JP2012508978A5 - - Google Patents

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Publication number
JP2012508978A5
JP2012508978A5 JP2011536331A JP2011536331A JP2012508978A5 JP 2012508978 A5 JP2012508978 A5 JP 2012508978A5 JP 2011536331 A JP2011536331 A JP 2011536331A JP 2011536331 A JP2011536331 A JP 2011536331A JP 2012508978 A5 JP2012508978 A5 JP 2012508978A5
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Japan
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layer
pattern
etching
depositing
forming
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JP2011536331A
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Japanese (ja)
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JP5723779B2 (ja
JP2012508978A (ja
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Priority claimed from US12/616,896 external-priority patent/US8529778B2/en
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JP2011536331A 2008-11-13 2009-11-13 ナノサイズ形状の大面積パターニング Active JP5723779B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US11423908P 2008-11-13 2008-11-13
US61/114,239 2008-11-13
US12/616,896 2009-11-12
US12/616,896 US8529778B2 (en) 2008-11-13 2009-11-12 Large area patterning of nano-sized shapes
PCT/US2009/006113 WO2010056349A2 (en) 2008-11-13 2009-11-13 Large area patterning of nano-sized shapes

Publications (3)

Publication Number Publication Date
JP2012508978A JP2012508978A (ja) 2012-04-12
JP2012508978A5 true JP2012508978A5 (enExample) 2012-12-27
JP5723779B2 JP5723779B2 (ja) 2015-05-27

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Family Applications (1)

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JP2011536331A Active JP5723779B2 (ja) 2008-11-13 2009-11-13 ナノサイズ形状の大面積パターニング

Country Status (5)

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US (2) US8529778B2 (enExample)
EP (1) EP2344926B1 (enExample)
JP (1) JP5723779B2 (enExample)
TW (1) TWI453106B (enExample)
WO (1) WO2010056349A2 (enExample)

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US10609660B2 (en) * 2017-04-19 2020-03-31 Qualcomm Incorporated Synchronization for wideband coverage enhancement
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JP6447657B2 (ja) * 2017-04-25 2019-01-09 大日本印刷株式会社 インプリント樹脂滴下順序決定方法及びインプリント方法
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