JP4018702B2 - 磁気ヘッドアッセンブリ - Google Patents
磁気ヘッドアッセンブリ Download PDFInfo
- Publication number
- JP4018702B2 JP4018702B2 JP2005108432A JP2005108432A JP4018702B2 JP 4018702 B2 JP4018702 B2 JP 4018702B2 JP 2005108432 A JP2005108432 A JP 2005108432A JP 2005108432 A JP2005108432 A JP 2005108432A JP 4018702 B2 JP4018702 B2 JP 4018702B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode pad
- slider
- magnetic head
- wiring board
- head assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4853—Constructional details of the electrical connection between head and arm
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Description
11 スライダ
13 電極パッド
14 Au表面保護膜
15 ロードビーム
16 接着層
21 フレキシャ
22 フレキシブル配線基板
23 電極パッド
25 Auメッキ膜
30 キャピラリ
31 送出口
40 半田ボール
40’ 半田フィレット
Claims (4)
- 薄膜素子を通電する電極パッドを備えたスライダの該電極パッドと、フレキシブル配線基板の電極パッドとを半田ボールを介して接合した磁気ヘッドアッセンブリにおいて、
前記半田ボールを接合する前の前記スライダの電極パッド表面全体は、真空成膜されたAu表面保護膜によって覆われており、
前記スライダの電極パッドの上面と、同電極パッドのフレキシブル配線基板に近い側の側面と、前記フレキシブル配線基板の電極パッドの上面とに接合した半田フィレットが形成されていることを特徴とする磁気ヘッドアッセンブリ。 - 請求項1記載の磁気ヘッドアッセンブリにおいて、前記スライダの電極パッドはNiメッキ膜またはNiFeメッキ膜で形成され、この電極パッド表面と前記Au表面保護膜との間に、真空成膜されたNi、NiFeまたはNiCuからなる接着層が介在している磁気ヘッドアッセンブリ。
- 請求項1または2記載の磁気ヘッドアッセンブリにおいて、前記半田ボールを接合する前の前記スライダの電極パッドは、真空雰囲気中で前記スライダの電極パッドに表面クリーニングを施した後、同一真空雰囲気中で、前記表面クリーニングにより露出させた前記電極パッドの新たな膜面の上にAu表面保護膜を成膜し、このAu表面保護膜によって前記スライダの電極パッド表面全体が覆われている磁気ヘッドアッセンブリ。
- 請求項1記載の磁気ヘッドアッセンブリにおいて、前記半田ボールを接合する前の前記スライダの電極パッドは、真空雰囲気中で前記スライダの電極パッドに表面クリーニングを施した後、同一真空雰囲気中で、前記表面クリーニングにより露出させた前記電極パッドの新たな膜面の上にNi、NiFeまたはNiCuからなる接着層を成膜し、続いてこの接着層上にAu表面保護膜を成膜することにより、該接着層及びAu表面保護膜によって前記スライダの電極パッド表面全体が覆われている磁気ヘッドアッセンブリ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005108432A JP4018702B2 (ja) | 2005-04-05 | 2005-04-05 | 磁気ヘッドアッセンブリ |
US11/388,653 US20060221501A1 (en) | 2005-04-05 | 2006-03-23 | Slider, magnetic head assembly and manufacturing the same |
CNB2006100743029A CN100536017C (zh) | 2005-04-05 | 2006-04-05 | 滑动器及其制造方法和磁头组件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005108432A JP4018702B2 (ja) | 2005-04-05 | 2005-04-05 | 磁気ヘッドアッセンブリ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006286155A JP2006286155A (ja) | 2006-10-19 |
JP4018702B2 true JP4018702B2 (ja) | 2007-12-05 |
Family
ID=37070083
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005108432A Expired - Fee Related JP4018702B2 (ja) | 2005-04-05 | 2005-04-05 | 磁気ヘッドアッセンブリ |
Country Status (3)
Country | Link |
---|---|
US (1) | US20060221501A1 (ja) |
JP (1) | JP4018702B2 (ja) |
CN (1) | CN100536017C (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100825795B1 (ko) * | 2006-12-05 | 2008-04-28 | 삼성전자주식회사 | 하드 디스크 드라이브의 헤드 짐발 조립체 |
JP2008159215A (ja) * | 2006-12-26 | 2008-07-10 | Fujitsu Ltd | ヘッドサスペンションアセンブリおよび記憶媒体駆動装置 |
US20130335931A1 (en) * | 2012-06-15 | 2013-12-19 | Delphi Technologies, Inc. | Surface mount interconnection system for modular circuit board and method |
CN103928032B (zh) * | 2013-01-14 | 2018-04-06 | 新科实业有限公司 | 磁头及其制造方法、磁头折片组合及磁盘驱动器 |
US20160325370A1 (en) * | 2015-05-05 | 2016-11-10 | Delavan Inc | Deposition of braze preform |
US10879211B2 (en) | 2016-06-30 | 2020-12-29 | R.S.M. Electron Power, Inc. | Method of joining a surface-mount component to a substrate with solder that has been temporarily secured |
US9953669B1 (en) * | 2016-10-18 | 2018-04-24 | Seagate Technology Llc | Toothed slider high density head gimbal assembly slider interconnect |
US11259435B2 (en) * | 2017-11-09 | 2022-02-22 | Super Micro Computer, Inc. | Single-enclosure multi-drive data storage system |
US11626133B1 (en) * | 2022-03-30 | 2023-04-11 | Sae Magnetics (H.K.) Ltd. | Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5828031A (en) * | 1996-06-27 | 1998-10-27 | International Business Machines Corporation | Head transducer to suspension lead termination by solder ball place/reflow |
US6703566B1 (en) * | 2000-10-25 | 2004-03-09 | Sae Magnetics (H.K.), Ltd. | Bonding structure for a hard disk drive suspension using anisotropic conductive film |
-
2005
- 2005-04-05 JP JP2005108432A patent/JP4018702B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-23 US US11/388,653 patent/US20060221501A1/en not_active Abandoned
- 2006-04-05 CN CNB2006100743029A patent/CN100536017C/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2006286155A (ja) | 2006-10-19 |
CN100536017C (zh) | 2009-09-02 |
US20060221501A1 (en) | 2006-10-05 |
CN1848285A (zh) | 2006-10-18 |
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