CN101964194B - 具有凹道的滑动器结合垫 - Google Patents

具有凹道的滑动器结合垫 Download PDF

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Publication number
CN101964194B
CN101964194B CN201010246885.5A CN201010246885A CN101964194B CN 101964194 B CN101964194 B CN 101964194B CN 201010246885 A CN201010246885 A CN 201010246885A CN 101964194 B CN101964194 B CN 101964194B
Authority
CN
China
Prior art keywords
pad
slider
recessed road
edge
suspension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201010246885.5A
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English (en)
Chinese (zh)
Other versions
CN101964194A (zh
Inventor
E·J·希区森
C·M·恩格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seagate Technology LLC
Original Assignee
Seagate Technology LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seagate Technology LLC filed Critical Seagate Technology LLC
Publication of CN101964194A publication Critical patent/CN101964194A/zh
Application granted granted Critical
Publication of CN101964194B publication Critical patent/CN101964194B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4853Constructional details of the electrical connection between head and arm

Landscapes

  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
CN201010246885.5A 2009-06-22 2010-06-22 具有凹道的滑动器结合垫 Expired - Fee Related CN101964194B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/489,176 US8259415B2 (en) 2009-06-22 2009-06-22 Slider bond pad with a recessed channel
US12/489,176 2009-06-22

Publications (2)

Publication Number Publication Date
CN101964194A CN101964194A (zh) 2011-02-02
CN101964194B true CN101964194B (zh) 2013-06-19

Family

ID=43354144

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010246885.5A Expired - Fee Related CN101964194B (zh) 2009-06-22 2010-06-22 具有凹道的滑动器结合垫

Country Status (5)

Country Link
US (1) US8259415B2 (enExample)
JP (2) JP5252592B2 (enExample)
KR (1) KR101273441B1 (enExample)
CN (1) CN101964194B (enExample)
MY (1) MY152696A (enExample)

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US8243391B2 (en) * 2008-09-26 2012-08-14 Hitachi Global Storage Technologies, Netherlands B.V. Slider and suspension composite fiber solder joints
US8587901B1 (en) 2009-12-30 2013-11-19 Western Digital (Fremont), Llc Magnetic recording head slider comprising bond pad having a probe contact area and a solder contact area
US8477457B2 (en) * 2011-09-09 2013-07-02 HGST Netherlands, B.V. Head-gimbal assembly with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge
US8730621B2 (en) 2012-07-09 2014-05-20 Seagate Technology Llc Solder ball bridge, and methods of making
US8767351B1 (en) * 2013-01-31 2014-07-01 Seagate Technology Llc Ambient temperature ball bond
US9025283B1 (en) 2013-09-18 2015-05-05 Western Digital Technologies, Inc. Laminated suspension flexure with open polyimide base
US8947830B1 (en) * 2014-06-10 2015-02-03 Seagate Technology Llc Method of forming electrical connections from solder posts
US9728211B1 (en) 2016-02-04 2017-08-08 Western Digital Technologies, Inc. Suspension pad for head-gimbal assembly that inhibits formation of an inter-pad solder bridge
US9786308B1 (en) 2016-06-07 2017-10-10 Seagate Technology Llc Interconnect interposer attachable to a trailing edge of a slider
US9953669B1 (en) * 2016-10-18 2018-04-24 Seagate Technology Llc Toothed slider high density head gimbal assembly slider interconnect
US10460754B2 (en) 2018-02-05 2019-10-29 Western Digital Technologies, Inc. Slider and suspension arm interconnection for magnetic storage device
US10643645B2 (en) 2018-09-24 2020-05-05 Seagate Technology Llc Slider with bondable surface opposite suspension trace
US10706880B1 (en) * 2019-04-02 2020-07-07 Seagate Technology Llc Electrically conductive solder non-wettable bond pads in head gimbal assemblies
CN115376565A (zh) * 2021-05-20 2022-11-22 日本发条株式会社 磁盘装置用悬架、电子部件以及悬架和电子部件的连接方法
US11676628B1 (en) 2021-12-02 2023-06-13 Western Digital Technologies, Inc. Multiple-portion hard disk drive slider pad configuration
US11631426B1 (en) 2021-12-15 2023-04-18 Western Digital Technologies, Inc. Hard disk drive suspension pad peel-prevention configuration
US11705153B1 (en) 2022-03-23 2023-07-18 Western Digital Technologies, Inc. Hard disk drive suspension pad pre-solder formation and guiding
US11908497B2 (en) 2022-03-29 2024-02-20 Western Digital Technologies, Inc. Hard disk drive suspension pad pre-solder sidewalls
US12094501B1 (en) 2023-04-05 2024-09-17 Western Digital Technologies, Inc. Hard disk drive slider split pad configuration
US12260886B2 (en) 2023-06-28 2025-03-25 Western Digital Technologies, Inc. Suspension arm and slider contact for magnetic storage device

Citations (2)

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CN1498398A (zh) * 2002-01-19 2004-05-19 新科实业有限公司 硬盘微激励器和磁头对一个驱动臂悬架的物理和电气连接方法及装置
CN1959812A (zh) * 2005-11-01 2007-05-09 阿尔卑斯电气株式会社 磁头组件及其钎焊接合方法

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JPS57188315A (en) 1981-05-15 1982-11-19 Nippon Concrete Ind Co Ltd Method of removing concrete post body from die
JPS57188315U (enExample) * 1981-05-26 1982-11-30
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US5373111A (en) 1993-11-19 1994-12-13 Delco Electronics Corporation Bond pad having a patterned bonding surface
US5530604A (en) * 1994-05-19 1996-06-25 International Business Machines Corporation Electrical connection and slider-suspension assembly having an improved electrical connection
KR0157284B1 (ko) 1995-05-31 1999-02-18 김광호 솔더 볼 장착홈을 갖는 인쇄 회로 기판과 이를 사용한 볼 그리드 어레이 패키지
US5686762A (en) 1995-12-21 1997-11-11 Micron Technology, Inc. Semiconductor device with improved bond pads
US5876580A (en) 1996-01-12 1999-03-02 Micromodule Systems Rough electrical contact surface
JP3526376B2 (ja) 1996-08-21 2004-05-10 株式会社東芝 半導体装置及びその製造方法
US5929521A (en) 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
US6025988A (en) 1998-12-17 2000-02-15 Read-Rite Corporation Interconnect adapter and head suspension assembly
JP2000188232A (ja) * 1998-12-21 2000-07-04 Matsushita Electric Ind Co Ltd 面実装部品
US6531384B1 (en) 2001-09-14 2003-03-11 Motorola, Inc. Method of forming a bond pad and structure thereof
US6989967B2 (en) * 2002-08-06 2006-01-24 Seagate Technology Llc Slider having a trailing bearing pad adjacent to a recessed area
US7015580B2 (en) 2003-11-25 2006-03-21 International Business Machines Corporation Roughened bonding pad and bonding wire surfaces for low pressure wire bonding
JP4255859B2 (ja) * 2004-02-26 2009-04-15 ヒタチグローバルストレージテクノロジーズネザーランドビーブイ 回転円板形記憶装置及び配線一体型ヘッド・サスペンション・アセンブリ
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JP2006185479A (ja) * 2004-12-27 2006-07-13 Hitachi Global Storage Technologies Netherlands Bv ヘッド・ジンバル・アセンブリ及び磁気ディスク装置
CN100559473C (zh) * 2005-04-25 2009-11-11 新科实业有限公司 焊接装置及在磁盘驱动单元内形成电性焊接的方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1498398A (zh) * 2002-01-19 2004-05-19 新科实业有限公司 硬盘微激励器和磁头对一个驱动臂悬架的物理和电气连接方法及装置
CN1959812A (zh) * 2005-11-01 2007-05-09 阿尔卑斯电气株式会社 磁头组件及其钎焊接合方法

Also Published As

Publication number Publication date
MY152696A (en) 2014-11-28
JP2012256418A (ja) 2012-12-27
JP2011009216A (ja) 2011-01-13
US20100321829A1 (en) 2010-12-23
KR20100137392A (ko) 2010-12-30
US8259415B2 (en) 2012-09-04
JP5252592B2 (ja) 2013-07-31
JP5794738B2 (ja) 2015-10-14
KR101273441B1 (ko) 2013-06-11
CN101964194A (zh) 2011-02-02

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130619