JP2012256418A5 - - Google Patents
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- Publication number
- JP2012256418A5 JP2012256418A5 JP2012164631A JP2012164631A JP2012256418A5 JP 2012256418 A5 JP2012256418 A5 JP 2012256418A5 JP 2012164631 A JP2012164631 A JP 2012164631A JP 2012164631 A JP2012164631 A JP 2012164631A JP 2012256418 A5 JP2012256418 A5 JP 2012256418A5
- Authority
- JP
- Japan
- Prior art keywords
- slider
- pad
- solder
- pads
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 description 86
- 239000000725 suspension Substances 0.000 description 59
- 238000010168 coupling process Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 10
- 230000008878 coupling Effects 0.000 description 10
- 238000005859 coupling reaction Methods 0.000 description 10
- 229910003460 diamond Inorganic materials 0.000 description 10
- 239000010432 diamond Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/489,176 US8259415B2 (en) | 2009-06-22 | 2009-06-22 | Slider bond pad with a recessed channel |
| US12/489,176 | 2009-06-22 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010140738A Division JP5252592B2 (ja) | 2009-06-22 | 2010-06-21 | スライダ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012256418A JP2012256418A (ja) | 2012-12-27 |
| JP2012256418A5 true JP2012256418A5 (enExample) | 2014-05-08 |
| JP5794738B2 JP5794738B2 (ja) | 2015-10-14 |
Family
ID=43354144
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010140738A Expired - Fee Related JP5252592B2 (ja) | 2009-06-22 | 2010-06-21 | スライダ |
| JP2012164631A Expired - Fee Related JP5794738B2 (ja) | 2009-06-22 | 2012-07-25 | アセンブリおよび電気的に接続するための方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010140738A Expired - Fee Related JP5252592B2 (ja) | 2009-06-22 | 2010-06-21 | スライダ |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8259415B2 (enExample) |
| JP (2) | JP5252592B2 (enExample) |
| KR (1) | KR101273441B1 (enExample) |
| CN (1) | CN101964194B (enExample) |
| MY (1) | MY152696A (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8243391B2 (en) * | 2008-09-26 | 2012-08-14 | Hitachi Global Storage Technologies, Netherlands B.V. | Slider and suspension composite fiber solder joints |
| US8587901B1 (en) | 2009-12-30 | 2013-11-19 | Western Digital (Fremont), Llc | Magnetic recording head slider comprising bond pad having a probe contact area and a solder contact area |
| US8477457B2 (en) * | 2011-09-09 | 2013-07-02 | HGST Netherlands, B.V. | Head-gimbal assembly with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge |
| US8730621B2 (en) | 2012-07-09 | 2014-05-20 | Seagate Technology Llc | Solder ball bridge, and methods of making |
| US8767351B1 (en) * | 2013-01-31 | 2014-07-01 | Seagate Technology Llc | Ambient temperature ball bond |
| US9025283B1 (en) | 2013-09-18 | 2015-05-05 | Western Digital Technologies, Inc. | Laminated suspension flexure with open polyimide base |
| US8947830B1 (en) * | 2014-06-10 | 2015-02-03 | Seagate Technology Llc | Method of forming electrical connections from solder posts |
| US9728211B1 (en) | 2016-02-04 | 2017-08-08 | Western Digital Technologies, Inc. | Suspension pad for head-gimbal assembly that inhibits formation of an inter-pad solder bridge |
| US9786308B1 (en) | 2016-06-07 | 2017-10-10 | Seagate Technology Llc | Interconnect interposer attachable to a trailing edge of a slider |
| US9953669B1 (en) * | 2016-10-18 | 2018-04-24 | Seagate Technology Llc | Toothed slider high density head gimbal assembly slider interconnect |
| US10460754B2 (en) | 2018-02-05 | 2019-10-29 | Western Digital Technologies, Inc. | Slider and suspension arm interconnection for magnetic storage device |
| US10643645B2 (en) | 2018-09-24 | 2020-05-05 | Seagate Technology Llc | Slider with bondable surface opposite suspension trace |
| US10706880B1 (en) * | 2019-04-02 | 2020-07-07 | Seagate Technology Llc | Electrically conductive solder non-wettable bond pads in head gimbal assemblies |
| CN115376565A (zh) * | 2021-05-20 | 2022-11-22 | 日本发条株式会社 | 磁盘装置用悬架、电子部件以及悬架和电子部件的连接方法 |
| US11676628B1 (en) | 2021-12-02 | 2023-06-13 | Western Digital Technologies, Inc. | Multiple-portion hard disk drive slider pad configuration |
| US11631426B1 (en) | 2021-12-15 | 2023-04-18 | Western Digital Technologies, Inc. | Hard disk drive suspension pad peel-prevention configuration |
| US11705153B1 (en) | 2022-03-23 | 2023-07-18 | Western Digital Technologies, Inc. | Hard disk drive suspension pad pre-solder formation and guiding |
| US11908497B2 (en) | 2022-03-29 | 2024-02-20 | Western Digital Technologies, Inc. | Hard disk drive suspension pad pre-solder sidewalls |
| US12094501B1 (en) | 2023-04-05 | 2024-09-17 | Western Digital Technologies, Inc. | Hard disk drive slider split pad configuration |
| US12260886B2 (en) | 2023-06-28 | 2025-03-25 | Western Digital Technologies, Inc. | Suspension arm and slider contact for magnetic storage device |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5258460U (enExample) * | 1975-10-24 | 1977-04-27 | ||
| JPS57166377U (enExample) * | 1981-04-13 | 1982-10-20 | ||
| JPS57188315A (en) | 1981-05-15 | 1982-11-19 | Nippon Concrete Ind Co Ltd | Method of removing concrete post body from die |
| JPS57188315U (enExample) * | 1981-05-26 | 1982-11-30 | ||
| US5390412A (en) | 1993-04-08 | 1995-02-21 | Gregoire; George D. | Method for making printed circuit boards |
| US5373111A (en) | 1993-11-19 | 1994-12-13 | Delco Electronics Corporation | Bond pad having a patterned bonding surface |
| US5530604A (en) * | 1994-05-19 | 1996-06-25 | International Business Machines Corporation | Electrical connection and slider-suspension assembly having an improved electrical connection |
| KR0157284B1 (ko) | 1995-05-31 | 1999-02-18 | 김광호 | 솔더 볼 장착홈을 갖는 인쇄 회로 기판과 이를 사용한 볼 그리드 어레이 패키지 |
| US5686762A (en) | 1995-12-21 | 1997-11-11 | Micron Technology, Inc. | Semiconductor device with improved bond pads |
| US5876580A (en) | 1996-01-12 | 1999-03-02 | Micromodule Systems | Rough electrical contact surface |
| JP3526376B2 (ja) | 1996-08-21 | 2004-05-10 | 株式会社東芝 | 半導体装置及びその製造方法 |
| US5929521A (en) | 1997-03-26 | 1999-07-27 | Micron Technology, Inc. | Projected contact structure for bumped semiconductor device and resulting articles and assemblies |
| US6025988A (en) | 1998-12-17 | 2000-02-15 | Read-Rite Corporation | Interconnect adapter and head suspension assembly |
| JP2000188232A (ja) * | 1998-12-21 | 2000-07-04 | Matsushita Electric Ind Co Ltd | 面実装部品 |
| US6531384B1 (en) | 2001-09-14 | 2003-03-11 | Motorola, Inc. | Method of forming a bond pad and structure thereof |
| CN1498398A (zh) * | 2002-01-19 | 2004-05-19 | 新科实业有限公司 | 硬盘微激励器和磁头对一个驱动臂悬架的物理和电气连接方法及装置 |
| US6989967B2 (en) * | 2002-08-06 | 2006-01-24 | Seagate Technology Llc | Slider having a trailing bearing pad adjacent to a recessed area |
| US7015580B2 (en) | 2003-11-25 | 2006-03-21 | International Business Machines Corporation | Roughened bonding pad and bonding wire surfaces for low pressure wire bonding |
| JP4255859B2 (ja) * | 2004-02-26 | 2009-04-15 | ヒタチグローバルストレージテクノロジーズネザーランドビーブイ | 回転円板形記憶装置及び配線一体型ヘッド・サスペンション・アセンブリ |
| US7446399B1 (en) | 2004-08-04 | 2008-11-04 | Altera Corporation | Pad structures to improve board-level reliability of solder-on-pad BGA structures |
| JP2006185479A (ja) * | 2004-12-27 | 2006-07-13 | Hitachi Global Storage Technologies Netherlands Bv | ヘッド・ジンバル・アセンブリ及び磁気ディスク装置 |
| CN100559473C (zh) * | 2005-04-25 | 2009-11-11 | 新科实业有限公司 | 焊接装置及在磁盘驱动单元内形成电性焊接的方法 |
| JP4237744B2 (ja) * | 2005-11-01 | 2009-03-11 | Ｔｄｋ株式会社 | 磁気ヘッドアッセンブリ及びその半田接合方法 |
-
2009
- 2009-06-22 US US12/489,176 patent/US8259415B2/en not_active Expired - Fee Related
-
2010
- 2010-06-21 MY MYPI2010002941 patent/MY152696A/en unknown
- 2010-06-21 JP JP2010140738A patent/JP5252592B2/ja not_active Expired - Fee Related
- 2010-06-22 KR KR1020100059050A patent/KR101273441B1/ko not_active Expired - Fee Related
- 2010-06-22 CN CN201010246885.5A patent/CN101964194B/zh not_active Expired - Fee Related
-
2012
- 2012-07-25 JP JP2012164631A patent/JP5794738B2/ja not_active Expired - Fee Related
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