JP2012525619A - 電子部品を製品に取り付ける方法 - Google Patents
電子部品を製品に取り付ける方法 Download PDFInfo
- Publication number
- JP2012525619A JP2012525619A JP2012507806A JP2012507806A JP2012525619A JP 2012525619 A JP2012525619 A JP 2012525619A JP 2012507806 A JP2012507806 A JP 2012507806A JP 2012507806 A JP2012507806 A JP 2012507806A JP 2012525619 A JP2012525619 A JP 2012525619A
- Authority
- JP
- Japan
- Prior art keywords
- assembly
- transferable layer
- transfer sheet
- chip
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012546 transfer Methods 0.000 claims abstract description 93
- 238000000034 method Methods 0.000 claims abstract description 57
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 121
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 2
- 238000012423 maintenance Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000000712 assembly Effects 0.000 description 7
- 238000000429 assembly Methods 0.000 description 7
- 230000008901 benefit Effects 0.000 description 7
- 239000000976 ink Substances 0.000 description 6
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000011806 microball Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
- G06K19/0776—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Die Bonding (AREA)
Abstract
Description
明確にするために、異なる図面において同様の構成要素に同様の参照番号を付している。更に、種々の図面は正確な縮尺ではない。
Claims (20)
- 製品に接触した状態で移転可能層を配置するステップと、支持シートの後面側に圧力をかけるステップと、前記支持シートの前面の一部を覆う少なくとも1つの移転可能層が前記製品に接着されたまま前記支持シートを取り外すステップとを有する移転方法を、前記支持シートと、前記少なくとも1つの移転可能層とを備える移転シートを用いて実行する、前記製品に電子部品を取り付ける取付方法であって、
前記支持シートの取外し後に各組立品の少なくとも一部が移転可能層によって維持されるように、前記製品及び支持シート間で、少なくとも1つのワイヤに取り付けられる少なくとも1つの電子チップを備える少なくとも1つの電子組立品の位置を合わせる、前記移転方法より前のステップを備えること
を特徴とする取付方法。 - 各組立品のワイヤの少なくとも一部は、前記支持シートの取外し後に移転可能層によって維持されること
を特徴とする請求項1に記載の取付方法。 - 各組立品の少なくとも一部の一部又は全部を前記移転シートの移転可能層に挿入するステップを予め備え、
前記少なくとも1つの電子組立品は、前記移転シートが前記製品に配置される前に前記移転シートに取り付けられていること
を特徴とする請求項1又は請求項2に記載の取付方法。 - 前記各組立品の少なくとも一部は、前記移転可能層の接着層に全体的に又は部分的に配置されること
を特徴とする請求項1から請求項3のいずれか1つに記載の取付方法。 - 各組立品の少なくとも一部は、前記移転可能層の伝導層に接触した状態で配置されること
を特徴とする請求項1から請求項4のいずれか1つに記載の取付方法。 - 前記各組立品の少なくとも一部の全部又は一部を移転可能層に挿入するステップは、プレス機を用いて行われること
を特徴とする請求項3に記載の取付方法。 - 移転過程の間、前記移転可能層は、該移転可能層の融点よりも高い温度にあること
を特徴とする請求項1から請求項6のいずれか1つに記載の取付方法。 - 支持シート(1,10,20,30,40,50)と、該支持シートの前面の一部を覆う少なくとも1つの移転可能層(2,11,12,21,31,41,51)とを備え、該少なくとも1つの移転可能層が前記支持シートの後面側を押し付けるプレス機を用いて製品に配置されることを目的とされる移転シートであって、
少なくとも1つのワイヤ(4,14,34,35,44,45,54,55)に取り付けられる少なくとも1つの電子チップ(3,13,33,43,53)を備える少なくとも1つの電子組立品(22,23)を備え、
各組立品の少なくとも一部は移転可能層によって維持されていること
を特徴とする移転シート。 - 各組立品のワイヤの少なくとも一部は移転可能層によって維持されていること
を特徴とする請求項8に記載の移転シート。 - 前記少なくとも1つの移転可能層は少なくとも1つの伝導層(46,56,57)を備え、
組立品のワイヤの少なくとも一部は移転可能層の伝導層に接触した状態であること
を特徴とする請求項8又は請求項9に記載の移転シート。 - 組立品のワイヤ(34,35,44,45,54,55)の少なくとも一部はアンテナの全部又は一部を成すこと
を特徴とする請求項8から請求項10のいずれか1つに記載の移転シート。 - 組立品の少なくとも1つのチップは、
アンテナの全部又は一部を成すワイヤの一部に接続されており、
前記チップが接続されている前記アンテナを介したデータの送信及び/又は受信を行うことが可能な電子回路を有すること
を特徴とする請求項11に記載の移転シート。 - 組立品の少なくとも1つのチップは発光ダイオードを有すること
を特徴とする請求項8から請求項12のいずれか1つに記載の移転シート。 - 組立品の少なくとも1つの電子チップはセンサを有すること
を特徴とする請求項8から請求項13のいずれか1つに記載の移転シート。 - 前記少なくとも1つの組立品は移転可能層に一体的に配置されていること
を特徴とする請求項8から請求項14のいずれか1つに記載の移転シート。 - 前記電子チップの最大寸法は1ミリメートルよりも小さく、前記電子チップの体積は1立方ミリメートルよりも小さいこと
を特徴とする請求項8から請求項15のいずれか1つに記載の移転シート。 - 少なくとも1つの電子チップが取り付けられている少なくとも1つのワイヤは伝導部分を有すること
を特徴とする請求項8から請求項16のいずれか1つに記載の移転シート。 - 前記少なくとも1つのチップは少なくとも1つの溝を有し、当該チップが取り付けられている前記少なくとも1つのワイヤの少なくとも1つは、該チップの溝内に配置されていること
を特徴とする請求項8から請求項17のいずれか1つに記載の移転シート。 - 少なくとも1つの伝導性パッドは電子チップの溝内に配置され、
該伝導性パッドは当該チップの前記溝内に配置されるワイヤの伝導部分に電気的に接触していること
を特徴とする請求項17又は請求項18に記載の移転シート。 - 移転可能層によって維持される前記各組立品の少なくとも一部は、該各組立品の少なくとも一部を維持する前記移転可能層の厚さよりも小さい厚さを有すること
を特徴とする請求項8又は請求項19に記載の移転シート。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0952916A FR2945151B1 (fr) | 2009-04-30 | 2009-04-30 | Procede de fixation d'un composant electronique sur un produit |
FR0952916 | 2009-04-30 | ||
PCT/FR2010/050823 WO2010125320A1 (fr) | 2009-04-30 | 2010-04-29 | Procédé de fixation d'un composant électronique sur un produit |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2012525619A true JP2012525619A (ja) | 2012-10-22 |
Family
ID=41404099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012507806A Pending JP2012525619A (ja) | 2009-04-30 | 2010-04-29 | 電子部品を製品に取り付ける方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20120199867A1 (ja) |
EP (1) | EP2425379B1 (ja) |
JP (1) | JP2012525619A (ja) |
CN (1) | CN102439608B (ja) |
ES (1) | ES2425628T3 (ja) |
FR (1) | FR2945151B1 (ja) |
WO (1) | WO2010125320A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016113667A1 (de) * | 2016-07-25 | 2018-01-25 | Itz Innovations- Und Technologiezentrum Gmbh | Leuchtenbaugruppe mit spritzgegossenem LED-Schaltungsträger |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002269520A (ja) * | 2001-03-13 | 2002-09-20 | Hitachi Ltd | 半導体装置及びその製造方法 |
JP2003168090A (ja) * | 2001-11-29 | 2003-06-13 | Toppan Printing Co Ltd | 複合タグ、複合タグラベル、複合タグ転写シート、複合タグ付き物品、及び複合タグ用素子 |
JP2003209421A (ja) * | 2002-01-17 | 2003-07-25 | Dainippon Printing Co Ltd | 透明アンテナを有するrfidタグ、及びその製造方法 |
WO2008025889A1 (fr) * | 2006-08-29 | 2008-03-06 | Commissariat A L'energie Atomique | Puce microelectronique nue munie d'un evidement formant un logement pour un element filaire constituant un support mecanique souple, procede de fabrication et microstructure |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY118036A (en) * | 1996-01-22 | 2004-08-30 | Lintec Corp | Wafer dicing/bonding sheet and process for producing semiconductor device |
EP1243434A4 (en) * | 2000-11-30 | 2006-05-24 | Daicel Chem | TRANSFER SHEET |
JP3727587B2 (ja) * | 2001-12-28 | 2005-12-14 | シャープ株式会社 | 半導体装置の実装方法 |
US20070172609A1 (en) * | 2004-02-10 | 2007-07-26 | Foto-Wear, Inc. | Image transfer material and polymer composition |
US20070003758A1 (en) * | 2004-04-01 | 2007-01-04 | National Starch And Chemical Investment Holding Corporation | Dicing die bonding film |
US20090206750A1 (en) * | 2006-05-02 | 2009-08-20 | Sst Smart Surface Technology Ag | Method for the Production of an Electroluminescence Apparatus and an Electroluminescence Apparatus Produced According to Said Method |
NL2000292C2 (nl) | 2006-10-27 | 2008-04-29 | Romico Hold A V V | Werkwijze voor het in fracties separeren van een mediummengsel. |
DE102007027998A1 (de) * | 2007-06-14 | 2008-12-18 | Leonhard Kurz Gmbh & Co. Kg | Heißprägen von Leiterbahnen auf Photovoltaik-Silizium-Wafer |
FR2917895B1 (fr) | 2007-06-21 | 2010-04-09 | Commissariat Energie Atomique | Procede de fabrication d'un assemblage de puces reliees mecaniquement au moyen d'une connexion souple |
-
2009
- 2009-04-30 FR FR0952916A patent/FR2945151B1/fr not_active Expired - Fee Related
-
2010
- 2010-04-29 US US13/266,975 patent/US20120199867A1/en not_active Abandoned
- 2010-04-29 CN CN201080019234.0A patent/CN102439608B/zh not_active Expired - Fee Related
- 2010-04-29 EP EP10727070.4A patent/EP2425379B1/fr not_active Not-in-force
- 2010-04-29 JP JP2012507806A patent/JP2012525619A/ja active Pending
- 2010-04-29 WO PCT/FR2010/050823 patent/WO2010125320A1/fr active Application Filing
- 2010-04-29 ES ES10727070T patent/ES2425628T3/es active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002269520A (ja) * | 2001-03-13 | 2002-09-20 | Hitachi Ltd | 半導体装置及びその製造方法 |
JP2003168090A (ja) * | 2001-11-29 | 2003-06-13 | Toppan Printing Co Ltd | 複合タグ、複合タグラベル、複合タグ転写シート、複合タグ付き物品、及び複合タグ用素子 |
JP2003209421A (ja) * | 2002-01-17 | 2003-07-25 | Dainippon Printing Co Ltd | 透明アンテナを有するrfidタグ、及びその製造方法 |
WO2008025889A1 (fr) * | 2006-08-29 | 2008-03-06 | Commissariat A L'energie Atomique | Puce microelectronique nue munie d'un evidement formant un logement pour un element filaire constituant un support mecanique souple, procede de fabrication et microstructure |
Also Published As
Publication number | Publication date |
---|---|
US20120199867A1 (en) | 2012-08-09 |
CN102439608A (zh) | 2012-05-02 |
EP2425379B1 (fr) | 2013-06-05 |
CN102439608B (zh) | 2015-01-14 |
ES2425628T3 (es) | 2013-10-16 |
FR2945151B1 (fr) | 2011-04-29 |
WO2010125320A1 (fr) | 2010-11-04 |
FR2945151A1 (fr) | 2010-11-05 |
EP2425379A1 (fr) | 2012-03-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
RU2446465C2 (ru) | Способ нанесения меток на поверхности подложек с помощью способа переноса | |
EP2323079A3 (en) | Electrical device manufacturing techniques | |
JP2012520517A5 (ja) | ||
TW200713075A (en) | RFID tag and manufacturing method thereof | |
JP2006107296A (ja) | 非接触icタグおよび非接触icタグ用アンテナ | |
CN107563473A (zh) | 基于液态金属的信息识别系统 | |
JP2007108983A (ja) | Ic実装モジュールとその製造方法および製造装置 | |
JP5088544B2 (ja) | 無線icデバイスの製造方法 | |
US20140224882A1 (en) | Flexible Smart Card Transponder | |
JP2012525619A (ja) | 電子部品を製品に取り付ける方法 | |
WO2002086910A3 (en) | A method and system for forming electrically conductive pathways | |
JP2008177352A (ja) | 電子装置の製造方法 | |
CN109074507A (zh) | 载带及其制造方法、以及rfid标签的制造方法 | |
JP7353578B2 (ja) | Icタグ | |
JP2004005260A (ja) | エレクトロルミネッセント表示部を有したicメディアおよびその製造方法 | |
JP2005045161A (ja) | アンテナシート | |
CN206039587U (zh) | 一种银浆挡风玻璃标签 | |
KR20080053721A (ko) | Rfid 태그 제조 방법, rfid 태그 및 rfid태그용 전기 연결 부재 | |
JP5873312B2 (ja) | アンテナシートおよびこれを備えた非接触型データ受送信体 | |
JP2006318343A (ja) | 非接触icインレットの製造方法および製造装置 | |
CN210924630U (zh) | 织物的热转印rfid卷标结构 | |
TW201134332A (en) | Printed circuit board with embedded antenna for RFID tag and method for manufacturing the same | |
KR20120033732A (ko) | 전자태그를 구비한 절첩상자 제조방법 | |
JP2006140359A (ja) | インターポーザの接合方法及び、このインターポーザの接合方法を利用して作製した電子部品 | |
JP5878007B2 (ja) | アンテナシートおよびこれを備えた非接触型データ受送信体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130328 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140122 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140128 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140424 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20140924 |