JP2012501252A5 - - Google Patents

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JP2012501252A5
JP2012501252A5 JP2011525047A JP2011525047A JP2012501252A5 JP 2012501252 A5 JP2012501252 A5 JP 2012501252A5 JP 2011525047 A JP2011525047 A JP 2011525047A JP 2011525047 A JP2011525047 A JP 2011525047A JP 2012501252 A5 JP2012501252 A5 JP 2012501252A5
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Japan
Prior art keywords
abrasive
layer
particles
translucent film
meth
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JP2011525047A
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JP5351967B2 (ja
JP2012501252A (ja
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Priority claimed from PCT/US2009/052188 external-priority patent/WO2010025003A2/en
Publication of JP2012501252A publication Critical patent/JP2012501252A/ja
Publication of JP2012501252A5 publication Critical patent/JP2012501252A5/ja
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Publication of JP5351967B2 publication Critical patent/JP5351967B2/ja
Expired - Fee Related legal-status Critical Current
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Claims (3)

  1. 少なくとも半透明なフィルム裏材と、
    前記少なくとも半透明なフィルム裏材上に配置され、かつ複数の成形研磨複合材を含む研磨層であって、前記成形研磨複合材が、結合剤に分散した研磨粒子を含み、前記研磨粒子が、100ナノメートル未満の平均一次粒径を有するセリア粒子から本質的に成り、前記結合剤が、ポリエーテル酸と、カルボン酸(メタ)アクリレート及びポリ(メタ)アクリレートを含む成分の反応生成物とを含み、前記研磨層の総重量に基づいて、前記研磨粒子が、少なくとも70重量%の量存在する、研磨層と、を含む、構造化研磨物品。
  2. 構造化研磨物品を作製する方法であって、
    セリア粒子、ポリエーテル酸、カルボン酸(メタ)アクリレート、及び溶媒を組み合わせて分散液を形成する工程であって、前記セリア粒子が100ナノメートル未満の平均一次粒径を有する、工程と、
    前記分散液とポリ(メタ)アクリレートを含む成分を組み合わせて、結合剤前駆体を形成する工程と、
    少なくとも半透明なフィルム裏材上に前記結合剤前駆体の層を形成する工程と、
    複数の精密に成形されたくぼみを有する生産用具と前記結合剤前駆体を接触させる工程と、
    前記結合剤前駆体を硬化させて、前記少なくとも半透明なフィルム裏材上に配置された研磨層を形成する工程と、
    前記研磨層を前記生産用具から分離させて、前記構造化研磨物品を提供する工程であって、前記研磨層の総重量に基づいて、前記セリア粒子が少なくとも70重量%の量存在する、工程と、を含む、方法。
  3. ウエハの酸化物表面をコンディショニングする方法であって、
    少なくとも半透明なフィルム裏材と、
    前記少なくとも半透明なフィルム裏材上に配置され、かつ複数の成形研磨複合材を含む研磨層であって、前記成形研磨複合材が、結合剤に分散した研磨粒子を含み、前記研磨粒子が、100ナノメートル未満の平均一次粒径を有するセリア粒子から本質的に成り、前記結合剤が、ポリエーテル酸と、カルボン酸(メタ)アクリレート及びポリ(メタ)アクリレートを含む成分の反応生成物とを含み、前記研磨層の総重量に基づいて、前記研磨粒子が、少なくとも70重量%の量存在する、研磨層と、を含む、構造化研磨物品を提供する工程と、
    前記研磨層をコンディショニングする工程と、
    前記少なくとも半透明なフィルム裏材をサブパッドと接触させる工程であって、前記サブパッドがそれを貫いて延在する第1のウィンドウを有する、工程と、
    前記サブパッドを圧盤に固定する工程であって、前記圧盤が、それを貫いて延在し、かつ前記第1のウィンドウに隣接している第2のウィンドウを有する、工程と、
    前記研磨層を前記ウエハの前記酸化物表面と摩擦により接触させる工程と、
    前記研磨層又は前記ウエハの少なくとも1つを移動させて、作動液と接触しながら前記ウエハの前記表面を研磨する工程と、
    前記第1のウィンドウ、前記第2のウィンドウ、及び前記構造化研磨物品を通して導かれる可視光線を用いて、前記ウエハの表面特性をモニタする工程と、を含む、方法。
JP2011525047A 2008-08-28 2009-07-30 構造化研磨物品、その製造方法、及びウエハの平坦化における使用 Expired - Fee Related JP5351967B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9252108P 2008-08-28 2008-08-28
US61/092,521 2008-08-28
PCT/US2009/052188 WO2010025003A2 (en) 2008-08-28 2009-07-30 Structured abrasive article, method of making the same, and use in wafer planarization

Publications (3)

Publication Number Publication Date
JP2012501252A JP2012501252A (ja) 2012-01-19
JP2012501252A5 true JP2012501252A5 (ja) 2012-07-05
JP5351967B2 JP5351967B2 (ja) 2013-11-27

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JP2011525047A Expired - Fee Related JP5351967B2 (ja) 2008-08-28 2009-07-30 構造化研磨物品、その製造方法、及びウエハの平坦化における使用

Country Status (7)

Country Link
US (1) US8251774B2 (ja)
EP (1) EP2327088B1 (ja)
JP (1) JP5351967B2 (ja)
KR (1) KR101602001B1 (ja)
CN (1) CN102138203B (ja)
TW (1) TWI429735B (ja)
WO (1) WO2010025003A2 (ja)

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