JP5755114B2 - Element storage package and optical semiconductor device - Google Patents

Description

  The present invention relates to an element storage package in which an optical semiconductor element such as a PD (photodiode) or LD (laser diode) is stored, and an optical semiconductor device using the same. Such an optical semiconductor device can be used, for example, in an optical communication device.

  As an element storage package (hereinafter also simply referred to as a package) for storing an optical semiconductor element, for example, a package used in an optical module described in Patent Document 1 is known. In the package described in Patent Document 1, a ferrule holder for holding a ferrule to which an optical fiber is fixed is attached to the package body. The optical fiber fixed to the package body by the ferrule holder is optically coupled to the optical semiconductor element. The ferrule holder is generally joined to the package body using a joining member such as a brazing material.

JP 2003-204107 A

  In order to firmly join the ferrule holder to the package body, a large amount of brazing material for joining these members is generally used. However, there is a possibility that the surplus brazing material spreads in an unexpected region on the surface of the package body or the surface of the ferrule holder. Due to the difference in thermal expansion coefficient between the material constituting the package body or ferrule holder and the material constituting the brazing material, there is a possibility that unexpected stress is applied to the package body or ferrule holder from the surplus brazing material. is there. Therefore, the durability and airtightness of the package may be reduced.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a highly reliable element storage package having good durability and airtightness.

  An element storage package according to one aspect of the present invention is provided on a top surface of the substrate so as to surround the mounting region, a substrate having a mounting region on which an optical semiconductor element is mounted on the top surface, A frame having a through hole that opens to the inner surface and the outer surface, a cylindrical first part joined to the inner peripheral surface of the through hole via a brazing material, and a cylinder located outside the frame And an optical fiber holding member in which the inner peripheral surface of the first portion and the inner peripheral surface of the second portion are continuous. And the groove | channel is formed in the outer peripheral surface of a said 2nd part along the penetration direction of the said through-hole.

In the element housing package of the above aspect, as described above, a groove is formed in the cylindrical second portion of the optical fiber holding member located outside the frame body along the penetration direction of the through hole. Therefore, it is possible to store an excess amount of the brazing material that joins the frame body and the optical fiber holding member to the groove in the second portion adjacent to the first portion. Accordingly, it is possible to suppress the brazing material from spreading in an unexpected region. In addition, since the surplus amount of the brazing material can be stored in the groove, the frame body and the optical fiber holding member can be stably joined without using an excessively large amount of brazing material.

1 is an exploded perspective view showing an element storage package and an optical semiconductor device including the same according to a first embodiment. FIG. 2 is a plan view of the element storage package shown in FIG. 1. It is sectional drawing in the XX cross section of the element storage package shown in FIG. It is an expanded sectional view which shows the area | region A in FIG. It is a side view of the element storage package shown in FIG. It is an enlarged side view which shows the area | region B in FIG. FIG. 7 is a side view showing a first modification of the element storage package shown in FIG. 6. FIG. 10 is a side view showing a second modification of the element storage package shown in FIG. 4. FIG. 10 is a side view showing a third modification of the element storage package shown in FIG. 6. It is sectional drawing of the element storage package of 2nd Embodiment. It is an expanded sectional view which shows the area | region C in FIG.

  Hereinafter, an element storage package (hereinafter also simply referred to as a package) of each embodiment and an optical semiconductor device including the same will be described in detail with reference to the drawings. However, in the drawings referred to below, for convenience of explanation, among the constituent members of the embodiment, only the main members necessary for explaining the present invention are shown in a simplified manner. Therefore, the package and the optical semiconductor device according to the present invention can include arbitrary constituent members not shown in the drawings referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

  As shown in FIGS. 1 to 6, the package 1 according to the first embodiment includes a substrate 3, a frame 5 that is disposed on the upper surface of the substrate 3 and has through holes 7 a that open on the inner surface and the outer surface. The optical fiber holding member 9 attached to the through hole 7a of the frame 5 is provided.

  The substrate 3 in the present embodiment has a rectangular plate-shaped flat plate portion and screwing portions that are drawn laterally from the four corners of the flat plate region. The flat plate portion has a placement region 3a on which the optical semiconductor element 11 is placed. A screwing hole 13 is formed in each screwing portion. The package 1 can be fixed to the mounting substrate (not shown) with the screw holes 13.

  In the present embodiment, the placement region 3a means a region that overlaps the optical semiconductor element 11 when the substrate 3 is viewed in plan. As a magnitude | size of the board | substrate 3, the one side of a flat plate part can be set to 5 mm-50 mm, for example. Moreover, as thickness of the board | substrate 3, it can set to 0.3 mm-3 mm, for example.

  In the present embodiment, the placement region 3a is formed at the center of the upper surface of the substrate 3. However, since the region where the optical semiconductor element 11 is placed is the placement region 3a, for example, the upper surface of the substrate 3 is used. There is no problem even if the placement region 3a is formed at the end of the substrate. Further, the substrate 3 of the present embodiment has one placement region 3a, but the substrate 3 has a plurality of placement regions 3a, and the optical semiconductor element 11 is placed in each placement region 3a. It may be.

  An optical semiconductor element 11 is disposed in the placement region 3 a on the upper surface of the substrate 3. Examples of the optical semiconductor element 11 include a light emitting element that emits light to an optical fiber, typified by an LD element, and a light receiving element that receives light from an optical fiber, typified by a PD element. Such an optical semiconductor element 11 is optically coupled with an optical fiber to be described later.

  A bonding wire (not shown) is electrically connected to the optical semiconductor element 11. The optical semiconductor element 11 can input / output signals to / from an external wiring circuit (not shown) via the bonding wires and lead terminals (not shown). As described above, the optical semiconductor element 11 is disposed on the upper surface of the substrate 3. Therefore, the substrate 3 is required to have high insulation properties at least in a portion where the optical semiconductor element 11 is disposed.

  The substrate 3 having high insulation can be produced by laminating a plurality of insulating members. Then, the optical semiconductor element 11 is placed on the placement region 3 a of the substrate 3. As the insulating member, for example, a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body may be used. it can. Further, a glass ceramic material may be used instead of these ceramic materials.

  A mixing member is prepared by mixing the raw material powder containing these glass powder and ceramic powder, an organic solvent, and a binder. A plurality of ceramic green sheets are produced by forming the mixed member into a sheet. A plurality of laminated bodies are produced by laminating the produced ceramic green sheets. The substrate 3 is fabricated by integrally firing the plurality of laminated bodies at a temperature of about 1600 degrees.

  The substrate 3 is not limited to the configuration in which a plurality of insulating members are stacked. The board | substrate 3 may be comprised by one insulating member. Moreover, since it is calculated | required that the board | substrate 3 has high insulation at least in the part by which the optical semiconductor element 11 is arrange | positioned, it is good also as a structure which laminated | stacked the insulating member on the metal member, for example. In particular, when high heat dissipation is required for the substrate 3, the substrate 3 preferably has the above-described configuration. This is because the metal member has high heat dissipation. By setting it as the structure which laminated | stacked the insulating member on the metal member, the heat dissipation of the board | substrate 3 can be improved.

  Specifically, like the substrate 3 in the present embodiment, an insulating mounting substrate 15 may be provided. In the substrate 3 in the present embodiment, the substrate 3 is made of a metal member, and the placement substrate 15 is disposed on the placement region 3 a of the substrate 3. The optical semiconductor element 11 is mounted on the mounting substrate 15.

  Specifically, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used as the metal member. The metal member which comprises the board | substrate 3 is producible by giving metal processing methods, such as a rolling process method and a punching method, to such an ingot of a metal member.

  Further, as the mounting substrate 15, it is preferable to use a member having good insulation like the insulating member. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, a nitrided body Ceramic materials such as aluminum sintered bodies and silicon nitride sintered bodies, or glass ceramic materials can be used.

  The package 1 of the present embodiment includes a frame body 5 disposed on the upper surface of the substrate 3 so as to surround the placement region 3a. The frame 5 has a through hole 7a (first through hole 7a) that opens to the inner surface and the outer surface. The frame 5 has a quadrangular cylindrical shape on the inner peripheral surface and the outer peripheral surface in plan view, and includes four side wall portions. The frame 5 is bonded to the substrate 3 via a bonding member such as silver solder.

The frame 5 can be set to have an outer periphery of 5 mm or more and 50 mm or less when viewed in plan. The thickness of the frame 5 indicated by the width between the outer periphery and the inner periphery is, for example, 0.5 mm or more and 2 m.
m or less can be set. Moreover, as the height of the frame 5, it can set to 3 mm or more and 30 mm or less, for example.

  As the frame body 5, for example, a member having a good insulating property or a metal member can be used in the same manner as the substrate 3. Examples of members having good insulation include ceramic materials such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body. Can be used. Moreover, as a metal member, metal materials, such as iron, copper, nickel, chromium, cobalt, and tungsten, or the alloy which consists of these metal materials can be used, for example.

  A cylindrical optical fiber holding member 9 (hereinafter also simply referred to as a holding member 9) having a first portion 9a and a second portion 9b is attached to the first through hole 7a. Specifically, the first portion 9 a is located in the first through hole 7 a and joined to the inner peripheral surface of the first through hole 7 a via the brazing material 17. The second portion 9 b is located outside the frame body 5. The inner peripheral surface of the first portion 9a and the inner peripheral surface of the second portion 9b are continuous. And the groove | channel 19 is formed in the outer peripheral surface of the 2nd part 9b along the penetration direction of the 1st through-hole 7a.

  The holding member 9 is a member for holding and fixing the optical fiber. The holding member 9 fixes and positions the optical fiber and has a cylindrical shape, so that light can be transmitted between the optical semiconductor element 11 and the optical fiber through the cylindrical hollow portion. .

  In the package 1 of the present embodiment, a groove 19 is formed in the second portion 9b located outside the frame body 5 along the penetration direction of the first through hole 7a. Therefore, the surplus portion of the brazing material 17 that joins the frame 5 and the optical fiber holding member 9 can be accumulated in the groove 19 in the second portion 9b adjacent to the first portion 9a. Therefore, it is possible to suppress the brazing material 17 from spreading in an unexpected region. Further, since the surplus portion of the brazing material 17 can be stored in the groove 19, the frame body 5 and the optical fiber holding member 9 can be stably joined without using an excessively large amount of brazing material 17.

  At this time, the distance L1 from the central axis X of the first through hole 7a to the bottom of the groove 19 is larger than the inner diameter L2 of the first portion 9a and smaller than the outer diameter L3 of the first portion 9a. Is preferred. This is because the brazing material 17 that joins the inner peripheral surface of the first through hole 7 a and the first portion 9 a is stably accumulated in the groove 19. In the package 1 of the present embodiment, the depth D1 of the groove 19 is larger than the difference D2 between the thickness of the first portion 9a and the thickness of the second portion 9b, and the side end surface of the first portion 9a is the package 1 It is exposed to the side. Therefore, the brazing material 17 can easily flow out into the groove 19, so that the brazing material 17 can be stably accumulated in the groove 19.

  Furthermore, the side end surface of the first portion 9a may be flush with the inner peripheral surface of the frame 5 around the first through hole 7a. As a result, the brazing material 17 filled in the gap between the first through-hole 7a and the outer periphery of the first portion 9a has the first portion due to the surface tension acting on the surface exposed to the inside of the frame 5. It becomes difficult to spread to 9a, and the wetting and spreading to the inner peripheral surface of the holding member 9 is suppressed. Accordingly, the inner diameter of the first portion 9a is suppressed from being reduced by the brazing material 17, and the ferrule cannot be inserted and fixed in the first through hole 7a, or an optical member such as a translucent window material or a lens member. Is prevented from being inserted and fixed in the first through hole 7a.

Further, since the distance L1 from the central axis X of the first through hole 7a to the bottom of the groove 19 is larger than the inner diameter L2 of the first portion 9a, the brazing material 17 collected in the groove 19 is the first through hole. It can suppress flowing out to the inner peripheral surface of the hole 7a. Therefore, the brazing material 17 that has flowed out to the inner peripheral surface of the first through hole 7a reduces the inner diameter of the first portion 9a, and the ferrule cannot be inserted and fixed in the first through hole 7a. The optical member such as the window member and the lens member can be prevented from being inserted and fixed in the first through-hole 7a, and the light transmission between the optical semiconductor element 11 and the optical fiber can be suppressed. Can be good.

  Moreover, it is preferable that the outer diameter of the 2nd part 9b is larger than the outer diameter of the 1st part 9a. When the second portion 9b has such a configuration, a gap is formed between the second portion 9b and the outer surface of the frame 5, so that the brazing material 17 can be fastened to this portion. Further, the brazing material 17 easily flows out into the groove 19 through this gap. Therefore, it is possible to suppress the brazing material 17 from spreading in an unexpected region. Furthermore, the holding member 9 is positioned by the second portion 9b, which is positioned along the penetration direction when inserted and fixed in the first through hole 7a, by the second portion 9b larger than the outer diameter of the first portion 9a. The holding member 9 can be bonded to a desired portion of the frame 5 and can fix the optical fiber at a desired position.

  Further, in the package 1 of the present embodiment, the groove 19 is opened upward. When the groove 19 is formed in this way, the brazing material 17 accumulated in the groove 19 can be prevented from flowing downward, the brazing material 17 can be stably retained in the groove 19, and the brazing material 17 Since the joining area between the material 17 and the holding member 9 does not increase, the thermal stress caused by the difference in thermal expansion coefficient between the brazing material 17 and the holding member 9 can be reduced.

  The groove 19 shown in FIG. 6 has a V-shape formed from two flat side surfaces when viewed from the side, but is not limited thereto. For example, as shown in FIG. 7, when viewed from the side, at least the bottom is preferably curved.

  Due to the difference in thermal expansion coefficient between the brazing material 17 and the holding member 9, thermal stress may be applied from the brazing material 17 to the holding member 9. When the groove 19 is V-shaped, the thermal stress may concentrate on the bottom of the groove 19. However, when the holding member 9 is viewed from the side or when viewed from a cross section perpendicular to the penetrating direction of the first through-hole 7a, when at least the bottom of the groove 19 has a curved shape, the above stress is applied. Concentration can be suppressed. Therefore, the durability of the holding member 9 can be improved.

  The groove 19 in the package 1 of the present embodiment is formed so as to pierce from one end to the other end of the second portion 9b along the penetration direction of the first through hole 7a. It is not something that can be done. As described above, in order for the brazing material 17 to flow stably into the groove 19, the groove 19 needs to be opened on the end side continuous with the first portion 9 a in the second portion 9 b. The groove 19 does not need to be open at the opposite end of the second portion 9b.

  However, when it is required to store a large amount of brazing material 17 in the groove 19, it is formed so as to penetrate from the one end to the other end of the second portion 9 b like the groove 19 in this embodiment. Is preferred. On the other hand, a relatively small amount of brazing material 17 is used, and in order to prevent the brazing material 17 from flowing out from the end portion of the second portion 9b opposite to the end portion continuous with the first portion 9a, a groove is used. It is preferable that 19 has a shape as shown in FIG.

Further, in the package 1 of the present embodiment, the groove 19 may be formed at a position where the distance from the upper surface of the frame 5 to the holding member 9 is the shortest when viewed from the side, that is, at the top of the holding member 9 when viewed from the side. Good. Thereby, the thermal stress generated due to the difference in thermal expansion coefficient between the holding member 9, the frame body 5, the brazing material 17, and the lid body 103 generated when the lid body 103 is attached to the frame body 9 is generated in the groove portion 19. The positional displacement of the holding member 9 and the optical fiber, which is mitigated and caused by applying thermal stress to the holding member 9, is suppressed. As a result, the holding member 9 and the optical fiber are prevented from being misaligned with the optical semiconductor element 11 in the optical semiconductor device 101, and the input / output of optical signals is performed smoothly, so that the optical semiconductor device 101 is normal and stable. Can be activated.

  In the package 1 of this embodiment, one groove 19 is formed, but the present invention is not limited to this. For example, as shown in FIG. 9, a plurality of grooves 19 may be formed. In FIG. 9, three grooves 19 are formed in the second portion 9 b located outside the frame body 5 along the penetration direction of the first through hole 7 a.

  The holding member 9 preferably has a strength at least enough to fix the optical fiber. Specifically, metal members such as iron, copper, nickel, chromium, cobalt, and tungsten, or alloys made of these metals can be used. The cylindrical holding member 9 can be produced by subjecting such an ingot of a metal member to a metal processing method such as a rolling method or a punching method.

  In particular, it is preferable that the frame 5 and the holding member 9 are formed using the same metal member. This is because the difference in thermal expansion between the frame 5 and the holding member 9 can be reduced, so that the stress generated between the frame 5 and the holding member 9 can be reduced.

  The brazing material 17 is not particularly limited as long as the holding member 9 can be satisfactorily joined to the first through hole 7a. For example, gold-tin solder or silver solder can be used.

  When using the optical semiconductor device 101 of the present embodiment, a ferrule (not shown) is fixed to the other end of the holding member 9. The ferrule has a first through hole 7 a that opens at one end with respect to the inside of the cylinder of the holding member 9. Then, an optical fiber is inserted and fixed in the first through hole 7a. Thus, the optical coupling between the optical fiber and the optical semiconductor element 11 can be performed by inserting and fixing the ferrule to the holding member 9.

  As the ferrule, for example, a ceramic material such as zirconia or alumina can be used. As the optical fiber, a light-transmitting material such as quartz glass can be used. The ferrule may be joined to the inner peripheral surface of the cylindrical holding member 9 or may be joined to the end surface of the other end of the holding member 9.

  The frame 5 in the package 1 of the present embodiment has a second through hole 7b separately from the first through hole 7a. The input / output member 21 is inserted and fixed in the second through hole 7b. The second through hole 7b may have the shape of the through hole 7a penetrating from the inner surface to the outer surface as in the case of the first through hole 7a. In addition, a shape that partially opens between the substrate 3 and the frame 5 on the inner peripheral side and the outer peripheral side of the frame 5 may be used.

  The input / output member 21 has an insulating member 23 and a plurality of wiring conductors 25 disposed on the upper surface of the insulating member 23. Signals can be input / output between the optical semiconductor element 11 and an external wiring circuit via these wiring conductors 25. Thus, since the wiring conductor 25 is disposed on the upper surface of the insulating member 23, the insulating member 23 is required to have high insulating properties. As an exemplary size of the insulating member 23, a square plate-shaped member having a side of about 1 to 20 mm and a thickness of about 0.3 to 3 mm when viewed in plan can be used.

As the insulating member 23, like the substrate 3, for example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body are used. Ceramic materials or glass ceramic materials can be used. As the wiring conductor 25, it is preferable to use a member having good conductivity. Specifically, a metal material such as tungsten, molybdenum, nickel, copper, silver, and gold can be used as the wiring conductor 25. The above metal materials may be used alone or as an alloy.

  Next, the element storage package 1 of the second embodiment will be described in detail with reference to the drawings. In addition, in each structure concerning this embodiment, about the structure which has the same function as 1st Embodiment, the same referential mark is attached and the detailed description is abbreviate | omitted. FIG. 10 shows a cross-sectional view corresponding to the cross section in FIG. 3, which is a cross-sectional view of the package of the first embodiment.

  The package 1 of this embodiment is different in the shape of the optical fiber holding member 9 from the package 1 of the first embodiment. Specifically, the holding member 9 in the package 1 of the present embodiment has a cylindrical shape, and is joined to the periphery of the through hole 7 a on the outer surface of the frame body 5 via a brazing material 17. That is, the holding member 9 in the first embodiment has the first portion 9a joined to the through hole 7a of the frame 5 via the brazing material 17, but the holding member 9 in the present embodiment is The first portion 9a is not provided. And the holding member 9 in this embodiment is joined to the periphery of the through-hole 7a in the outer surface of the frame 5 through the brazing material 17 as above-mentioned.

  And the holding member 9 in this embodiment also has the groove | channel 19 similarly to the holding member 9 in 1st Embodiment. That is, the package 1 of the present embodiment includes a substrate 3 having a placement region 3a on which the optical semiconductor element 11 is placed on the upper surface, and an inner surface disposed on the upper surface of the substrate 3 so as to surround the placement region 3a. A frame body 5 having a through hole 7a that opens to the side surface and the outer surface, and a cylindrical optical fiber holding member 9 joined to the periphery of the through hole 7a on the outer surface of the frame body 5 via a brazing material 17 are provided. A groove 19 is formed in the outer peripheral surface of the optical fiber holding member 9 along the penetration direction of the through hole 7a.

  Therefore, it is possible to store an excess of the brazing material 17 that joins the frame body 5 and the optical fiber holding member 9 to the groove 19. Therefore, it is possible to suppress the brazing material 17 from spreading in an unexpected region. Further, since the surplus portion of the brazing material 17 can be stored in the groove 19, the frame body 5 and the optical fiber holding member 9 can be stably joined without using an excessively large amount of brazing material 17.

  In the package 1 of the present embodiment, the distance from the central axis of the through hole 7a to the bottom of the groove 19 is preferably larger than the inner diameter of the through hole 7a. This is because the brazing material 17 accumulated in the groove 19 can be suppressed from flowing out to the inner peripheral surface of the through hole 7a. Therefore, the brazing material 17 that has flowed out to the inner peripheral surface of the first through hole 7a reduces the inner diameter of the first portion 9a, and the ferrule cannot be inserted and fixed in the first through hole 7a. The optical member such as the window member and the lens member can be prevented from being inserted and fixed in the first through-hole 7a, and the light transmission between the optical semiconductor element 11 and the optical fiber can be suppressed. Can be good.

  Further, the groove 19 shown in FIG. 10 is a V-shape formed from two flat side surfaces when viewed from the side, but when viewed in a cross section perpendicular to the penetrating direction of the first through hole 7a. It is preferable that at least the bottom has a curved shape. This is because, as shown in the package 1 of the first embodiment, it is possible to improve the durability of the holding member 9 by suppressing the concentration of stress on the bottom of the groove 19.

Next, an optical semiconductor device 101 according to an embodiment will be described in detail with reference to the drawings. The optical semiconductor device 101 of the present embodiment includes an element housing package 1 typified by the above embodiment, an optical semiconductor element 11 placed in the placement area 3 a of the element housing package 1, and a frame 5. And a lid 103 that seals the optical semiconductor element 11. FIG. 1 illustrates an optical semiconductor device 101 including the package 1 according to the first embodiment.

  In the optical semiconductor device 101 of this embodiment, the optical semiconductor element 11 is mounted on the mounting region 3 a of the substrate 3. The optical semiconductor element 11 is electrically connected to the wiring conductor 25 of the input / output member 21 through a bonding wire. A desired input / output can be obtained from the optical semiconductor element 11 by inputting / outputting an external signal to / from the optical semiconductor element 11 via the wiring conductor 25 or the like.

  The lid 103 is bonded to the frame 5 and is provided so as to seal the optical semiconductor element 11. The lid 103 is joined to the upper surface of the frame 5. The optical semiconductor element 11 is sealed in a space surrounded by the substrate 3, the frame body 5, and the lid body 103. By sealing the optical semiconductor element 11 in this way, deterioration of the optical semiconductor element 11 due to the long-term use of the package 1 can be suppressed.

  As the lid 103, for example, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used. The frame body 5 and the lid body 103 can be joined by, for example, a seam welding method. Moreover, you may join the frame 5 and the cover body 103, for example using gold- tin solder.

  In particular, when the lid body 103 is joined to the frame body 5 using a brazing material such as gold-tin brazing and the groove 19 is open upward, the frame body 5 and the lid body 103. The brazing material that joins can also be stored in the groove 19. Therefore, it is possible to suppress the brazing material joining the frame 5 and the lid 103 from flowing out to an unexpected region.

  The frame body 5 and the lid body 103 may be directly joined. For example, a metal member having a ring shape that overlaps the frame body 5 when viewed in plan, a so-called seal ring 105 is sandwiched therebetween. May be joined together.

  The element storage package 1 and the optical semiconductor device 101 including the element storage package 1 according to each embodiment have been described above, but the present invention is not limited to the above-described embodiment. That is, various modifications and combinations of embodiments may be made without departing from the scope of the present invention.

1 ... Package for element storage (package)
3 ... Substrate 3a ... Placement area 5 ... Frame body 7a ... Through hole (first through hole)
7b: second through hole 9: optical fiber holding member (holding member)
9a ... 1st part 9b ... 2nd part 11 ... Optical semiconductor element 13 ... Screwing hole 15 ... Mounting substrate 17 ... Brazing material 19 ... Groove 21 ... .... Input / output member 23 ... insulating member 25 ... wiring conductor 101 ... optical semiconductor device 103 ... lid 105 ... seal ring

Claims (9)

A substrate having a mounting region on which an optical semiconductor element is mounted;
A frame body that has a through-hole that is disposed on the upper surface of the substrate so as to surround the placement area, and that opens on the inner surface and the outer surface;
A cylindrical first portion joined to the inner peripheral surface of the through-hole via a brazing material, and a cylindrical second portion located outside the frame body; An optical fiber holding member having a continuous peripheral surface and an inner peripheral surface of the second portion;
An element storage package, wherein a groove is formed in an outer peripheral surface of the second portion along a penetration direction of the through hole.   The distance from the central axis of the said through-hole to the bottom part of the said groove | channel is larger than the internal diameter of the said 1st part, and is smaller than the outer diameter of the said 1st part. Package for element storage.   The element storage package according to claim 2, wherein an outer diameter of the second portion is larger than an outer diameter of the first portion.   The element housing package according to claim 1, wherein the groove opens upward.   2. The element storage package according to claim 1, wherein at least a bottom of the groove has a curved shape in a cross section perpendicular to a through direction of the through hole. A substrate having a mounting region on which an optical semiconductor element is mounted;
A frame body that has a through-hole that is disposed on the upper surface of the substrate so as to surround the placement area, and that opens on the inner surface and the outer surface;
An element storage package comprising a cylindrical optical fiber holding member joined via a brazing material around the through hole in the outer surface of the frame body,
A device housing package, wherein a groove is formed in an outer peripheral surface of the optical fiber holding member along a penetration direction of the through hole.   The element storage package according to claim 6, wherein a distance from a central axis of the through hole to a bottom of the groove is larger than an inner diameter of the through hole.   The device housing package according to claim 6, wherein at least a bottom portion of the groove has a curved shape in a cross section perpendicular to a through direction of the through hole. The device storage package according to claim 1 or 6,
An optical semiconductor element placed in the placement area of the element storage package;
An optical semiconductor device comprising: a lid body that is bonded to the upper surface of the frame body and seals the optical semiconductor element.

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