JP2013005446A - 非圧電層を備えたバルク音響共振器 - Google Patents

非圧電層を備えたバルク音響共振器 Download PDF

Info

Publication number
JP2013005446A
JP2013005446A JP2012135371A JP2012135371A JP2013005446A JP 2013005446 A JP2013005446 A JP 2013005446A JP 2012135371 A JP2012135371 A JP 2012135371A JP 2012135371 A JP2012135371 A JP 2012135371A JP 2013005446 A JP2013005446 A JP 2013005446A
Authority
JP
Japan
Prior art keywords
layer
piezoelectric layer
electrode
piezoelectric
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012135371A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013005446A5 (enExample
Inventor
Burak Dariusz
ダリウズ・ブラク
Kaitila Jyrki
ジルキ・カイティラ
Shirakawa Alexandre
アレキサンドル・シラカワ
Handman Martin
マルティン・ハンドマン
Nickel Phil
フィル・ニッケル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Avago Technologies Wireless IP Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Technologies Wireless IP Singapore Pte Ltd filed Critical Avago Technologies Wireless IP Singapore Pte Ltd
Publication of JP2013005446A publication Critical patent/JP2013005446A/ja
Publication of JP2013005446A5 publication Critical patent/JP2013005446A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/173Air-gaps
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46Filters
    • H03H9/54Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/58Multiple crystal filters
    • H03H9/582Multiple crystal filters implemented with thin-film techniques
    • H03H9/583Multiple crystal filters implemented with thin-film techniques comprising a plurality of piezoelectric layers acoustically coupled
    • H03H9/585Stacked Crystal Filters [SCF]

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2012135371A 2011-06-16 2012-06-15 非圧電層を備えたバルク音響共振器 Pending JP2013005446A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/161,946 US8330325B1 (en) 2011-06-16 2011-06-16 Bulk acoustic resonator comprising non-piezoelectric layer
US13/161,946 2011-06-16

Publications (2)

Publication Number Publication Date
JP2013005446A true JP2013005446A (ja) 2013-01-07
JP2013005446A5 JP2013005446A5 (enExample) 2015-07-16

Family

ID=47228671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012135371A Pending JP2013005446A (ja) 2011-06-16 2012-06-15 非圧電層を備えたバルク音響共振器

Country Status (3)

Country Link
US (1) US8330325B1 (enExample)
JP (1) JP2013005446A (enExample)
DE (1) DE102012210160B4 (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014195001A (ja) * 2013-03-29 2014-10-09 Ngk Insulators Ltd 圧電/電歪素子
JP2015095729A (ja) * 2013-11-11 2015-05-18 太陽誘電株式会社 圧電薄膜共振器、フィルタおよびデュプレクサ
JP2018007230A (ja) * 2016-07-07 2018-01-11 サムソン エレクトロ−メカニックス カンパニーリミテッド. 音響共振器及びその製造方法
KR20180006248A (ko) * 2016-07-07 2018-01-17 삼성전기주식회사 음향 공진기 및 그 제조 방법
JP2019198066A (ja) * 2018-03-28 2019-11-14 コーボ ユーエス,インコーポレイティド 埋め込み型境界リングを備えた結合共振器フィルタ
JP2022080885A (ja) * 2020-11-18 2022-05-30 シアン サン、ニアン 磁気電気アンテナアレイ
WO2022230723A1 (ja) * 2021-04-30 2022-11-03 株式会社村田製作所 弾性波装置
JP2023522485A (ja) * 2020-06-09 2023-05-30 見聞録(浙江)半導体有限公司 薄膜バルク音波共振器及びその製造工程
US11784628B2 (en) 2018-12-14 2023-10-10 Qorvo Us, Inc. Bi-polar border region in piezoelectric device

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010013197A2 (en) * 2008-08-01 2010-02-04 Ecole polytechnique fédérale de Lausanne (EPFL) Piezoelectric resonator operating in thickness shear mode
US8962443B2 (en) 2011-01-31 2015-02-24 Avago Technologies General Ip (Singapore) Pte. Ltd. Semiconductor device having an airbridge and method of fabricating the same
US9425764B2 (en) 2012-10-25 2016-08-23 Avago Technologies General Ip (Singapore) Pte. Ltd. Accoustic resonator having composite electrodes with integrated lateral features
US9401692B2 (en) 2012-10-29 2016-07-26 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator having collar structure
US9490771B2 (en) 2012-10-29 2016-11-08 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator comprising collar and frame
US9484882B2 (en) 2013-02-14 2016-11-01 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator having temperature compensation
US9590165B2 (en) 2011-03-29 2017-03-07 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator comprising aluminum scandium nitride and temperature compensation feature
US9748918B2 (en) 2013-02-14 2017-08-29 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator comprising integrated structures for improved performance
US9490418B2 (en) 2011-03-29 2016-11-08 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator comprising collar and acoustic reflector with temperature compensating layer
US9444426B2 (en) 2012-10-25 2016-09-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Accoustic resonator having integrated lateral feature and temperature compensation feature
US9917567B2 (en) 2011-05-20 2018-03-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Bulk acoustic resonator comprising aluminum scandium nitride
US9154111B2 (en) * 2011-05-20 2015-10-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Double bulk acoustic resonator comprising aluminum scandium nitride
US9473106B2 (en) * 2011-06-21 2016-10-18 Georgia Tech Research Corporation Thin-film bulk acoustic wave delay line
JP5792554B2 (ja) * 2011-08-09 2015-10-14 太陽誘電株式会社 弾性波デバイス
US8797123B2 (en) * 2011-09-14 2014-08-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Double film bulk acoustic resonator having electrode edge alignments providing improved quality factor or electromechanical coupling coefficient
US9525399B2 (en) * 2011-10-31 2016-12-20 Avago Technologies General Ip (Singapore) Pte. Ltd. Planarized electrode for improved performance in bulk acoustic resonators
CN102904546B (zh) * 2012-08-30 2016-04-13 中兴通讯股份有限公司 一种温度补偿能力可调节的压电声波谐振器
US10804877B2 (en) * 2014-01-21 2020-10-13 Avago Technologies International Sales Pte. Limited Film bulk acoustic wave resonator (FBAR) having stress-relief
US9853626B2 (en) 2014-03-31 2017-12-26 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator comprising acoustic redistribution layers and lateral features
US9548438B2 (en) 2014-03-31 2017-01-17 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator comprising acoustic redistribution layers
US9991872B2 (en) * 2014-04-04 2018-06-05 Qorvo Us, Inc. MEMS resonator with functional layers
US9998088B2 (en) 2014-05-02 2018-06-12 Qorvo Us, Inc. Enhanced MEMS vibrating device
US10340885B2 (en) 2014-05-08 2019-07-02 Avago Technologies International Sales Pte. Limited Bulk acoustic wave devices with temperature-compensating niobium alloy electrodes
FR3047355B1 (fr) * 2016-02-01 2019-04-19 Soitec Structure hybride pour dispositif a ondes acoustiques de surface
US10873316B2 (en) 2017-03-02 2020-12-22 Samsung Electro-Mechanics Co., Ltd. Acoustic resonator and method of manufacturing the same
DE102018104712B4 (de) 2018-03-01 2020-03-12 RF360 Europe GmbH Verfahren zum Ausbilden einer Aluminiumnitridschicht
US12155368B2 (en) * 2018-07-20 2024-11-26 Global Communication Semiconductors, Llc Support structure for bulk acoustic wave resonator
US11502667B2 (en) 2019-01-14 2022-11-15 Qorvo Us, Inc. Top electrodes with step arrangements for bulk acoustic wave resonators
WO2021021748A1 (en) 2019-07-31 2021-02-04 QXONIX Inc. Structures, acoustic wave resonators, devices and systems
US12451860B2 (en) 2019-07-31 2025-10-21 QXONIX Inc. Structures, acoustic wave resonators, devices and systems
US12445109B2 (en) 2019-07-31 2025-10-14 QXONIX Inc. Structures, acoustic wave resonators, layers, devices and systems
US12431861B2 (en) 2019-07-31 2025-09-30 Qxoniix Inc. Layers, structures, acoustic wave resonators, devices and systems
CN111010121A (zh) * 2019-10-18 2020-04-14 天津大学 带不导电插入层的体声波谐振器、滤波器和电子设备
CN115461988A (zh) * 2020-04-24 2022-12-09 华为技术有限公司 具有改进的压电极化均匀性的体声波器件
US12329035B2 (en) 2021-06-29 2025-06-10 Global Communication Semiconductors, Llc Bulk acoustic wave resonator with improved structures
WO2024058904A2 (en) * 2022-09-16 2024-03-21 Qorvo Us, Inc. Baw resonator with zero-coupling in border regions

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000332570A (ja) * 1999-05-24 2000-11-30 Kyocera Corp 圧電共振子
JP2002223144A (ja) * 2000-12-21 2002-08-09 Agilent Technol Inc バルク弾性共振器周辺反射システム
JP2003505905A (ja) * 1999-07-19 2003-02-12 ノキア コーポレイション 共振子構造及びそのような共振子構造を有するフィルター
JP2004312611A (ja) * 2003-04-10 2004-11-04 Ube Ind Ltd 窒化アルミニウム薄膜及びそれを用いた圧電薄膜共振子
JP2005303573A (ja) * 2004-04-09 2005-10-27 Toshiba Corp 薄膜圧電共振器及びその製造方法
JP2007006501A (ja) * 2005-06-23 2007-01-11 Avago Technologies Wireless Ip (Singapore) Pte Ltd 交互配列の縁部構造を利用した音響共振器の性能向上
JP2007510383A (ja) * 2003-10-30 2007-04-19 アバゴ・テクノロジーズ・ジェネラル・アイピー(シンガポール)プライベート・リミテッド 制御可能な通過帯域幅を有する減結合スタック型バルク音響共振器の帯域フィルタ
JP2009100464A (ja) * 2007-09-25 2009-05-07 Panasonic Electric Works Co Ltd 共振装置およびその製造方法

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6165507A (ja) * 1984-09-06 1986-04-04 Nec Corp 薄膜圧電振動子の製造方法
FR2635247B1 (fr) 1988-08-05 1990-10-19 Thomson Csf Transducteur piezoelectrique pour generer des ondes de volume
US5587620A (en) 1993-12-21 1996-12-24 Hewlett-Packard Company Tunable thin film acoustic resonators and method for making the same
DE69836011T2 (de) 1998-01-16 2007-05-24 Mitsubishi Denki K.K. Piezoelektrische dünnschichtanordnung
US6060818A (en) 1998-06-02 2000-05-09 Hewlett-Packard Company SBAR structures and method of fabrication of SBAR.FBAR film processing techniques for the manufacturing of SBAR/BAR filters
US6150703A (en) 1998-06-29 2000-11-21 Trw Inc. Lateral mode suppression in semiconductor bulk acoustic resonator (SBAR) devices using tapered electrodes, and electrodes edge damping materials
JP2000209063A (ja) 1998-11-12 2000-07-28 Mitsubishi Electric Corp 薄膜圧電素子
US6107721A (en) 1999-07-27 2000-08-22 Tfr Technologies, Inc. Piezoelectric resonators on a differentially offset reflector
KR100398363B1 (ko) 2000-12-05 2003-09-19 삼성전기주식회사 Fbar 소자 및 그 제조방법
US6522800B2 (en) 2000-12-21 2003-02-18 Bernardo F. Lucero Microstructure switches
JP2003017964A (ja) 2001-07-04 2003-01-17 Hitachi Ltd 弾性波素子の製造方法
US6816035B2 (en) * 2002-08-08 2004-11-09 Intel Corporation Forming film bulk acoustic resonator filters
US20040027030A1 (en) * 2002-08-08 2004-02-12 Li-Peng Wang Manufacturing film bulk acoustic resonator filters
WO2004053431A2 (en) * 2002-12-10 2004-06-24 Koninklijke Philips Electronics N.V. Transducer and electronic device
US6985051B2 (en) 2002-12-17 2006-01-10 The Regents Of The University Of Michigan Micromechanical resonator device and method of making a micromechanical device
FR2852165A1 (fr) 2003-03-06 2004-09-10 St Microelectronics Sa Procede de realisation d'un microresonateur piezolectrique accordable
JP2004304704A (ja) 2003-04-01 2004-10-28 Matsushita Electric Ind Co Ltd 薄膜音響共振子、及び、薄膜音響共振子回路
EP1469599B1 (en) 2003-04-18 2010-11-03 Samsung Electronics Co., Ltd. Air gap type FBAR, duplexer using the FBAR, and fabricating methods thereof
US6820469B1 (en) 2003-05-12 2004-11-23 Sandia Corporation Microfabricated teeter-totter resonator
US7332985B2 (en) 2003-10-30 2008-02-19 Avago Technologies Wireless Ip (Singapore) Pte Ltd. Cavity-less film bulk acoustic resonator (FBAR) devices
WO2005074502A2 (en) 2004-01-21 2005-08-18 The Regents Of The University Of Michigan High-q micromechanical resonator devices and filters utilizing same
JP3945486B2 (ja) 2004-02-18 2007-07-18 ソニー株式会社 薄膜バルク音響共振子およびその製造方法
TW200610266A (en) 2004-06-03 2006-03-16 Sony Corp Thin film bulk acoustic resonator and method of manufacturing the same
US20060017352A1 (en) 2004-07-20 2006-01-26 Aram Tanielian Thin device and method of fabrication
US7280007B2 (en) 2004-11-15 2007-10-09 Avago Technologies General Ip (Singapore) Pte. Ltd. Thin film bulk acoustic resonator with a mass loaded perimeter
US8981876B2 (en) 2004-11-15 2015-03-17 Avago Technologies General Ip (Singapore) Pte. Ltd. Piezoelectric resonator structures and electrical filters having frame elements
US7299529B2 (en) * 2005-06-16 2007-11-27 Intel Corporation Film bulk acoustic resonator (FBAR) process using single-step resonator layer deposition
US8008993B2 (en) 2005-09-30 2011-08-30 Nxp B.V. Thin-film bulk-acoustic wave (BAW) resonators
US20070085632A1 (en) * 2005-10-18 2007-04-19 Larson John D Iii Acoustic galvanic isolator
JP2007181185A (ja) 2005-12-01 2007-07-12 Sony Corp 音響共振器およびその製造方法
US7345410B2 (en) 2006-03-22 2008-03-18 Agilent Technologies, Inc. Temperature compensation of film bulk acoustic resonator devices
US7629865B2 (en) 2006-05-31 2009-12-08 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Piezoelectric resonator structures and electrical filters
US7508286B2 (en) 2006-09-28 2009-03-24 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. HBAR oscillator and method of manufacture
JP2007028669A (ja) 2006-10-02 2007-02-01 Ube Ind Ltd 薄膜音響共振器の製造方法
US7869187B2 (en) * 2007-09-04 2011-01-11 Paratek Microwave, Inc. Acoustic bandgap structures adapted to suppress parasitic resonances in tunable ferroelectric capacitors and method of operation and fabrication therefore
US7576471B1 (en) 2007-09-28 2009-08-18 Triquint Semiconductor, Inc. SAW filter operable in a piston mode
JP2009124640A (ja) 2007-11-19 2009-06-04 Hitachi Media Electoronics Co Ltd 薄膜圧電バルク波共振器およびその製造方法、並びに薄膜圧電バルク波共振器を用いた薄膜圧電バルク波共振器フィルタ
JP5279068B2 (ja) * 2008-02-15 2013-09-04 太陽誘電株式会社 圧電薄膜共振子、フィルタ、通信モジュール、および通信装置
US7795781B2 (en) 2008-04-24 2010-09-14 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Bulk acoustic wave resonator with reduced energy loss
US7768364B2 (en) 2008-06-09 2010-08-03 Maxim Integrated Products, Inc. Bulk acoustic resonators with multi-layer electrodes
US7889024B2 (en) 2008-08-29 2011-02-15 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Single cavity acoustic resonators and electrical filters comprising single cavity acoustic resonators
US8718112B2 (en) 2008-10-10 2014-05-06 International Business Machines Corporation Radial Bragg ring resonator structure with high quality factor
US8030823B2 (en) 2009-01-26 2011-10-04 Resonance Semiconductor Corporation Protected resonator
US20100260453A1 (en) 2009-04-08 2010-10-14 Block Bruce A Quality factor (q-factor) for a waveguide micro-ring resonator
US8248185B2 (en) 2009-06-24 2012-08-21 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic resonator structure comprising a bridge
US9673778B2 (en) 2009-06-24 2017-06-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Solid mount bulk acoustic wave resonator structure comprising a bridge
US8902023B2 (en) 2009-06-24 2014-12-02 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator structure having an electrode with a cantilevered portion
EP2299593A1 (en) 2009-09-18 2011-03-23 Nxp B.V. Laterally coupled bulk acoustic wave device
US20110121916A1 (en) 2009-11-24 2011-05-26 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Hybrid bulk acoustic wave resonator
US8283999B2 (en) 2010-02-23 2012-10-09 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Bulk acoustic resonator structures comprising a single material acoustic coupling layer comprising inhomogeneous acoustic property
US9154112B2 (en) 2011-02-28 2015-10-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Coupled resonator filter comprising a bridge
US9136818B2 (en) 2011-02-28 2015-09-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Stacked acoustic resonator comprising a bridge
US8575820B2 (en) 2011-03-29 2013-11-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Stacked bulk acoustic resonator
US8872604B2 (en) 2011-05-05 2014-10-28 Avago Technologies General Ip (Singapore) Pte. Ltd. Double film bulk acoustic resonators with electrode layer and piezo-electric layer thicknesses providing improved quality factor

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000332570A (ja) * 1999-05-24 2000-11-30 Kyocera Corp 圧電共振子
JP2003505905A (ja) * 1999-07-19 2003-02-12 ノキア コーポレイション 共振子構造及びそのような共振子構造を有するフィルター
JP2002223144A (ja) * 2000-12-21 2002-08-09 Agilent Technol Inc バルク弾性共振器周辺反射システム
JP2004312611A (ja) * 2003-04-10 2004-11-04 Ube Ind Ltd 窒化アルミニウム薄膜及びそれを用いた圧電薄膜共振子
JP2007510383A (ja) * 2003-10-30 2007-04-19 アバゴ・テクノロジーズ・ジェネラル・アイピー(シンガポール)プライベート・リミテッド 制御可能な通過帯域幅を有する減結合スタック型バルク音響共振器の帯域フィルタ
JP2005303573A (ja) * 2004-04-09 2005-10-27 Toshiba Corp 薄膜圧電共振器及びその製造方法
JP2007006501A (ja) * 2005-06-23 2007-01-11 Avago Technologies Wireless Ip (Singapore) Pte Ltd 交互配列の縁部構造を利用した音響共振器の性能向上
JP2009100464A (ja) * 2007-09-25 2009-05-07 Panasonic Electric Works Co Ltd 共振装置およびその製造方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014195001A (ja) * 2013-03-29 2014-10-09 Ngk Insulators Ltd 圧電/電歪素子
JP2015095729A (ja) * 2013-11-11 2015-05-18 太陽誘電株式会社 圧電薄膜共振器、フィルタおよびデュプレクサ
JP2018007230A (ja) * 2016-07-07 2018-01-11 サムソン エレクトロ−メカニックス カンパニーリミテッド. 音響共振器及びその製造方法
KR20180006248A (ko) * 2016-07-07 2018-01-17 삼성전기주식회사 음향 공진기 및 그 제조 방법
US10720900B2 (en) 2016-07-07 2020-07-21 Samsung Electro-Mechanics Co., Ltd. Acoustic resonator and method
KR102703814B1 (ko) * 2016-07-07 2024-09-04 삼성전기주식회사 음향 공진기 및 그 제조 방법
JP2019198066A (ja) * 2018-03-28 2019-11-14 コーボ ユーエス,インコーポレイティド 埋め込み型境界リングを備えた結合共振器フィルタ
US11784628B2 (en) 2018-12-14 2023-10-10 Qorvo Us, Inc. Bi-polar border region in piezoelectric device
JP2023522485A (ja) * 2020-06-09 2023-05-30 見聞録(浙江)半導体有限公司 薄膜バルク音波共振器及びその製造工程
US11901872B2 (en) 2020-06-09 2024-02-13 Jwl (Zhejiang) Semiconductor Co., Ltd. Thin film bulk acoustic resonator and manufacturing process therefor
JP2022080885A (ja) * 2020-11-18 2022-05-30 シアン サン、ニアン 磁気電気アンテナアレイ
WO2022230723A1 (ja) * 2021-04-30 2022-11-03 株式会社村田製作所 弾性波装置

Also Published As

Publication number Publication date
DE102012210160A1 (de) 2012-12-20
DE102012210160B4 (de) 2023-12-07
US20120319530A1 (en) 2012-12-20
US8330325B1 (en) 2012-12-11

Similar Documents

Publication Publication Date Title
JP2013005446A (ja) 非圧電層を備えたバルク音響共振器
US8796904B2 (en) Bulk acoustic resonator comprising piezoelectric layer and inverse piezoelectric layer
US9083302B2 (en) Stacked bulk acoustic resonator comprising a bridge and an acoustic reflector along a perimeter of the resonator
US8350445B1 (en) Bulk acoustic resonator comprising non-piezoelectric layer and bridge
US9577603B2 (en) Solidly mounted acoustic resonator having multiple lateral features
US9048812B2 (en) Bulk acoustic wave resonator comprising bridge formed within piezoelectric layer
US9136818B2 (en) Stacked acoustic resonator comprising a bridge
US9525399B2 (en) Planarized electrode for improved performance in bulk acoustic resonators
US9148117B2 (en) Coupled resonator filter comprising a bridge and frame elements
US9099983B2 (en) Bulk acoustic wave resonator device comprising a bridge in an acoustic reflector
US8896395B2 (en) Accoustic resonator having multiple lateral features
US9401691B2 (en) Acoustic resonator device with air-ring and temperature compensating layer
US9203374B2 (en) Film bulk acoustic resonator comprising a bridge
US9748918B2 (en) Acoustic resonator comprising integrated structures for improved performance
US8872604B2 (en) Double film bulk acoustic resonators with electrode layer and piezo-electric layer thicknesses providing improved quality factor
US9246473B2 (en) Acoustic resonator comprising collar, frame and perimeter distributed bragg reflector
US9093979B2 (en) Laterally-coupled acoustic resonators
US9490418B2 (en) Acoustic resonator comprising collar and acoustic reflector with temperature compensating layer
US9490770B2 (en) Acoustic resonator comprising temperature compensating layer and perimeter distributed bragg reflector
US8797123B2 (en) Double film bulk acoustic resonator having electrode edge alignments providing improved quality factor or electromechanical coupling coefficient
US9698753B2 (en) Laterally coupled resonator filter having apodized shape
US20140111288A1 (en) Acoustic resonator having guard ring
CN102739191B (zh) 包括桥部的堆叠式声学谐振器
CN110868170A (zh) 一种声谐振器

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20130718

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150527

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150527

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160328

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160426

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20161122