materials include silver brazing.

  In the element storage package 1 of the present embodiment, since the substrate 5 has the concave portion 17 below the through hole 7, a part of the second bonding member 11 b includes the frame body 9, the fixing member 15, and the like. Even if it flows out of the space, there is a possibility that the fixing member 15 and the upper surface of the substrate 5 are directly bonded via the bonding member 11 and stress is applied to the fixing member 15 so that the fixing member 15 is displaced. Can be small.

  A translucent member 25 is disposed in the cylindrical fixing member 15 so as to close the hole of the fixing member 15. The translucent member 25 closes the inside of the fixing member 15, maintains the airtightness of the element housing package 1, and takes the excited light of the optical semiconductor element 3 that transmits the internal space of the fixing member 15 as it is. It acts to transmit to the incoming optical fiber. As the translucent member 25, it is possible to use, for example, lead-based silicon oxide, lead oxide containing lead oxide as a main component, and borosilicate-based amorphous glass containing boric acid and silica sand as main components.

  The optical module 27 of the present embodiment includes an element housing package 1 represented by the above embodiment, an optical semiconductor element 3 placed in the placement area 5 a of the element housing package 1, and a frame body 9. A lid 29 that seals the optical semiconductor element 3 is provided.

In the optical module 27 of the present embodiment, the optical semiconductor element 3 is placed on the placement area 5 a of the substrate 5. Further, the optical semiconductor element 3 and the wiring conductor 19 are electrically connected via a conducting wire. A desired output can be obtained from the optical semiconductor element 3 by inputting an external signal to the optical semiconductor element 3 via the external wiring, the wiring conductor 19 and the conducting wire. Examples of the optical semiconductor element 3 include a light emitting element that emits light to the optical fiber 13 typified by an LD element, and a light receiving element that receives light to the optical fiber 13 typified by a PD element. It is done.

  The optical semiconductor element 3 and the wiring conductor 19 can be electrically connected by so-called wire bonding, for example, via a conducting wire. Further, the optical semiconductor element is extended by a so-called flip chip in which the wiring conductor 19 is extended to a position immediately below the optical semiconductor element 3 and the optical semiconductor element 3 and the wiring conductor 19 are joined via a conductive adhesive such as a brazing material. 3 and the wiring conductor 19 may be electrically connected.

  The lid 29 is bonded to the frame body 9 and is provided so as to seal the optical semiconductor element 3. The lid body 29 is joined to the upper surface of the frame body 9. The optical semiconductor element 3 is sealed in a space surrounded by the substrate 5, the frame body 9, and the lid body 29. By sealing the optical semiconductor element 3 in this way, deterioration of the optical semiconductor element 3 due to the use of the element storage package 1 for a long period of time can be suppressed. As the lid 29, for example, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used. Further, the frame body 9 and the lid body 29 can be joined by, for example, a seam welding method. Further, the frame body 9 and the lid body 29 may be joined using, for example, gold-tin solder.

  The optical semiconductor device 31 of the present embodiment includes the optical module 27 represented by the above embodiment and the optical fiber 13 fixed to the fixing member 15. The optical fiber 13 may be fixed to the fixing member 15 at the end face located outside the frame body 9, and may be fixed to the fixing member 15 by inserting a part of the optical fiber 13 into the fixing member 15. Also good.

  Next, an element storage package of the second embodiment, an optical module and an optical semiconductor device including the same will be described in detail with reference to the drawings. In addition, in each structure concerning this embodiment, about the structure which has the same function as 1st Embodiment, the same referential mark is attached and the detailed description is abbreviate | omitted.

  As shown in FIGS. 5 to 6, in the element storage package 1 of the second embodiment, the frame body 9 has a plurality of through holes 7, and a fixing member 15 is inserted and fixed in each of these through holes 7. Yes. And the board | substrate 5 has the recessed part 17 in the peripheral part of the area | region where the frame 9 is joined, and the part which overlaps with the some fixing member 15 when the board | substrate 5 is planarly viewed.

  As described above, when the substrate 5 is viewed in a plan view, the concave portions 17 are respectively provided in portions where the fixing members 15 are overlapped. Therefore, in the portion where the fixing members 15 and the substrate 5 overlap, the fixing members 15 and the substrates 5 are overlapped. The distance from the upper surface of each can be increased. Therefore, it is possible to reduce the possibility that the fixing member 15 and the upper surface of the substrate 5 are directly joined via the joining member 11 while reducing the height of the element housing package 1.

  When the concave portion 17 is formed, the thickness of the substrate 5 below the concave portion 17 is relatively small, so that stress is easily applied to this portion of the substrate 5. 1 has a plurality of recesses 17. In other words, a portion having a relatively large thickness is formed between the recesses 17 in comparison with the thickness of the substrate 5 below the recesses 17. As described above, since there is a portion having a relatively large thickness between the portions below the concave portion 17 and the thickness of the substrate 5 being relatively small, the thickness of the substrate 5 is below the concave portion 17 and is small. It can suppress that durability of the board | substrate 5 falls by the stress added to a relatively small part.

In the element storage package 1 of the present embodiment, it is preferable that the depths of the respective recesses 17 are equal. When the variation in the depth of the recesses 17 is large, the stress is likely to be concentrated on a part of the substrate 5. However, since the recesses 17 are equal in depth, the portions of the substrate 5 located below the respective recesses 17. Variations in stress applied to can be reduced. As a result, the durability of the substrate 5 can be improved.

  As mentioned above, although the element storage package concerning each embodiment of this invention and the optical module and optical semiconductor device provided with this have been demonstrated, this invention is not limited to the above-mentioned embodiment. In other words, various modifications and combinations of embodiments may be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Element accommodation package 3 ... Optical semiconductor element 5 ... Substrate 5a ... Mounting area 7 ... Through-hole 9 ... Frame body 11 ... Joining member 11a ... No. 1 joining member 11b ... 2nd joining member 13 ... optical fiber 15 ... fixing member 17 ... recessed part 19 ... wiring conductor 21 ... lead terminal 23 ... mounting substrate 25 ... Translucent member 27 ... Optical module 29 ... Cover 31 ... Optical semiconductor element

Claims (7)

A substrate having a mounting region on which an optical semiconductor element is mounted;
A frame body having a through-hole that opens to the inner peripheral surface and the outer peripheral surface, disposed so as to surround the placement region on the main surface of the substrate;
A bonding member that is positioned between the substrate and the frame, and bonds the substrate and the frame;
A cylindrical fixing member that is inserted into and fixed to the through hole and to which the optical fiber is fixed;
The element storage package according to claim 1, wherein the substrate has a concave portion in a peripheral portion of a region to which the frame body is bonded and overlaps with the fixing member when the substrate is viewed in plan.   The width of the concave portion in the first direction when the first direction is a direction perpendicular to the direction in which the fixing member is inserted into the through-hole and parallel to the upper surface of the substrate. 2. The element storage package according to claim 1, wherein a width of the fixing member is larger than a width of the fixing member in the first direction.   2. The element storage package according to claim 1, wherein when the substrate is viewed in plan, a part of the joining member overlaps the concave portion.   2. The element storage package according to claim 1, wherein a part of the recess overlaps the frame when the substrate is viewed in plan.   The frame has a plurality of the through holes, and the fixing member is inserted and fixed in each of the through holes. The substrate is a peripheral portion of a region where the frame is joined, and the substrate is 2. The element storage package according to claim 1, wherein each of the plurality of the fixing members overlaps with each other when viewed in a plan view. The device storage package according to any one of claims 1 to 5,
The optical semiconductor element placed in the placement area of the element storage package;
An optical module comprising: a lid body that is bonded to the frame body and seals the optical semiconductor element. An optical module according to claim 6;
An optical semiconductor device comprising: an optical fiber fixed to the fixing member.

Images