JP2012527119A - 研磨ヘッドゾーン境界平滑化 - Google Patents

研磨ヘッドゾーン境界平滑化 Download PDF

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Publication number
JP2012527119A
JP2012527119A JP2012510818A JP2012510818A JP2012527119A JP 2012527119 A JP2012527119 A JP 2012527119A JP 2012510818 A JP2012510818 A JP 2012510818A JP 2012510818 A JP2012510818 A JP 2012510818A JP 2012527119 A JP2012527119 A JP 2012527119A
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JP
Japan
Prior art keywords
carrier head
flexible membrane
head assembly
base assembly
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012510818A
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English (en)
Japanese (ja)
Other versions
JP2012527119A5 (enExample
Inventor
ハン チー チェン，
サミュエル チュ−チャン スウ，
ゴータム ダンダヴェート，
デニス エム． クーソー，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
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Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2012527119A publication Critical patent/JP2012527119A/ja
Publication of JP2012527119A5 publication Critical patent/JP2012527119A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2012510818A 2009-05-14 2010-04-20 研磨ヘッドゾーン境界平滑化 Pending JP2012527119A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US17821809P 2009-05-14 2009-05-14
US61/178,218 2009-05-14
US12/720,893 2010-03-10
US12/720,893 US8460067B2 (en) 2009-05-14 2010-03-10 Polishing head zone boundary smoothing
PCT/US2010/031802 WO2010132181A2 (en) 2009-05-14 2010-04-20 Polishing head zone boundary smoothing

Publications (2)

Publication Number Publication Date
JP2012527119A true JP2012527119A (ja) 2012-11-01
JP2012527119A5 JP2012527119A5 (enExample) 2013-06-06

Family

ID=43068892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012510818A Pending JP2012527119A (ja) 2009-05-14 2010-04-20 研磨ヘッドゾーン境界平滑化

Country Status (7)

Country Link
US (2) US8460067B2 (enExample)
JP (1) JP2012527119A (enExample)
KR (1) KR101647962B1 (enExample)
CN (1) CN102227803B (enExample)
SG (1) SG174850A1 (enExample)
TW (1) TWI572442B (enExample)
WO (1) WO2010132181A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9287828B2 (en) 2013-03-05 2016-03-15 Panasonic Intellectual Property Management Co., Ltd. Mixing circuit

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8460067B2 (en) * 2009-05-14 2013-06-11 Applied Materials, Inc. Polishing head zone boundary smoothing
JP5392483B2 (ja) * 2009-08-31 2014-01-22 不二越機械工業株式会社 研磨装置
US9418904B2 (en) 2011-11-14 2016-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Localized CMP to improve wafer planarization
US20130210173A1 (en) * 2012-02-14 2013-08-15 Taiwan Semiconductor Manufacturing Co., Ltd. Multiple Zone Temperature Control for CMP
US10065288B2 (en) 2012-02-14 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing (CMP) platform for local profile control
KR101223010B1 (ko) 2012-06-29 2013-01-17 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드용 멤브레인
US10532441B2 (en) 2012-11-30 2020-01-14 Applied Materials, Inc. Three-zone carrier head and flexible membrane
US20140357161A1 (en) * 2013-05-31 2014-12-04 Sunedison Semiconductor Limited Center flex single side polishing head
KR102173323B1 (ko) 2014-06-23 2020-11-04 삼성전자주식회사 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법
US9610672B2 (en) 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
KR102160328B1 (ko) * 2017-02-01 2020-09-25 강준모 화학기계적연마장치용 캐리어헤드
JP6431560B2 (ja) * 2017-03-08 2018-11-28 日清工業株式会社 両頭平面研削盤および研削方法
US11945073B2 (en) * 2019-08-22 2024-04-02 Applied Materials, Inc. Dual membrane carrier head for chemical mechanical polishing
US11325223B2 (en) * 2019-08-23 2022-05-10 Applied Materials, Inc. Carrier head with segmented substrate chuck
CN113118969A (zh) * 2019-12-31 2021-07-16 清华大学 一种用于化学机械抛光的承载头

Citations (3)

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JP2000296457A (ja) * 1999-02-25 2000-10-24 Obsidian Inc パッドレス基板キャリヤ
JP2003224095A (ja) * 1994-03-02 2003-08-08 Applied Materials Inc 化学機械研磨装置
JP2004221566A (ja) * 2003-01-14 2004-08-05 Samsung Electronics Co Ltd ポリシングヘッド及び化学機械的研磨装置

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US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6227955B1 (en) * 1999-04-20 2001-05-08 Micron Technology, Inc. Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6855043B1 (en) * 1999-07-09 2005-02-15 Applied Materials, Inc. Carrier head with a modified flexible membrane
US6450868B1 (en) * 2000-03-27 2002-09-17 Applied Materials, Inc. Carrier head with multi-part flexible membrane
US6558232B1 (en) * 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US6722965B2 (en) * 2000-07-11 2004-04-20 Applied Materials Inc. Carrier head with flexible membranes to provide controllable pressure and loading area
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
US7101273B2 (en) * 2000-07-25 2006-09-05 Applied Materials, Inc. Carrier head with gimbal mechanism
US7198561B2 (en) * 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
DE60138343D1 (de) * 2000-07-31 2009-05-28 Ebara Corp Substrathalter und Poliervorrichtung
TWI246448B (en) * 2000-08-31 2006-01-01 Multi Planar Technologies Inc Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby
US7255637B2 (en) * 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
US7497767B2 (en) * 2000-09-08 2009-03-03 Applied Materials, Inc. Vibration damping during chemical mechanical polishing
KR100437456B1 (ko) 2001-05-31 2004-06-23 삼성전자주식회사 화학적 기계적 평탄화 기계의 폴리싱 헤드 및 그것을이용한 폴리싱방법
US6769973B2 (en) * 2001-05-31 2004-08-03 Samsung Electronics Co., Ltd. Polishing head of chemical mechanical polishing apparatus and polishing method using the same
US6890249B1 (en) * 2001-12-27 2005-05-10 Applied Materials, Inc. Carrier head with edge load retaining ring
US20030124963A1 (en) * 2001-12-27 2003-07-03 Applied Materials, Inc. Carrier head with a non-stick membrane
US6872130B1 (en) * 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
JP2004154874A (ja) * 2002-11-05 2004-06-03 Ebara Corp ポリッシング装置及びポリッシング方法
CN101474771B (zh) * 2003-02-10 2012-07-11 株式会社荏原制作所 用于衬底保持装置中的弹性部件以及衬底抛光装置和方法
EP1593148B1 (en) * 2003-02-10 2015-04-29 Ebara Corporation Substrate holding apparatus and polishing apparatus
US7001245B2 (en) * 2003-03-07 2006-02-21 Applied Materials Inc. Substrate carrier with a textured membrane
US7255771B2 (en) * 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
US7207871B1 (en) * 2005-10-06 2007-04-24 Applied Materials, Inc. Carrier head with multiple chambers
WO2007143566A2 (en) * 2006-06-02 2007-12-13 Applied Materials, Inc. Fast substrate loading on polishing head without membrane inflation step
JP2009131920A (ja) * 2007-11-29 2009-06-18 Ebara Corp 研磨装置及び方法
US8460067B2 (en) * 2009-05-14 2013-06-11 Applied Materials, Inc. Polishing head zone boundary smoothing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003224095A (ja) * 1994-03-02 2003-08-08 Applied Materials Inc 化学機械研磨装置
JP2000296457A (ja) * 1999-02-25 2000-10-24 Obsidian Inc パッドレス基板キャリヤ
JP2004221566A (ja) * 2003-01-14 2004-08-05 Samsung Electronics Co Ltd ポリシングヘッド及び化学機械的研磨装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9287828B2 (en) 2013-03-05 2016-03-15 Panasonic Intellectual Property Management Co., Ltd. Mixing circuit

Also Published As

Publication number Publication date
TWI572442B (zh) 2017-03-01
KR20120025446A (ko) 2012-03-15
US8460067B2 (en) 2013-06-11
CN102227803B (zh) 2014-09-17
WO2010132181A2 (en) 2010-11-18
CN102227803A (zh) 2011-10-26
US20100291842A1 (en) 2010-11-18
US20130252518A1 (en) 2013-09-26
TW201102216A (en) 2011-01-16
US9050699B2 (en) 2015-06-09
KR101647962B1 (ko) 2016-08-12
WO2010132181A3 (en) 2011-01-13
SG174850A1 (en) 2011-11-28

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