JP2012510149A5 - - Google Patents

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JP2012510149A5
JP2012510149A5 JP2011536876A JP2011536876A JP2012510149A5 JP 2012510149 A5 JP2012510149 A5 JP 2012510149A5 JP 2011536876 A JP2011536876 A JP 2011536876A JP 2011536876 A JP2011536876 A JP 2011536876A JP 2012510149 A5 JP2012510149 A5 JP 2012510149A5
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JP5684715B2 (ja
JP2012510149A (ja
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Priority claimed from PCT/EP2009/065569 external-priority patent/WO2010057984A2/en
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JP2011536876A 2008-11-24 2009-11-20 光硬化性ポリマー性誘電体、及びその製造方法、及びその使用方法 Active JP5684715B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11740408P 2008-11-24 2008-11-24
US61/117,404 2008-11-24
PCT/EP2009/065569 WO2010057984A2 (en) 2008-11-24 2009-11-20 Photocurable polymeric dielectrics and methods of preparation and use thereof

Related Child Applications (1)

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JP2014139115A Division JP5960202B2 (ja) 2008-11-24 2014-07-04 光硬化性ポリマー性誘電体、及びその製造方法、及びその使用方法

Publications (3)

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JP2012510149A JP2012510149A (ja) 2012-04-26
JP2012510149A5 true JP2012510149A5 (https=) 2013-02-14
JP5684715B2 JP5684715B2 (ja) 2015-03-18

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JP2011536876A Active JP5684715B2 (ja) 2008-11-24 2009-11-20 光硬化性ポリマー性誘電体、及びその製造方法、及びその使用方法
JP2014139115A Expired - Fee Related JP5960202B2 (ja) 2008-11-24 2014-07-04 光硬化性ポリマー性誘電体、及びその製造方法、及びその使用方法

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JP2014139115A Expired - Fee Related JP5960202B2 (ja) 2008-11-24 2014-07-04 光硬化性ポリマー性誘電体、及びその製造方法、及びその使用方法

Country Status (7)

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US (2) US8937301B2 (https=)
EP (2) EP2368281B1 (https=)
JP (2) JP5684715B2 (https=)
KR (2) KR101712680B1 (https=)
CN (2) CN102224611B (https=)
TW (1) TWI491622B (https=)
WO (1) WO2010057984A2 (https=)

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CN107621751B (zh) * 2017-09-21 2021-02-09 儒芯微电子材料(上海)有限公司 含碱性香豆素结构的聚合物树脂及其光刻胶组合物
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