CN101964194B - 具有凹道的滑动器结合垫 - Google Patents
具有凹道的滑动器结合垫 Download PDFInfo
- Publication number
- CN101964194B CN101964194B CN201010246885.5A CN201010246885A CN101964194B CN 101964194 B CN101964194 B CN 101964194B CN 201010246885 A CN201010246885 A CN 201010246885A CN 101964194 B CN101964194 B CN 101964194B
- Authority
- CN
- China
- Prior art keywords
- pad
- slider
- recessed road
- edge
- suspension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 55
- 239000000725 suspension Substances 0.000 claims description 74
- 238000000034 method Methods 0.000 claims description 20
- 230000013011 mating Effects 0.000 claims description 11
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 3
- 230000002463 transducing effect Effects 0.000 description 9
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000002445 nipple Anatomy 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4853—Constructional details of the electrical connection between head and arm
Landscapes
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/489,176 US8259415B2 (en) | 2009-06-22 | 2009-06-22 | Slider bond pad with a recessed channel |
| US12/489,176 | 2009-06-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101964194A CN101964194A (zh) | 2011-02-02 |
| CN101964194B true CN101964194B (zh) | 2013-06-19 |
Family
ID=43354144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010246885.5A Expired - Fee Related CN101964194B (zh) | 2009-06-22 | 2010-06-22 | 具有凹道的滑动器结合垫 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8259415B2 (enExample) |
| JP (2) | JP5252592B2 (enExample) |
| KR (1) | KR101273441B1 (enExample) |
| CN (1) | CN101964194B (enExample) |
| MY (1) | MY152696A (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8243391B2 (en) * | 2008-09-26 | 2012-08-14 | Hitachi Global Storage Technologies, Netherlands B.V. | Slider and suspension composite fiber solder joints |
| US8587901B1 (en) | 2009-12-30 | 2013-11-19 | Western Digital (Fremont), Llc | Magnetic recording head slider comprising bond pad having a probe contact area and a solder contact area |
| US8477457B2 (en) * | 2011-09-09 | 2013-07-02 | HGST Netherlands, B.V. | Head-gimbal assembly with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge |
| US8730621B2 (en) | 2012-07-09 | 2014-05-20 | Seagate Technology Llc | Solder ball bridge, and methods of making |
| US8767351B1 (en) * | 2013-01-31 | 2014-07-01 | Seagate Technology Llc | Ambient temperature ball bond |
| US9025283B1 (en) | 2013-09-18 | 2015-05-05 | Western Digital Technologies, Inc. | Laminated suspension flexure with open polyimide base |
| US8947830B1 (en) * | 2014-06-10 | 2015-02-03 | Seagate Technology Llc | Method of forming electrical connections from solder posts |
| US9728211B1 (en) | 2016-02-04 | 2017-08-08 | Western Digital Technologies, Inc. | Suspension pad for head-gimbal assembly that inhibits formation of an inter-pad solder bridge |
| US9786308B1 (en) | 2016-06-07 | 2017-10-10 | Seagate Technology Llc | Interconnect interposer attachable to a trailing edge of a slider |
| US9953669B1 (en) * | 2016-10-18 | 2018-04-24 | Seagate Technology Llc | Toothed slider high density head gimbal assembly slider interconnect |
| US10460754B2 (en) | 2018-02-05 | 2019-10-29 | Western Digital Technologies, Inc. | Slider and suspension arm interconnection for magnetic storage device |
| US10643645B2 (en) | 2018-09-24 | 2020-05-05 | Seagate Technology Llc | Slider with bondable surface opposite suspension trace |
| US10706880B1 (en) * | 2019-04-02 | 2020-07-07 | Seagate Technology Llc | Electrically conductive solder non-wettable bond pads in head gimbal assemblies |
| CN115376565A (zh) * | 2021-05-20 | 2022-11-22 | 日本发条株式会社 | 磁盘装置用悬架、电子部件以及悬架和电子部件的连接方法 |
| US11676628B1 (en) | 2021-12-02 | 2023-06-13 | Western Digital Technologies, Inc. | Multiple-portion hard disk drive slider pad configuration |
| US11631426B1 (en) | 2021-12-15 | 2023-04-18 | Western Digital Technologies, Inc. | Hard disk drive suspension pad peel-prevention configuration |
| US11705153B1 (en) | 2022-03-23 | 2023-07-18 | Western Digital Technologies, Inc. | Hard disk drive suspension pad pre-solder formation and guiding |
| US11908497B2 (en) | 2022-03-29 | 2024-02-20 | Western Digital Technologies, Inc. | Hard disk drive suspension pad pre-solder sidewalls |
| US12094501B1 (en) | 2023-04-05 | 2024-09-17 | Western Digital Technologies, Inc. | Hard disk drive slider split pad configuration |
| US12260886B2 (en) | 2023-06-28 | 2025-03-25 | Western Digital Technologies, Inc. | Suspension arm and slider contact for magnetic storage device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1498398A (zh) * | 2002-01-19 | 2004-05-19 | 新科实业有限公司 | 硬盘微激励器和磁头对一个驱动臂悬架的物理和电气连接方法及装置 |
| CN1959812A (zh) * | 2005-11-01 | 2007-05-09 | 阿尔卑斯电气株式会社 | 磁头组件及其钎焊接合方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5258460U (enExample) * | 1975-10-24 | 1977-04-27 | ||
| JPS57166377U (enExample) * | 1981-04-13 | 1982-10-20 | ||
| JPS57188315A (en) | 1981-05-15 | 1982-11-19 | Nippon Concrete Ind Co Ltd | Method of removing concrete post body from die |
| JPS57188315U (enExample) * | 1981-05-26 | 1982-11-30 | ||
| US5390412A (en) | 1993-04-08 | 1995-02-21 | Gregoire; George D. | Method for making printed circuit boards |
| US5373111A (en) | 1993-11-19 | 1994-12-13 | Delco Electronics Corporation | Bond pad having a patterned bonding surface |
| US5530604A (en) * | 1994-05-19 | 1996-06-25 | International Business Machines Corporation | Electrical connection and slider-suspension assembly having an improved electrical connection |
| KR0157284B1 (ko) | 1995-05-31 | 1999-02-18 | 김광호 | 솔더 볼 장착홈을 갖는 인쇄 회로 기판과 이를 사용한 볼 그리드 어레이 패키지 |
| US5686762A (en) | 1995-12-21 | 1997-11-11 | Micron Technology, Inc. | Semiconductor device with improved bond pads |
| US5876580A (en) | 1996-01-12 | 1999-03-02 | Micromodule Systems | Rough electrical contact surface |
| JP3526376B2 (ja) | 1996-08-21 | 2004-05-10 | 株式会社東芝 | 半導体装置及びその製造方法 |
| US5929521A (en) | 1997-03-26 | 1999-07-27 | Micron Technology, Inc. | Projected contact structure for bumped semiconductor device and resulting articles and assemblies |
| US6025988A (en) | 1998-12-17 | 2000-02-15 | Read-Rite Corporation | Interconnect adapter and head suspension assembly |
| JP2000188232A (ja) * | 1998-12-21 | 2000-07-04 | Matsushita Electric Ind Co Ltd | 面実装部品 |
| US6531384B1 (en) | 2001-09-14 | 2003-03-11 | Motorola, Inc. | Method of forming a bond pad and structure thereof |
| US6989967B2 (en) * | 2002-08-06 | 2006-01-24 | Seagate Technology Llc | Slider having a trailing bearing pad adjacent to a recessed area |
| US7015580B2 (en) | 2003-11-25 | 2006-03-21 | International Business Machines Corporation | Roughened bonding pad and bonding wire surfaces for low pressure wire bonding |
| JP4255859B2 (ja) * | 2004-02-26 | 2009-04-15 | ヒタチグローバルストレージテクノロジーズネザーランドビーブイ | 回転円板形記憶装置及び配線一体型ヘッド・サスペンション・アセンブリ |
| US7446399B1 (en) | 2004-08-04 | 2008-11-04 | Altera Corporation | Pad structures to improve board-level reliability of solder-on-pad BGA structures |
| JP2006185479A (ja) * | 2004-12-27 | 2006-07-13 | Hitachi Global Storage Technologies Netherlands Bv | ヘッド・ジンバル・アセンブリ及び磁気ディスク装置 |
| CN100559473C (zh) * | 2005-04-25 | 2009-11-11 | 新科实业有限公司 | 焊接装置及在磁盘驱动单元内形成电性焊接的方法 |
-
2009
- 2009-06-22 US US12/489,176 patent/US8259415B2/en not_active Expired - Fee Related
-
2010
- 2010-06-21 MY MYPI2010002941 patent/MY152696A/en unknown
- 2010-06-21 JP JP2010140738A patent/JP5252592B2/ja not_active Expired - Fee Related
- 2010-06-22 KR KR1020100059050A patent/KR101273441B1/ko not_active Expired - Fee Related
- 2010-06-22 CN CN201010246885.5A patent/CN101964194B/zh not_active Expired - Fee Related
-
2012
- 2012-07-25 JP JP2012164631A patent/JP5794738B2/ja not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1498398A (zh) * | 2002-01-19 | 2004-05-19 | 新科实业有限公司 | 硬盘微激励器和磁头对一个驱动臂悬架的物理和电气连接方法及装置 |
| CN1959812A (zh) * | 2005-11-01 | 2007-05-09 | 阿尔卑斯电气株式会社 | 磁头组件及其钎焊接合方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| MY152696A (en) | 2014-11-28 |
| JP2012256418A (ja) | 2012-12-27 |
| JP2011009216A (ja) | 2011-01-13 |
| US20100321829A1 (en) | 2010-12-23 |
| KR20100137392A (ko) | 2010-12-30 |
| US8259415B2 (en) | 2012-09-04 |
| JP5252592B2 (ja) | 2013-07-31 |
| JP5794738B2 (ja) | 2015-10-14 |
| KR101273441B1 (ko) | 2013-06-11 |
| CN101964194A (zh) | 2011-02-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130619 |