CN102227803B - 研磨头区域边界平滑化 - Google Patents

研磨头区域边界平滑化 Download PDF

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Publication number
CN102227803B
CN102227803B CN201080003356.0A CN201080003356A CN102227803B CN 102227803 B CN102227803 B CN 102227803B CN 201080003356 A CN201080003356 A CN 201080003356A CN 102227803 B CN102227803 B CN 102227803B
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CN
China
Prior art keywords
fin
base portion
carrier head
assembly
head assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080003356.0A
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English (en)
Chinese (zh)
Other versions
CN102227803A (zh
Inventor
陈宏志
塞缪尔·楚-江·许
高塔姆·丹达瓦特
丹尼斯·M·库索
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Applied Materials Inc
Original Assignee
Applied Materials Inc
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Publication date
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Publication of CN102227803A publication Critical patent/CN102227803A/zh
Application granted granted Critical
Publication of CN102227803B publication Critical patent/CN102227803B/zh
Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201080003356.0A 2009-05-14 2010-04-20 研磨头区域边界平滑化 Expired - Fee Related CN102227803B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US17821809P 2009-05-14 2009-05-14
US61/178,218 2009-05-14
US12/720,893 2010-03-10
US12/720,893 US8460067B2 (en) 2009-05-14 2010-03-10 Polishing head zone boundary smoothing
PCT/US2010/031802 WO2010132181A2 (en) 2009-05-14 2010-04-20 Polishing head zone boundary smoothing

Publications (2)

Publication Number Publication Date
CN102227803A CN102227803A (zh) 2011-10-26
CN102227803B true CN102227803B (zh) 2014-09-17

Family

ID=43068892

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080003356.0A Expired - Fee Related CN102227803B (zh) 2009-05-14 2010-04-20 研磨头区域边界平滑化

Country Status (7)

Country Link
US (2) US8460067B2 (enExample)
JP (1) JP2012527119A (enExample)
KR (1) KR101647962B1 (enExample)
CN (1) CN102227803B (enExample)
SG (1) SG174850A1 (enExample)
TW (1) TWI572442B (enExample)
WO (1) WO2010132181A2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8460067B2 (en) * 2009-05-14 2013-06-11 Applied Materials, Inc. Polishing head zone boundary smoothing
JP5392483B2 (ja) * 2009-08-31 2014-01-22 不二越機械工業株式会社 研磨装置
US9418904B2 (en) 2011-11-14 2016-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Localized CMP to improve wafer planarization
US20130210173A1 (en) * 2012-02-14 2013-08-15 Taiwan Semiconductor Manufacturing Co., Ltd. Multiple Zone Temperature Control for CMP
US10065288B2 (en) 2012-02-14 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing (CMP) platform for local profile control
KR101223010B1 (ko) 2012-06-29 2013-01-17 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드용 멤브레인
US10532441B2 (en) 2012-11-30 2020-01-14 Applied Materials, Inc. Three-zone carrier head and flexible membrane
US9287828B2 (en) 2013-03-05 2016-03-15 Panasonic Intellectual Property Management Co., Ltd. Mixing circuit
US20140357161A1 (en) * 2013-05-31 2014-12-04 Sunedison Semiconductor Limited Center flex single side polishing head
KR102173323B1 (ko) 2014-06-23 2020-11-04 삼성전자주식회사 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법
US9610672B2 (en) 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
KR102160328B1 (ko) * 2017-02-01 2020-09-25 강준모 화학기계적연마장치용 캐리어헤드
JP6431560B2 (ja) * 2017-03-08 2018-11-28 日清工業株式会社 両頭平面研削盤および研削方法
US11945073B2 (en) * 2019-08-22 2024-04-02 Applied Materials, Inc. Dual membrane carrier head for chemical mechanical polishing
US11325223B2 (en) * 2019-08-23 2022-05-10 Applied Materials, Inc. Carrier head with segmented substrate chuck
CN113118969A (zh) * 2019-12-31 2021-07-16 清华大学 一种用于化学机械抛光的承载头

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004154874A (ja) * 2002-11-05 2004-06-03 Ebara Corp ポリッシング装置及びポリッシング方法
CN1697153A (zh) * 2004-03-26 2005-11-16 应用材料股份有限公司 具有弹性膜的多区域承载体
CN1748293A (zh) * 2003-02-10 2006-03-15 株式会社荏原制作所 衬底保持装置以及抛光装置
US20060105685A1 (en) * 2000-05-12 2006-05-18 Jiro Kajiwara System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
CN101444897A (zh) * 2007-11-29 2009-06-03 株式会社荏原制作所 抛光设备和方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3595011B2 (ja) * 1994-03-02 2004-12-02 アプライド マテリアルズ インコーポレイテッド 研磨制御を改善した化学的機械的研磨装置
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6276998B1 (en) * 1999-02-25 2001-08-21 Applied Materials, Inc. Padless substrate carrier
US6227955B1 (en) * 1999-04-20 2001-05-08 Micron Technology, Inc. Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6855043B1 (en) * 1999-07-09 2005-02-15 Applied Materials, Inc. Carrier head with a modified flexible membrane
US6450868B1 (en) * 2000-03-27 2002-09-17 Applied Materials, Inc. Carrier head with multi-part flexible membrane
US6722965B2 (en) * 2000-07-11 2004-04-20 Applied Materials Inc. Carrier head with flexible membranes to provide controllable pressure and loading area
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
US7101273B2 (en) * 2000-07-25 2006-09-05 Applied Materials, Inc. Carrier head with gimbal mechanism
US7198561B2 (en) * 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
DE60138343D1 (de) * 2000-07-31 2009-05-28 Ebara Corp Substrathalter und Poliervorrichtung
TWI246448B (en) * 2000-08-31 2006-01-01 Multi Planar Technologies Inc Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby
US7255637B2 (en) * 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
US7497767B2 (en) * 2000-09-08 2009-03-03 Applied Materials, Inc. Vibration damping during chemical mechanical polishing
KR100437456B1 (ko) 2001-05-31 2004-06-23 삼성전자주식회사 화학적 기계적 평탄화 기계의 폴리싱 헤드 및 그것을이용한 폴리싱방법
US6769973B2 (en) * 2001-05-31 2004-08-03 Samsung Electronics Co., Ltd. Polishing head of chemical mechanical polishing apparatus and polishing method using the same
US6890249B1 (en) * 2001-12-27 2005-05-10 Applied Materials, Inc. Carrier head with edge load retaining ring
US20030124963A1 (en) * 2001-12-27 2003-07-03 Applied Materials, Inc. Carrier head with a non-stick membrane
US6872130B1 (en) * 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
KR100481872B1 (ko) * 2003-01-14 2005-04-11 삼성전자주식회사 폴리싱 헤드 및 화학적 기계적 연마 장치
EP1593148B1 (en) * 2003-02-10 2015-04-29 Ebara Corporation Substrate holding apparatus and polishing apparatus
US7001245B2 (en) * 2003-03-07 2006-02-21 Applied Materials Inc. Substrate carrier with a textured membrane
US7207871B1 (en) * 2005-10-06 2007-04-24 Applied Materials, Inc. Carrier head with multiple chambers
WO2007143566A2 (en) * 2006-06-02 2007-12-13 Applied Materials, Inc. Fast substrate loading on polishing head without membrane inflation step
US8460067B2 (en) * 2009-05-14 2013-06-11 Applied Materials, Inc. Polishing head zone boundary smoothing

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060105685A1 (en) * 2000-05-12 2006-05-18 Jiro Kajiwara System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
JP2004154874A (ja) * 2002-11-05 2004-06-03 Ebara Corp ポリッシング装置及びポリッシング方法
CN1748293A (zh) * 2003-02-10 2006-03-15 株式会社荏原制作所 衬底保持装置以及抛光装置
CN1697153A (zh) * 2004-03-26 2005-11-16 应用材料股份有限公司 具有弹性膜的多区域承载体
CN101444897A (zh) * 2007-11-29 2009-06-03 株式会社荏原制作所 抛光设备和方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2004-154874A 2004.06.03

Also Published As

Publication number Publication date
TWI572442B (zh) 2017-03-01
JP2012527119A (ja) 2012-11-01
KR20120025446A (ko) 2012-03-15
US8460067B2 (en) 2013-06-11
WO2010132181A2 (en) 2010-11-18
CN102227803A (zh) 2011-10-26
US20100291842A1 (en) 2010-11-18
US20130252518A1 (en) 2013-09-26
TW201102216A (en) 2011-01-16
US9050699B2 (en) 2015-06-09
KR101647962B1 (ko) 2016-08-12
WO2010132181A3 (en) 2011-01-13
SG174850A1 (en) 2011-11-28

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C06 Publication
PB01 Publication
C53 Correction of patent of invention or patent application
CB02 Change of applicant information

Address after: California, USA

Applicant after: APPLIED MATERIALS, Inc.

Address before: California, USA

Applicant before: APPLIED MATERIALS, Inc.

C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140917

CF01 Termination of patent right due to non-payment of annual fee