JP2012513500A5 - - Google Patents
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- Publication number
- JP2012513500A5 JP2012513500A5 JP2011542589A JP2011542589A JP2012513500A5 JP 2012513500 A5 JP2012513500 A5 JP 2012513500A5 JP 2011542589 A JP2011542589 A JP 2011542589A JP 2011542589 A JP2011542589 A JP 2011542589A JP 2012513500 A5 JP2012513500 A5 JP 2012513500A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal plating
- substrate
- polyamide
- suitable solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 230000003750 conditioning effect Effects 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical group OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 2
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14038408P | 2008-12-23 | 2008-12-23 | |
| US61/140,384 | 2008-12-23 | ||
| PCT/US2009/069357 WO2010075484A1 (en) | 2008-12-23 | 2009-12-23 | Chrome-free method of conditioning and etching of a thermoplastic substrate for metal plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012513500A JP2012513500A (ja) | 2012-06-14 |
| JP2012513500A5 true JP2012513500A5 (https=) | 2013-02-14 |
Family
ID=42040588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011542589A Withdrawn JP2012513500A (ja) | 2008-12-23 | 2009-12-23 | 金属めっき用熱可塑性基材のコンディショニングおよびエッチングのクロムフリー法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20100159260A1 (https=) |
| EP (1) | EP2367872A1 (https=) |
| JP (1) | JP2012513500A (https=) |
| KR (1) | KR20110110217A (https=) |
| CN (1) | CN102264812A (https=) |
| WO (1) | WO2010075484A1 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010022431A1 (de) * | 2010-06-01 | 2011-12-01 | Karl Storz Gmbh & Co. Kg | Medizinisches Greifwerkzeug |
| US11268526B2 (en) | 2013-07-09 | 2022-03-08 | Raytheon Technologies Corporation | Plated polymer fan |
| WO2015006421A1 (en) | 2013-07-09 | 2015-01-15 | United Technologies Corporation | Metal-encapsulated polymeric article |
| EP3019723A4 (en) | 2013-07-09 | 2017-05-10 | United Technologies Corporation | Plated polymer compressor |
| WO2015006397A1 (en) * | 2013-07-09 | 2015-01-15 | United Technologies Corporation | Industrial products formed from plated polymers |
| CA2917916A1 (en) | 2013-07-09 | 2015-02-05 | United Technologies Corporation | Plated polymer nosecone |
| CN103388135A (zh) * | 2013-07-18 | 2013-11-13 | 厦门建霖工业有限公司 | 一种尼龙材料的粗化液及粗化方法 |
| WO2017016965A1 (en) * | 2015-07-30 | 2017-02-02 | Basf Se | Process for metallizing plastic surfaces |
| CN107556504B (zh) * | 2017-08-18 | 2020-01-03 | 东华大学 | 尼龙薄膜表面的水热溶蚀处理方法 |
| KR102187001B1 (ko) * | 2017-12-21 | 2020-12-04 | 주식회사 엘지화학 | 폴리프탈아마이드 수지 조성물, 이를 포함하는 성형품 및 이들의 제조방법 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4335164A (en) * | 1978-12-19 | 1982-06-15 | Crown City Plating Co. | Conditioning of polyamides for electroless plating |
| US4552626A (en) * | 1984-11-19 | 1985-11-12 | Michael Landney, Jr. | Metal plating of polyamide thermoplastics |
| US4842946A (en) * | 1987-09-28 | 1989-06-27 | General Electric Company | Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby |
| US5324766A (en) * | 1989-07-07 | 1994-06-28 | Mitsui Petrochemical Industries, Ltd. | Resin composition for forming plated layer and use thereof |
| ATE132885T1 (de) * | 1989-07-07 | 1996-01-15 | Mitsui Petrochemical Ind | Verfahren zur herstellung von metallbeschichteten kunststoffgegenständen |
| US5811050A (en) * | 1994-06-06 | 1998-09-22 | Gabower; John F. | Electromagnetic interference shield for electronic devices |
| US5762777A (en) * | 1996-05-02 | 1998-06-09 | Persee Chemical Co. Ltd. | Process of directly electroplating onto a nonconductive substrate |
| JP2000239422A (ja) * | 1999-02-22 | 2000-09-05 | Idemitsu Petrochem Co Ltd | 無電解メッキ品の製造方法およびそれに用いる樹脂組成物 |
| US6645557B2 (en) * | 2001-10-17 | 2003-11-11 | Atotech Deutschland Gmbh | Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions |
-
2009
- 2009-12-03 US US12/630,003 patent/US20100159260A1/en not_active Abandoned
- 2009-12-23 EP EP20090802084 patent/EP2367872A1/en not_active Withdrawn
- 2009-12-23 KR KR1020117017210A patent/KR20110110217A/ko not_active Withdrawn
- 2009-12-23 CN CN200980152330XA patent/CN102264812A/zh active Pending
- 2009-12-23 WO PCT/US2009/069357 patent/WO2010075484A1/en not_active Ceased
- 2009-12-23 JP JP2011542589A patent/JP2012513500A/ja not_active Withdrawn
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