JP2013093494A - Package for housing electronic component and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve such a problem that a holding member of a coaxial cable may be cracked because a base may be warped when a package is screwed to an external circuit board.SOLUTION: In a package 1 for housing an electronic component, a frame 7 has a first sidewall 9 on a straight line connecting a pair of screw portions 5c of a circuit board 5 at a position in parallel with the straight line, and a notch 11 to which an I/O member 13 is fixed is formed in the first sidewall 9 so as to open to the inner side face, the outer side face and the top face. In a region of the notch 11 above the I/O member 13, a joining member 15 having a Young'a modulus lower than that of the frame 7 is provided.

Description

  The present invention relates to an electronic component storage package in which an electronic component such as a semiconductor element is stored, and an electronic device using the same. Such an electronic device can be used for various electronic devices.

  As an electronic component storage package (hereinafter also simply referred to as a package) for storing electronic components, for example, a package described in Patent Document 1 is known. The package described in Patent Document 1 includes a base body and a frame joined to the outer peripheral portion of the upper surface of the base body. A through-hole penetrating the inside and the outside is formed in the frame, and a holding member is clamped in the through-hole. A coaxial connector is inserted into the holding member from the outside of the frame. Screw holes are formed in the base. The package is mounted on the external circuit board by fixing the base body to the external circuit board in the screw holes.

JP 2003-7884 A

  When the package described in Patent Document 1 is screwed to an external circuit board, the base may be warped. At this time, since the frame is fixed to the base, the frame may be deformed along with the deformation of the base. When the base body and the frame body are deformed, the through-hole penetrating the inside and outside of the frame body is also deformed. Along with the deformation of the through hole, the holding member is easily applied with a pressing force from a portion of the frame located above the through hole. For this reason, when the package is to be firmly fixed to the external circuit board, there is a possibility that the holding member cracks or that a gap is formed between the holding member and the frame.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a highly reliable electronic component storage package having good durability.

  An electronic component storage package according to one aspect of the present invention includes a flat plate portion having a mounting area on which an electronic component is mounted on the upper surface, and a pair of screws that are pulled out from the flat plate portion to the sides opposite to each other. And a plurality of side walls including a first side wall having a notch opening at the inner side surface, the outer side surface, and the upper surface, and the straight line on the straight line connecting the pair of screwing portions. The first side wall portion is positioned in parallel, and a frame body is provided on the upper surface of the substrate so as to surround the placement area, and the notch is disposed such that the upper surface is positioned lower than the upper surface of the frame body. An input / output member attached to a part and electrically connected to the electronic component; and a Young's modulus lower than a Young's modulus of the frame body; And a joining member disposed in the region. There.

In the electronic component storage package of the above aspect, there is a notch portion that opens on the inner side surface, the outer side surface, and the upper surface of the frame body between the pair of screw fixing portions that are likely to be greatly warped when the board is screwed. The first side wall is located. An input / output member is attached to the notch. A joining member having a Young's modulus lower than the Young's modulus of the frame is disposed in a region above the input / output member in the notch.

  Thus, since the joining member that is more elastically deformed than the frame body is filled in the above-described region, the stress generated with the deformation of the frame body can be relaxed by the joining member. Therefore, even if a large warp occurs in the substrate, the possibility that a large stress is applied to the input / output member can be reduced. As a result, the electronic component storage package can be made durable and highly reliable.

It is a disassembled perspective view which shows the electronic component storage package of 1st Embodiment, and an electronic apparatus provided with the same. FIG. 2 is a plan view of the electronic component storage package shown in FIG. 1. FIG. 3 is an enlarged cross-sectional view of a region A in FIG. 2, including a frame body and a joining member, and showing a cross section parallel to the upper surface of the substrate. It is sectional drawing in the XX cross section of the electronic component storage package shown in FIG. It is a side view by the side of the 1st side wall part of the electronic component storage package shown in FIG. It is a perspective view which shows the electronic component storage package of 2nd Embodiment. FIG. 7 is a plan view of the electronic component storage package shown in FIG. 6. It is sectional drawing in the YY cross section of the electronic component storage package shown in FIG.

  Hereinafter, an electronic component storage package (hereinafter also simply referred to as a package) of each embodiment and an electronic device including the same will be described in detail with reference to the drawings. However, in the drawings referred to below, for convenience of explanation, among the constituent members of the embodiment, only the main members necessary for explaining the present invention are shown in a simplified manner. Therefore, the package and the electronic device according to the present invention may include arbitrary components not shown in the drawings referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

  As shown in FIGS. 1 to 5, the package 1 of the first embodiment includes a substrate 5 having a placement area 5 a on which an electronic component 3 is placed on the upper surface, and a substrate 5 so as to surround the placement area 5 a. And a frame 7 provided on the upper surface. The substrate 5 includes a flat plate portion 5b having a mounting area 5a on the upper surface and a pair of screwing portions 5c drawn from the flat plate portion 5b to the sides opposite to each other. The frame body 7 includes a plurality of side wall portions including the first side wall portion 9. The 1st side wall part 9 has the notch part 11 opened to an inner surface, an outer surface, and an upper surface. Such a frame body 7 has an upper surface of the substrate 5 on a straight line connecting the pair of screwing portions 5c of the substrate 5 so that the first side wall portion 9 is located in parallel to the straight line and surrounds the mounting region 5a. Is provided.

  In addition, the package 1 of this embodiment includes an input / output member 13 attached to the notch portion 11. At this time, the input / output member 13 is attached such that its upper surface is positioned lower than the upper surface of the frame body 7. The input / output member 13 is electrically connected to the electronic component 3. Furthermore, the package 1 of the present embodiment includes a joining member 15 disposed in a region above the input / output member 13 in the notch portion 11. And the joining member 15 has the Young's modulus lower than the Young's modulus which the frame 7 has, It is characterized by the above-mentioned.

  As described above, since the joining member 15 that is more elastically deformed than the frame body 7 is filled in the region above the input / output member 13 in the notch portion 11, the stress generated along with the deformation of the frame body 7. Can be relaxed by the joining member 15. Therefore, even when a large warp occurs in the substrate 5, the possibility that a large stress is applied to the input / output member 13 can be reduced. As a result, the package 1 can be made durable and highly reliable.

  The substrate 5 in the present embodiment includes a flat plate portion 5b having a placement area 5a on the top surface on which the electronic component 3 is placed, and a pair of screwing portions 5c drawn from the flat plate portion 5b to opposite sides. doing. The flat plate portion 5b has a square plate shape and has a placement area 5a on which the electronic component 3 is placed. Moreover, the screwing part 5c is each pulled out from the four corners of the flat plate part 5b of square plate shape. That is, in the package 1 of the present embodiment, the substrate 5 includes two pairs of screwing portions 5c that are pulled out to the opposite sides. The package 1 can be screwed and fixed to the mounting substrate 103 by screwing holes formed in these screwing portions 5c. The flat plate portion 5b and the screwing portion 5c may be formed separately and then joined together. However, in order to increase the strength of the substrate 5, the flat plate portion 5b and the screwing portion 5c may be integrally formed. preferable.

  In the present embodiment, the placement area 5a means an area that overlaps the electronic component 3 when the substrate 5 is viewed in plan. In the case where the flat plate portion 5b has a square plate shape, the size thereof can be set to, for example, 10 mm to 100 mm on a side. Moreover, as thickness of the board | substrate 5, it can set to 0.3 mm or more and 3 mm or less, for example.

  In the present embodiment, the placement area 5a is formed at the center of the upper surface of the flat plate portion 5b of the substrate 5, but the area where the electronic component 3 is placed is the placement area 5a. There is no problem even if the placement region 5a is formed at the end of the upper surface of the portion 5b. Further, the substrate 5 of the present embodiment has one placement region 5a, but the substrate 5 has a plurality of placement regions 5a, and the electronic component 3 is placed on each placement region 5a. May be.

  The electronic component 3 is disposed in the placement region 5 a on the upper surface of the substrate 5. A bonding wire 17 is electrically connected to the electronic component 3. The electronic component 3 can input and output signals with an external wiring circuit (not shown) via the bonding wire 17 and the lead terminal 41. Thus, the electronic component 3 is disposed on the upper surface of the substrate 5. Therefore, the substrate 5 is required to have high insulation properties at least in a portion where the electronic component 3 is disposed.

  The substrate 5 having high insulation can be produced by laminating a plurality of insulating members. Then, the electronic component 3 is placed on the placement area 5 a of the substrate 5. As the insulating member, for example, a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body may be used. it can. Further, a glass ceramic material may be used instead of these ceramic materials.

  A mixing member is prepared by mixing the raw material powder containing these glass powder and ceramic powder, an organic solvent, and a binder. A plurality of ceramic green sheets are produced by forming the mixed member into a sheet. A plurality of laminated bodies are produced by laminating the produced ceramic green sheets. The substrate 5 is manufactured by integrally firing the plurality of laminated bodies at a temperature of about 1600 degrees.

  The substrate 5 is not limited to a configuration in which a plurality of insulating members are stacked. The board | substrate 5 may be comprised by one insulating member. Moreover, since it is calculated | required that the board | substrate 5 has high insulation in the part by which the electronic component 3 is arrange | positioned at least, it is good also as a structure which laminated | stacked the insulating member on the metal member, for example. In particular, when high heat dissipation is required for the substrate 5, the substrate 5 preferably has the above-described configuration. This is because the metal member has high heat dissipation. By setting it as the structure which laminated | stacked the insulating member on the metal member, the heat dissipation of the board | substrate 5 can be improved.

  Specifically, an insulating mounting substrate 19 may be provided like the substrate 5 in the present embodiment. In the package 1 in the present embodiment, the substrate 5 is made of a metal member, and the mounting substrate 19 is disposed on the mounting region 5 a of the substrate 5. The electronic component 3 is placed on the placement board 19.

  Specifically, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used as the metal member. The metal member which comprises the board | substrate 5 is producible by giving metal processing methods, such as a rolling method and a punching method, to such an ingot of a metal member.

  As the mounting substrate 19, it is preferable to use a member having good insulation like the insulating member. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, and an aluminum nitride material are used. Ceramic materials such as sintered bodies and silicon nitride-based sintered bodies, or glass ceramic materials can be used.

  The package 1 of the present embodiment includes a frame body 7 disposed on the upper surface of the substrate 5 so as to surround the placement region 5a. The frame body 7 includes a plurality of side wall portions including the first side wall portion 9. Specifically, the frame body 7 has a substantially rectangular cylindrical shape on the inner peripheral surface and the outer peripheral surface in plan view, and is configured by four side wall portions. The first side wall portion 9 is one of these four side wall portions.

  The 1st side wall part 9 has the notch part 11 opened to an inner surface, an outer surface, and an upper surface. Such a frame body 7 has an upper surface of the substrate 5 on a straight line connecting the pair of screwing portions 5c of the substrate 5 so that the first side wall portion 9 is located in parallel to the straight line and surrounds the mounting region 5a. And bonded to the substrate 5 via a bonding material (not shown). Examples of the bonding material include gold-tin brazing and silver brazing.

  The frame body 7 can set the outer periphery in a plan view to 10 mm or more and 100 mm or less on a side. Moreover, the thickness of the frame 7 shown by the width | variety between an outer periphery and an inner periphery can be set to 0.5 mm or more and 2 mm or less, for example. Moreover, as the height of the frame 7, it can set to 3 mm or more and 30 mm or less, for example.

  As the frame body 7, for example, a member having good insulating properties can be used in the same manner as the substrate 5. Examples of members having good insulation include ceramic materials such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body. Can be used. Further, a glass ceramic material may be used instead of these ceramic materials.

  In addition to the above-described members having good insulation properties, for example, metal members such as iron, copper, nickel, chromium, cobalt, and tungsten, or alloys made of these metals may be used as the frame 7. it can. A plurality of plate-like members constituting the frame body 7 can be produced by subjecting such an ingot of the metal member to a metal working method such as a rolling method or a punching method. Further, the frame body 7 may be composed of one member, but may be a laminated structure of a plurality of members.

  The first side wall 9 of the frame 7 in the package 1 of the present embodiment has a first through hole 21 that opens to the inner surface and the outer surface. Specifically, the first through hole 21 is formed on the lower surface side of the first side wall portion 9 to be bonded to the substrate 5 and has a shape that opens to the lower surface, the inner surface, and the outer surface of the first side wall portion 9. It is.

  A part of the input / output member 13 (first input / output member 13) is inserted and fixed in the first through hole 21. The first input / output member 13 includes a first insulating member 23, a second insulating member 25, and a wiring conductor 27. The first input / output member 13 is a member that electrically connects the electronic component 3 and external wiring via the wiring conductor 27. The first insulating member 23 is disposed on the upper surface of the substrate 5.

  The wiring conductor 27 is electrically connected to the line conductor 29 and the line conductor 29 located on the upper surface of the first insulating member 23 and surrounded by the frame body 7, and is drawn out to the outside of the frame body 7. And a distribution cable 31. The second insulating member 25 is disposed on the top surfaces of the first insulating member 23 and the wiring conductor 27 so that one end and the other end of the wiring conductor 27 are exposed. At this time, one end of the wiring conductor 27 is located in a region surrounded by the frame body 7, and the other end is drawn out to the inner surface of the recess. One end of the wiring conductor 27 is electrically connected to the electronic component 3 via the bonding wire 17. It is preferable that a portion of the wiring cable 31 positioned outside the frame body 7 is covered with an insulating covering member 33.

  In the first input / output member 13 in the present embodiment, gaps are formed between the first insulating member 23 and the second insulating member 25 so as to open inside and outside the frame body 7, respectively. In other words, the insulating member constituted by the first insulating member 23 and the second insulating member 25 has a through-hole penetrating between the inside and the outside of the frame body 7.

  Further, a ground conductor (not shown) is disposed on the inner peripheral surface of the through hole, and the wiring cable 31 is separated from the ground conductor, and is inserted and fixed in the through hole with a gap between the ground conductor. ing. That is, a coaxial cable is formed by the wiring cable 31 and the ground conductor. An insulator may be provided between the wiring cable 31 and the ground conductor, and a gap may be provided between the wiring cable 31 and the ground conductor.

  In particular, when the space between the wiring cable 31 and the ground conductor is an air gap, the characteristic configuration of the package 1 of the present embodiment is particularly effective. When a large stress is applied to the first input / output member 13 from the substrate 5 and the frame body 7 in accordance with the deformation of the substrate 5 as in the conventional package 1, the distance between the wiring cable 31 and the ground conductor changes. The signal transmission characteristics in the wiring cable 31 may be greatly affected. However, in the package 1 of the present embodiment, the stress applied to the first input / output member 13 can be relaxed by the bonding member 15, so that it is possible to suppress a change in the interval between the wiring cable 31 and the ground conductor.

  In the package 1 of the present embodiment, the wiring conductor 27 and the electronic component 3 are electrically connected via the bonding wire 17, but the present invention is not limited to this. For example, a connection conductor in which one end is electrically connected to the wiring conductor 27 and the other end is routed to the placement region 5a is disposed on the upper surface of the substrate 5, and thus A simple conductor and the electronic component 3 may be connected.

  In the package 1 of the present embodiment, the wiring conductor 27 is constituted by the line conductor 29 and the wiring cable 31, but the wiring conductor 27 is not limited to such a configuration. The upper surface of the first insulating member 23 may be configured by only the line conductor 29 drawn from the region surrounded by the frame body 7 to the outside of the frame body 7. When the wiring conductor 27 has such a configuration, the wiring conductor 27 and an external wiring circuit may be electrically connected using the lead terminal 41 or the like.

As an exemplary size of the first insulating member 23, the width of the short side direction parallel to the drawing direction of the wiring conductor 27 in a plan view is about 1 to 20 mm, and the drawing of the wiring conductor 27 in a plan view. A square plate-shaped member having a width in the longitudinal direction perpendicular to the direction of about 2 to 20 mm and a thickness of about 0.5 to 10 mm can be used. As the first insulating member 23, a member having a good insulating property may be used similarly to the insulating member.

  The wiring conductor 27 is a member for electrically connecting an external wiring circuit and the electronic component 3 via a coaxial connector, a lead terminal 41, or the like. As the wiring conductor 27, it is preferable to use a member having good conductivity. Specifically, a metal material such as tungsten, molybdenum, nickel, copper, silver, and gold can be used as the wiring conductor 27. The above metal materials may be used alone or as an alloy.

  The second insulating member 25 in the present embodiment has a square plate shape. As an exemplary size, the width in the short direction parallel to the drawing direction of the wiring conductor 27 in a plan view is about 0.5 to 19.5 mm, and is perpendicular to the drawing direction of the wiring conductor 27 in a plan view. A square plate-shaped member having a width in the longitudinal direction of about 2 to 20 mm and a thickness of about 0.5 to 10 mm can be used. As the second insulating member 25, a member having good insulating properties may be used similarly to the first insulating member 23.

  The first side wall 9 has a groove 35 that is above the first input / output member 13, is connected to the first through-hole 21, and opens on the inner surface, the outer surface, and the upper surface. That is, the notch 11 is formed by the first through hole 21 and the groove 35. At this time, since the groove portion 35 is positioned above the first input / output member 13, in other words, the upper surface of the first input / output member 13 is positioned lower than the upper surface of the frame body 7. It is attached to the notch 11.

  When the groove 35 is not provided, the first input / output member 13 is sandwiched between the substrate 5 and the frame body 7. Therefore, when deformation such as warpage occurs in the substrate 5, the first through hole 21 may be deformed and a large pressing force may be applied to the first input / output member 13 from the substrate 5 and the frame body 7. As a result, a crack is generated in the substrate 5, the frame body 7, or the first input / output member 13, or a gap is formed in a joint portion between these members, and the possibility that the airtightness of the package 1 is lowered is increased.

  However, in the package 1 of the present embodiment, the groove portion 35 that opens above the first input / output member 13 and opens to the inner side surface, the outer side surface, and the upper surface so as to be connected to the first through hole 21 is provided in the first portion. The side wall part 9 has. A joining member 15 having a Young's modulus lower than the Young's modulus of the frame body 7 is disposed in the groove portion 35 that is the region above the first input / output member 13 in the notch portion 11. For this reason, the bonding member 15 is easily deformed even when the substrate 5 is warped due to the screwing of the substrate 5, so that the first input / output member 13 is formed from the substrate 5 and the frame body 7. The pressing force applied to the can be reduced. Therefore, the durability of the package 1 can be increased and the airtightness can be improved.

  The notch 11 in the package 1 of the present embodiment is a first through hole 21 (first portion) to which the input / output member 13 is attached and a first position located above the first through hole 21. The through-hole 21 and the groove portion 35 (second portion) that is continuous are provided. At this time, as shown in FIG. 5, the upper surface of the substrate 5 in the second portion and the first width are larger than the width W1 in the direction parallel to the upper surface of the substrate 5 and the inner surface of the first side wall portion 9 in the first portion. The width W2 in the direction parallel to the inner surface of the one side wall 9 is small. Therefore, the first side wall 9 is positioned so as to face at least part of the upper surface of the first input / output member 13.

By forming the notch portion 11 in this way, the first input / output member 13 can be stably positioned in the height direction. The width of the second portion may be about 5 to 50% of the width of the first portion, and is preferably about 10 to 20%. When the width of the first part and the width of the second part are different, the average value of the width of the first part and the average value of the width of the second part may be compared.

  In order to suppress a change in the distance between the wiring cable 31 and the ground conductor, or to prevent the line conductor 29 from being disconnected due to a large stress applied to the input / output member 13, the second portion is a wiring conductor. It is preferable that it is located just above 27. The first side wall portion 9 has a relatively large stress relaxation effect on the input / output member 13 in the vicinity of the portion where the second portion is formed. Since the portion where the stress relaxation effect is large is located immediately above the wiring conductor 27, it is possible to suppress the transmission characteristic of the wiring conductor 27 from changing.

  Further, in order to enhance the effect of stress relaxation from the frame 7 to the input / output member 13 by the notch 11, the notch 11 is provided in the longitudinal direction of the first side wall 9 (the left-right direction in FIGS. 2 and 5). It is preferably formed in the center. A portion of the first side wall portion 9 located on one side of the pair of screwing portions 5c from the notch portion 11, a portion located on the other side of the pair of screwing portions 5c from the notch portion 11, This is because the stress relaxation bias between the two can be reduced. That is, since the bias of the stress applied to the input / output member 13 from the frame body 7 can be reduced, it is possible to suppress the above-described stress from locally increasing.

  The package 1 of this embodiment includes a joining member 15 disposed in a region above the input / output member 13 in the notch portion 11. The joining member 15 has a Young's modulus lower than the Young's modulus of the frame body 7. Since the joining member 15 that is more easily elastically deformed than the frame body 7 is filled in the region above the input / output member 13 in the cutout portion 11, the stress that occurs with the deformation of the frame body 7 is applied to the joining member 15. Can be relaxed.

  The joining member 15 is a member that joins the input / output member 13 and the frame body 7. For this reason, the joining member 15 is disposed at least in the region above the input / output member 13 in the notch 11, but it does not mean that the joining member 15 is disposed only in this region. In the package 1 of the present embodiment, the joining member 15 is disposed on the entire surface of the notch 11 so as to surround the input / output member 13. As a result, the bondability between the input / output member 13 and the frame 7 is improved.

  Further, the joining member 15 may protrude from the notch portion 11. For example, in the package 1 of this embodiment, as shown in FIG. 2, a part of the joining member 15 protrudes outside the frame body 7. At this time, it is preferable that the surface of the bonding member 15 that protrudes from the notch 11 and is exposed in a cross section parallel to the upper surface of the substrate 5 has a curved shape.

  As shown in FIG. 2, when the surface of the notch 11 has a convex curved surface shape, the internal stress is concentrated in a specific region of the joining member 15 when the joining member 15 is deformed along with the deformation of the frame body 7. Can be suppressed. Therefore, it is possible to suppress the possibility that the joining member 15 is cracked or the joining member 15 is peeled off from the frame body 7 or the input / output member 13.

  In the package 1 of the present embodiment, the joining member 15 protrudes from the notch 11 and the surface exposed at this part has a convex curved surface shape. For example, the entire joining member 15 is in the notch 11. Even if the surface exposed from the notch 11 is a concave curved surface, the concentration of internal stress on a specific region of the joining member 15 can be similarly suppressed.

  As the bonding member 15, for example, a resin member or a brazing material can be used. As a resin part agent, a silicone resin, an acrylic resin, and an epoxy resin are mentioned, for example. Examples of the brazing material include gold-tin brazing and silver brazing.

  For example, when the frame 7 uses Fe-Ni-Co of about 140 GPa or Cu-W of about 250-300 GPa, and the joint member 15 uses gold-tin solder of about 60 GPa, the joint member 15 Is smaller than the Young's modulus of the frame body 7. Therefore, the stress applied to the input / output member 13 from the substrate 5 and the frame body 7 can be reduced. The Young's modulus of the joining member 15 is preferably 3/4 or less, more preferably 1/2 or less, of the Young's modulus of the frame body 7.

  The frame body 7 in the present embodiment is not only the first through hole 21 formed in the first side wall part 9 but also the second through hole formed in a side wall part different from the first side wall part 9. have. Similar to the first through hole 21, the second through hole has a shape that opens to the lower surface, the inner peripheral surface, and the outer peripheral surface of the frame body 7. A part of the second input / output member 37 is inserted and fixed in the second through hole. The second input / output member 37 includes an insulating member and a wiring conductor, and has the same configuration as that of the first input / output member 13.

  While the first through hole 21 into which the first input / output member 13 is inserted and fixed is formed in the first side wall portion 9 located on a straight line connecting the pair of screwing portions 5c of the substrate 5, The second through hole into which the second input / output member 37 is inserted and fixed is formed in another side wall portion that is not located on a straight line connecting the pair of screwing portions 5 c of the substrate 5. Therefore, even when the substrate 5 is deformed such as warping when the substrate 5 is screwed, the deformation of the second through hole is relatively small. Therefore, the groove portion may not be formed above the second through hole.

  In the package 1 of the present embodiment, an optical semiconductor element is used as the electronic component 3. Examples of the optical semiconductor element include a light emitting element that emits light to an optical fiber, typified by an LD element, and a light receiving element that receives light to the optical fiber, typified by a PD element. When such an optical semiconductor element is used, it is necessary to perform optical coupling between the optical semiconductor element and the optical fiber.

  In the frame body 7 in this embodiment, an opening is formed separately from the first through hole 21 and the second through hole, and a cylindrical shape optically coupled to the optical semiconductor element is formed in the opening. An optical fiber holding member 39 is fixed. An optical fiber is held by the optical fiber holding member 39. Therefore, optical coupling can be performed between the optical semiconductor element and the optical fiber. The cylindrical optical fiber holding member 39 is a member for fixing and positioning the optical fiber. Further, since the optical fiber holding member 39 is cylindrical, light can be transmitted between the optical semiconductor element and the optical fiber through the cylindrical hollow portion.

  The optical fiber holding member 39 preferably has a strength that can at least fix the optical fiber. Specifically, metal members such as stainless steel, iron, copper, nickel, chromium, cobalt, and tungsten, or alloys made of these metals can be used. The cylindrical optical fiber holding member 39 can be manufactured by subjecting such an ingot of a metal member to a metal processing method such as a rolling method or a punching method.

  In particular, the frame body 7 and the optical fiber holding member 39 are preferably formed using the same metal member. This is because the difference in thermal expansion between the frame body 7 and the optical fiber holding member 39 can be reduced, so that the stress generated between the frame body 7 and the optical fiber holding member 39 can be reduced.

When the electronic apparatus 101 of this embodiment is used, a ferrule is fixed to the other end of the optical fiber holding member 39. The ferrule has a through-hole whose one end opens to the inside of the tube of the optical fiber holding member 39. Then, an optical fiber is inserted and fixed in this through hole. In this manner, the ferrule is inserted and fixed to the optical fiber holding member 39, so that the optical fiber and the electronic component 3 can be optically coupled.

  As the ferrule, for example, a ceramic material such as zirconia or alumina can be used. As the optical fiber, a light-transmitting material such as quartz glass can be used. In addition, although the ferrule in this embodiment is being fixed to the internal peripheral surface of the cylindrical optical fiber holding member 39, it is not restricted to this. For example, you may fix by joining a ferrule to the end surface of the other end part of the optical fiber holding member 39.

  Next, the electronic component storage package 1 according to the second embodiment will be described in detail with reference to the drawings. In addition, in each structure concerning this embodiment, about the structure which has the same function as 1st Embodiment, the same referential mark is attached and the detailed description is abbreviate | omitted.

  The package 1 of the second embodiment differs from the package 1 of the first embodiment in the shape of the notch 11. Specifically, as shown in FIGS. 6 to 8, the notch portion 11 in the package 1 of the present embodiment includes a first through hole 21 that opens to the inner side surface and the outer side surface of the first side wall portion 9, and Above the input / output member 13, it is connected to the first through-hole 21, and has either the inner side surface or the outer side surface of the first side wall portion 9 and a groove portion 35 that opens to the upper surface.

  That is, the notch portion 11 in the present embodiment has the first through hole 21 that opens to the inner side surface and the outer side surface of the first side wall portion 9 in the same manner as the notch portion 11 in the first embodiment. ing. Moreover, while the groove part 35 in 1st Embodiment is opening to both the inner surface and the outer surface of the 1st side wall part 9, the groove part 35 in this embodiment is the inside of the 1st side wall part 9. It opens to either one of the side surface and the outer surface.

  In the present embodiment, the thickness of the portion of the first sidewall 9 where the groove 35 is formed is smaller than the thickness of the other portion of the first sidewall 9. Therefore, the part in which the groove part 35 was formed becomes easy to deform | transform. When the first side wall 9 that is a side wall located on a straight line connecting the pair of screwing portions 5c of the substrate 5 and parallel to the straight line is deformed due to the screwing of the substrate 5, the above-mentioned The portion where the groove 35 is formed is deformed. Since the relatively easily deformable portion is located above the input / output member 13, the stress applied to the input / output member 13 from the frame 7 can be reduced.

  The effect of suppressing the stress applied to the input / output member 13 from the frame 7 in the package 1 of the present embodiment is smaller than that of the package 1 of the first embodiment, but on the other hand, the frame in the package 1 of the present embodiment. 7, the shape of the frame body 7 is stably maintained as compared with the package 1 of the first embodiment because the frame body 7 has a constant thickness in the portion where the groove portion 35 is formed. It becomes possible to do.

  The thickness of the first side wall 9 in the portion where the groove 35 is formed may be about 5 to 50% of the thickness of the other portion in the first side wall 9. In addition, when the thickness of the part in which the groove part 35 in the 1st side wall part 9 was formed, and the thickness of said other part each have dispersion | variation, what is necessary is just to compare the average value of the thickness of each part.

  Next, an electronic device 101 according to an embodiment will be described in detail with reference to the drawings. The electronic device 101 of this embodiment includes an electronic component storage package 1 typified by the above embodiment, an electronic component 3 placed in the placement region 5 a of the electronic component storage package 1, and a frame 7. And a lid 105 that seals the electronic component 3. FIG. 1 illustrates an electronic device 101 including the package 1 of the first embodiment.

  In the electronic device 101 of this embodiment, the electronic component 3 is placed on the placement area 5 a of the substrate 5. The electronic component 3 is electrically connected to the wiring conductor 27 of the input / output member 13 via the bonding wire 17. A desired output can be obtained from the electronic component 3 by inputting an external signal to the electronic component 3 through the wiring conductor 27 or the like. As the electronic component 3, in addition to the above-described optical semiconductor element, for example, a component such as an IC element or a capacitor can be used.

  The lid body 105 is joined to the frame body 7 so as to seal the electronic component 3. The lid body 105 is joined to the upper surface of the frame body 7. The electronic component 3 is sealed in a space surrounded by the substrate 5, the frame body 7, and the lid body 105. By sealing the electronic component 3 in this way, deterioration of the electronic component 3 due to the long-term use of the package 1 can be suppressed.

  As the lid 105, for example, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used. The frame body 7 and the lid body 105 can be joined by, for example, a seam welding method. Moreover, you may join the frame 7 and the cover body 105, for example using gold- tin solder.

  Further, the frame body 7 and the lid body 105 may be directly joined. For example, a metal member having a ring shape that overlaps the frame body 7 when viewed in plan, a so-called seal ring is interposed therebetween. It may be joined.

  As mentioned above, although the electronic component storage package of each embodiment and the electronic apparatus provided with the same have been described, the present invention is not limited to the above-described embodiment. That is, various modifications and combinations of embodiments may be made without departing from the scope of the present invention.

1 ... Electronic component storage package (package)
DESCRIPTION OF SYMBOLS 3 ... Electronic component 5 ... Board | substrate 5a ... Mounting area 5b ... Flat plate part 5c ... Screwing part 7 ... Frame body 9 ... 1st side wall part 11 ... Notch 13: Input / output member (first input / output member)
DESCRIPTION OF SYMBOLS 15 ... Bonding member 17 ... Bonding wire 19 ... Mounting substrate 21 ... 1st through-hole 23 ... 1st insulating member 25 ... 2nd insulating member 27 ... Wiring conductor 29 ... line conductor 31 ... wiring cable 33 ... covering member 35 ... groove 37 ... second input / output member 39 ... optical fiber holding member 41 ... lead terminal 101 ... Electronic device 103 ... Mounting board 105 ... Cover body

Claims (7)

A substrate having a flat plate portion having a mounting area on which an electronic component is mounted on the upper surface, and a pair of screwing portions drawn from the flat plate portion to the sides opposite to each other;
The first side wall includes a plurality of side wall parts including a first side wall part having a notch part opened to the inner side surface, the outer side surface, and the upper surface, and is parallel to the straight line on a straight line connecting the pair of screwing parts. The frame is provided so as to surround the placement region on the upper surface of the substrate,
An input / output member electrically connected to the electronic component attached to the notch so that the upper surface is positioned lower than the upper surface of the frame;
An electronic component storage package comprising a bonding member having a Young's modulus lower than a Young's modulus of the frame and disposed in a region of the cutout portion above the input / output member.   The notch has a first part to which the input / output member is attached and a second part located above the first part, and the second part is larger than the width of the first part. The electronic component storage package according to claim 1, wherein a width of the electronic component is small.   3. The input / output member includes an insulating member and a wiring conductor drawn from the inside to the outside of the frame, and the second portion is located immediately above the wiring conductor. Package for electronic component storage as described in 1. The insulating member has a through-hole penetrating between the inside and the outside of the frame,
A ground conductor is disposed on the inner peripheral surface of the through hole, and the wiring conductor is inserted and fixed to the through hole via an insulator,
The electronic component storage package according to claim 3, wherein a coaxial cable is formed by the wiring conductor and the ground conductor.   2. The electronic component storage package according to claim 1, wherein the cutout portion is formed at a center in a longitudinal direction of the first side wall portion.   2. The electronic component storing package according to claim 1, wherein a surface of the bonding member exposed from the notch is curved in a cross section parallel to the upper surface of the substrate. The electronic component storage package according to claim 1;
An electronic component placed in the placement area of the electronic component storage package;
An electronic device comprising: a lid body that seals the electronic component joined to an upper surface of the frame body.

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