JP2012527119A5 - - Google Patents
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- Publication number
- JP2012527119A5 JP2012527119A5 JP2012510818A JP2012510818A JP2012527119A5 JP 2012527119 A5 JP2012527119 A5 JP 2012527119A5 JP 2012510818 A JP2012510818 A JP 2012510818A JP 2012510818 A JP2012510818 A JP 2012510818A JP 2012527119 A5 JP2012527119 A5 JP 2012527119A5
- Authority
- JP
- Japan
- Prior art keywords
- flaps
- base assembly
- flexible membrane
- carrier head
- head assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012528 membrane Substances 0.000 claims 13
- 239000000758 substrate Substances 0.000 claims 4
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 238000005498 polishing Methods 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17821809P | 2009-05-14 | 2009-05-14 | |
| US61/178,218 | 2009-05-14 | ||
| US12/720,893 | 2010-03-10 | ||
| US12/720,893 US8460067B2 (en) | 2009-05-14 | 2010-03-10 | Polishing head zone boundary smoothing |
| PCT/US2010/031802 WO2010132181A2 (en) | 2009-05-14 | 2010-04-20 | Polishing head zone boundary smoothing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012527119A JP2012527119A (ja) | 2012-11-01 |
| JP2012527119A5 true JP2012527119A5 (enExample) | 2013-06-06 |
Family
ID=43068892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012510818A Pending JP2012527119A (ja) | 2009-05-14 | 2010-04-20 | 研磨ヘッドゾーン境界平滑化 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8460067B2 (enExample) |
| JP (1) | JP2012527119A (enExample) |
| KR (1) | KR101647962B1 (enExample) |
| CN (1) | CN102227803B (enExample) |
| SG (1) | SG174850A1 (enExample) |
| TW (1) | TWI572442B (enExample) |
| WO (1) | WO2010132181A2 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8460067B2 (en) * | 2009-05-14 | 2013-06-11 | Applied Materials, Inc. | Polishing head zone boundary smoothing |
| JP5392483B2 (ja) * | 2009-08-31 | 2014-01-22 | 不二越機械工業株式会社 | 研磨装置 |
| US9418904B2 (en) | 2011-11-14 | 2016-08-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Localized CMP to improve wafer planarization |
| US20130210173A1 (en) * | 2012-02-14 | 2013-08-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multiple Zone Temperature Control for CMP |
| US10065288B2 (en) | 2012-02-14 | 2018-09-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing (CMP) platform for local profile control |
| KR101223010B1 (ko) | 2012-06-29 | 2013-01-17 | 주식회사 케이씨텍 | 화학 기계적 연마 장치의 캐리어 헤드용 멤브레인 |
| US10532441B2 (en) | 2012-11-30 | 2020-01-14 | Applied Materials, Inc. | Three-zone carrier head and flexible membrane |
| US9287828B2 (en) | 2013-03-05 | 2016-03-15 | Panasonic Intellectual Property Management Co., Ltd. | Mixing circuit |
| US20140357161A1 (en) * | 2013-05-31 | 2014-12-04 | Sunedison Semiconductor Limited | Center flex single side polishing head |
| KR102173323B1 (ko) | 2014-06-23 | 2020-11-04 | 삼성전자주식회사 | 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법 |
| US9610672B2 (en) | 2014-06-27 | 2017-04-04 | Applied Materials, Inc. | Configurable pressure design for multizone chemical mechanical planarization polishing head |
| KR102160328B1 (ko) * | 2017-02-01 | 2020-09-25 | 강준모 | 화학기계적연마장치용 캐리어헤드 |
| JP6431560B2 (ja) * | 2017-03-08 | 2018-11-28 | 日清工業株式会社 | 両頭平面研削盤および研削方法 |
| US11945073B2 (en) * | 2019-08-22 | 2024-04-02 | Applied Materials, Inc. | Dual membrane carrier head for chemical mechanical polishing |
| US11325223B2 (en) * | 2019-08-23 | 2022-05-10 | Applied Materials, Inc. | Carrier head with segmented substrate chuck |
| CN113118969A (zh) * | 2019-12-31 | 2021-07-16 | 清华大学 | 一种用于化学机械抛光的承载头 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3595011B2 (ja) * | 1994-03-02 | 2004-12-02 | アプライド マテリアルズ インコーポレイテッド | 研磨制御を改善した化学的機械的研磨装置 |
| US6183354B1 (en) * | 1996-11-08 | 2001-02-06 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
| US6276998B1 (en) * | 1999-02-25 | 2001-08-21 | Applied Materials, Inc. | Padless substrate carrier |
| US6227955B1 (en) * | 1999-04-20 | 2001-05-08 | Micron Technology, Inc. | Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| US6855043B1 (en) * | 1999-07-09 | 2005-02-15 | Applied Materials, Inc. | Carrier head with a modified flexible membrane |
| US6450868B1 (en) * | 2000-03-27 | 2002-09-17 | Applied Materials, Inc. | Carrier head with multi-part flexible membrane |
| US6558232B1 (en) * | 2000-05-12 | 2003-05-06 | Multi-Planar Technologies, Inc. | System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control |
| US6722965B2 (en) * | 2000-07-11 | 2004-04-20 | Applied Materials Inc. | Carrier head with flexible membranes to provide controllable pressure and loading area |
| US6857945B1 (en) * | 2000-07-25 | 2005-02-22 | Applied Materials, Inc. | Multi-chamber carrier head with a flexible membrane |
| US7101273B2 (en) * | 2000-07-25 | 2006-09-05 | Applied Materials, Inc. | Carrier head with gimbal mechanism |
| US7198561B2 (en) * | 2000-07-25 | 2007-04-03 | Applied Materials, Inc. | Flexible membrane for multi-chamber carrier head |
| DE60138343D1 (de) * | 2000-07-31 | 2009-05-28 | Ebara Corp | Substrathalter und Poliervorrichtung |
| TWI246448B (en) * | 2000-08-31 | 2006-01-01 | Multi Planar Technologies Inc | Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby |
| US7255637B2 (en) * | 2000-09-08 | 2007-08-14 | Applied Materials, Inc. | Carrier head vibration damping |
| US7497767B2 (en) * | 2000-09-08 | 2009-03-03 | Applied Materials, Inc. | Vibration damping during chemical mechanical polishing |
| KR100437456B1 (ko) | 2001-05-31 | 2004-06-23 | 삼성전자주식회사 | 화학적 기계적 평탄화 기계의 폴리싱 헤드 및 그것을이용한 폴리싱방법 |
| US6769973B2 (en) * | 2001-05-31 | 2004-08-03 | Samsung Electronics Co., Ltd. | Polishing head of chemical mechanical polishing apparatus and polishing method using the same |
| US6890249B1 (en) * | 2001-12-27 | 2005-05-10 | Applied Materials, Inc. | Carrier head with edge load retaining ring |
| US20030124963A1 (en) * | 2001-12-27 | 2003-07-03 | Applied Materials, Inc. | Carrier head with a non-stick membrane |
| US6872130B1 (en) * | 2001-12-28 | 2005-03-29 | Applied Materials Inc. | Carrier head with non-contact retainer |
| JP2004154874A (ja) * | 2002-11-05 | 2004-06-03 | Ebara Corp | ポリッシング装置及びポリッシング方法 |
| KR100481872B1 (ko) * | 2003-01-14 | 2005-04-11 | 삼성전자주식회사 | 폴리싱 헤드 및 화학적 기계적 연마 장치 |
| CN101474771B (zh) * | 2003-02-10 | 2012-07-11 | 株式会社荏原制作所 | 用于衬底保持装置中的弹性部件以及衬底抛光装置和方法 |
| EP1593148B1 (en) * | 2003-02-10 | 2015-04-29 | Ebara Corporation | Substrate holding apparatus and polishing apparatus |
| US7001245B2 (en) * | 2003-03-07 | 2006-02-21 | Applied Materials Inc. | Substrate carrier with a textured membrane |
| US7255771B2 (en) * | 2004-03-26 | 2007-08-14 | Applied Materials, Inc. | Multiple zone carrier head with flexible membrane |
| US7207871B1 (en) * | 2005-10-06 | 2007-04-24 | Applied Materials, Inc. | Carrier head with multiple chambers |
| WO2007143566A2 (en) * | 2006-06-02 | 2007-12-13 | Applied Materials, Inc. | Fast substrate loading on polishing head without membrane inflation step |
| JP2009131920A (ja) * | 2007-11-29 | 2009-06-18 | Ebara Corp | 研磨装置及び方法 |
| US8460067B2 (en) * | 2009-05-14 | 2013-06-11 | Applied Materials, Inc. | Polishing head zone boundary smoothing |
-
2010
- 2010-03-10 US US12/720,893 patent/US8460067B2/en not_active Expired - Fee Related
- 2010-04-20 CN CN201080003356.0A patent/CN102227803B/zh not_active Expired - Fee Related
- 2010-04-20 JP JP2012510818A patent/JP2012527119A/ja active Pending
- 2010-04-20 SG SG2011053196A patent/SG174850A1/en unknown
- 2010-04-20 WO PCT/US2010/031802 patent/WO2010132181A2/en not_active Ceased
- 2010-04-20 KR KR1020117020300A patent/KR101647962B1/ko active Active
- 2010-05-11 TW TW099114991A patent/TWI572442B/zh active
-
2013
- 2013-05-13 US US13/893,030 patent/US9050699B2/en not_active Expired - Fee Related