JP2013004752A - レーザモジュール - Google Patents
レーザモジュール Download PDFInfo
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- JP2013004752A JP2013004752A JP2011134550A JP2011134550A JP2013004752A JP 2013004752 A JP2013004752 A JP 2013004752A JP 2011134550 A JP2011134550 A JP 2011134550A JP 2011134550 A JP2011134550 A JP 2011134550A JP 2013004752 A JP2013004752 A JP 2013004752A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4272—Cooling with mounting substrates of high thermal conductivity
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4267—Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4238—Soldering
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4262—Details of housings characterised by the shape of the housing
- G02B6/4265—Details of housings characterised by the shape of the housing of the Butterfly or dual inline package [DIP] type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
【解決手段】半導体レーザモジュール1は、半導体レーザチップ32が載置されたレーザマウント31と、光ファイバ2が載置されたファイバマウント40と、レーザマウント31及びファイバマウント40の両方が載置されるサブマウント20と、サブマウント20が載置される基板10とを備え、基板10の上面には、凸部11a〜11dが形成され、サブマウント20は、基板10との間に広がった軟質半田61によって、基板10に接合されている。
【選択図】図1
Description
本実施形態に係る半導体レーザモジュール1の構成について、図1〜図2を参照して説明する。図1は、半導体レーザモジュール1の全体像を示す斜視図である。図2は、半導体レーザモジュール1の要部(基板10、サブマウント20、CoS30)の構成を示す三面図である。図2においては、平面図(上面側)を左上、側面図を左下、正面図を右下に示す。
次に、半導体レーザモジュール1が備える基板10の具体例について、図3を参照して説明する。図3は、基板10の三面図である。図3においては、平面図(上面側)を左上、側面図を左下、正面図を右上に示す。
次に、半導体レーザモジュール1が備えるサブマウント20の具体例について、図4を参照して説明する。図4は、基板10の三面図である。図4においては、平面図(上面側)を左上、平面図(下面側)を右上、側面図を左下に示す。
最後に、半導体レーザモジュール1の製造過程で基板10とサブマウント20とを接合する接合方法について、簡単に説明する。基板10とサブマウント20とを接合する接合は、例えば、以下の工程S1〜S8によって実現される。
本発明は上述した実施形態に限定されるものではなく、請求項に示した範囲で種々の変更が可能である。すなわち、請求項に示した範囲で適宜変更した技術的手段を組み合わせて得られる実施形態についても本発明の技術的範囲に含まれる。
10 基板
11a〜11d 凸部(スペーサ)
20 サブマウント
30 CoS
31 レーザマウント
32 半導体レーザチップ(レーザ光源)
40 ファイバマウント
50 ケース
61 軟質半田
62〜63 硬質半田
2 光ファイバ
Claims (8)
- レーザ光を発するレーザ光源が載置されたレーザマウントと、
上記レーザ光を受ける光ファイバが載置されたファイバマウントと、
上記レーザマウント及び上記ファイバマウントの両方が載置されるサブマウントと、
上記サブマウントが載置される基板と、を備え、
上記サブマウントと上記基板との間には、上記サブマウントを上記基板から離間させるためのスペーサが配設されており、
上記サブマウントは、上記基板との間に広がった半田によって、上記基板に接合されている、ことを特徴とするレーザモジュール。 - 上記半田は、ヤング率が50Gpa以下の軟質半田である、
ことを特徴とする請求項1に記載のレーザモジュール。 - 上記半田は、ヤング率が上記サブマウントよりも小さい半田である、
ことを特徴とする請求項1又は2に記載のレーザモジュール。 - 上記スペーサは、上記基板に一体成型されたものである、
ことを特徴とする請求項1から3までの何れか1項に記載のレーザモジュール。 - 上記スペーサの形状は、上記サブマウントに当接する面が平坦な柱状である、
ことを特徴とする請求項1から4までの何れか1項に記載のレーザモジュール。 - 上記スペーサの高さは、40μmよりも高い、
ことを特徴とする請求項1から5までの何れか1項に記載のレーザモジュール。 - 上記サブマウントは、上記基板に対向する面の一部がメタライズ加工されており、該面のメタライズ加工されていない部分が上記スペーサに当接するように上記基板に載置されている、
ことを特徴とする請求項1から6までの何れか1項に記載のレーザモジュール。 - 上記サブマウントは、熱膨張率が上記レーザマウントの材料と同一又は略同一の材料により構成されている、
ことを特徴とする請求項1から7までの何れか1項に記載のレーザモジュール。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011134550A JP2013004752A (ja) | 2011-06-16 | 2011-06-16 | レーザモジュール |
PCT/JP2012/059154 WO2012172855A1 (ja) | 2011-06-16 | 2012-04-04 | レーザモジュール |
EP12800321.7A EP2722945A4 (en) | 2011-06-16 | 2012-04-04 | LASER MODULE |
CN201280029305.4A CN103608985A (zh) | 2011-06-16 | 2012-04-04 | 激光模块 |
US14/104,507 US9158078B2 (en) | 2011-06-16 | 2013-12-12 | Laser module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011134550A JP2013004752A (ja) | 2011-06-16 | 2011-06-16 | レーザモジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013004752A true JP2013004752A (ja) | 2013-01-07 |
JP2013004752A5 JP2013004752A5 (ja) | 2013-12-12 |
Family
ID=47356853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011134550A Pending JP2013004752A (ja) | 2011-06-16 | 2011-06-16 | レーザモジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US9158078B2 (ja) |
EP (1) | EP2722945A4 (ja) |
JP (1) | JP2013004752A (ja) |
CN (1) | CN103608985A (ja) |
WO (1) | WO2012172855A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016115720A (ja) * | 2014-12-11 | 2016-06-23 | 株式会社フジクラ | 光モジュールの製造方法 |
JP2017199842A (ja) * | 2016-04-28 | 2017-11-02 | 株式会社光波 | Led光源装置 |
US10670819B2 (en) | 2016-02-04 | 2020-06-02 | Furukawa Electric Co., Ltd. | Optical coupling structure between optical fiber and semiconductor laser |
JPWO2020175619A1 (ja) * | 2019-02-28 | 2021-12-16 | 京セラ株式会社 | 電子部品搭載用パッケージ、電子装置及び発光装置 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5281122B2 (ja) * | 2011-06-16 | 2013-09-04 | 株式会社フジクラ | 接合方法、及び、製造方法 |
KR101436075B1 (ko) * | 2012-12-28 | 2014-09-01 | 한국광기술원 | 레이저 다이오드 패키지 및 그 제조 방법 |
US9645333B2 (en) * | 2014-10-17 | 2017-05-09 | Lumentum Operations Llc | Optomechanical assembly |
JP6320557B2 (ja) | 2014-10-22 | 2018-05-09 | 三菱電機株式会社 | レーザ光源装置 |
WO2016093262A1 (ja) * | 2014-12-11 | 2016-06-16 | 株式会社フジクラ | 光モジュール |
JP2017011043A (ja) * | 2015-06-18 | 2017-01-12 | 株式会社フジクラ | レーザ装置、及び、レーザ装置の製造方法 |
US10197751B2 (en) * | 2016-03-17 | 2019-02-05 | Applied Optoelectronics, Inc. | Coaxial transmitter optical subassembly (TOSA) including ball lens |
WO2018156755A1 (en) | 2017-02-22 | 2018-08-30 | Stryker Corporation | Flow diverter for bone cement delivery systems |
US10152992B1 (en) * | 2018-02-09 | 2018-12-11 | Sae Magnetics (H.K.) Ltd. | Light source unit and thermally-assisted magnetic head |
CN111948761A (zh) * | 2019-05-14 | 2020-11-17 | 青岛海信宽带多媒体技术有限公司 | 一种光模块 |
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JPH04141606A (ja) * | 1990-10-02 | 1992-05-15 | Hitachi Ltd | 光電子装置 |
JP2000068583A (ja) * | 1998-08-18 | 2000-03-03 | Mitsubishi Electric Corp | 半導体レーザ装置 |
JP2002162542A (ja) * | 2000-11-22 | 2002-06-07 | Hitachi Ltd | 光素子モジュールの実装構造 |
JP2003037324A (ja) * | 2001-07-25 | 2003-02-07 | Sony Corp | 半導体レーザ・アレイ装置及びその作製方法 |
Family Cites Families (7)
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US5068865A (en) * | 1988-06-09 | 1991-11-26 | Nec Corporation | Semiconductor laser module |
US6758610B2 (en) | 2001-12-10 | 2004-07-06 | Jds Uniphase Corporation | Optical component attachment to optoelectronic packages |
EP2191546B1 (en) | 2007-09-20 | 2018-01-17 | II-VI Laser Enterprise GmbH | High power semiconductor laser diodes |
US8230589B2 (en) * | 2008-03-25 | 2012-07-31 | Intel Corporation | Method of mounting an optical device |
US8475056B2 (en) * | 2009-07-28 | 2013-07-02 | Jds Uniphase Corporation | Semiconductor device assembly |
US8345517B2 (en) * | 2010-04-30 | 2013-01-01 | Seagate Technology Llc | Method and apparatus for aligning a laser diode on a slider |
US8644357B2 (en) * | 2011-01-11 | 2014-02-04 | Ii-Vi Incorporated | High reliability laser emitter modules |
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2011
- 2011-06-16 JP JP2011134550A patent/JP2013004752A/ja active Pending
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2012
- 2012-04-04 CN CN201280029305.4A patent/CN103608985A/zh active Pending
- 2012-04-04 EP EP12800321.7A patent/EP2722945A4/en not_active Withdrawn
- 2012-04-04 WO PCT/JP2012/059154 patent/WO2012172855A1/ja unknown
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2013
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016115720A (ja) * | 2014-12-11 | 2016-06-23 | 株式会社フジクラ | 光モジュールの製造方法 |
US10670819B2 (en) | 2016-02-04 | 2020-06-02 | Furukawa Electric Co., Ltd. | Optical coupling structure between optical fiber and semiconductor laser |
JP2017199842A (ja) * | 2016-04-28 | 2017-11-02 | 株式会社光波 | Led光源装置 |
JPWO2020175619A1 (ja) * | 2019-02-28 | 2021-12-16 | 京セラ株式会社 | 電子部品搭載用パッケージ、電子装置及び発光装置 |
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US20140105538A1 (en) | 2014-04-17 |
EP2722945A1 (en) | 2014-04-23 |
EP2722945A4 (en) | 2015-04-22 |
WO2012172855A1 (ja) | 2012-12-20 |
US9158078B2 (en) | 2015-10-13 |
CN103608985A (zh) | 2014-02-26 |
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