CN1498398A - 硬盘微激励器和磁头对一个驱动臂悬架的物理和电气连接方法及装置 - Google Patents
硬盘微激励器和磁头对一个驱动臂悬架的物理和电气连接方法及装置 Download PDFInfo
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- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/5313—Means to assemble electrical device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
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Abstract
用金球焊接(GBB)或焊料碰焊(SBB)将硬盘微激励器和磁头物理和电气连接到一个驱动臂的悬架上的一种系统和方法,用来避免银膏环氧树脂因湿度/温度变化发生物理变形(粘性)的问题。
Description
背景信息
本发明涉及到硬磁盘驱动器。本发明具体涉及到硬盘微激励器和磁头对一个驱动臂的悬架的物理和电气连接系统。
当今的技术采用不同方法来改进硬盘驱动器的记录密度。图1的示意图表示用来读写硬磁盘的一种典型的驱动臂构造。用音圈电动机(VCM)102控制硬盘驱动器的臂104移动跨越硬磁盘106。由于仅仅靠VCM102来安置记录磁头108存在固有的公差(动态播放),按照美国专利US6,198,606中所述采用了微激励器110对磁头108的安置进行“微调”。仍然使用一个VCM102进行调节,然后用微激励器按很小的刻度校正位置,以补偿VCM102(连同臂104)的公差。这样就允许缩小记录轨迹宽度,提高硬盘驱动器的‘每英寸轨迹’(TPI)值(提高驱动器密度)。
图2表示现有技术中采用的微激励器的示意图。通常是利用滑板202(包含读/写磁头;未示出)来维持在盘面106(参见图1)上方规定的飞行高度。微激励器具有柔软的臂204,将一个支撑装置206连接到一个滑板收容单元208,使滑板202的运动与驱动臂104(参见图1)保持独立。可以用一个电磁组件或电磁/铁磁组件(未示出)为滑板/磁头202相对于臂104(参见图1)的取向/位置提供微小调节。由于使用中所处环境的限制,硬盘微激励器和磁头对一个驱动臂悬架的物理和电气连接存在困难。采用银膏(高汞含量环氧树脂)进行物理/电气连接的缺点是环氧树脂的粘稠度特性会随温度和湿度改变。
因而就希望有一种硬盘微激励器和磁头对驱动臂悬架的物理和电气连接系统,要能够避免上述问题,并且具有附加的优点。
附图简介
图1表示现有技术中用来对硬磁盘执行读出和写入的一种驱动臂构造。
图2表示现有技术中使用的一种微激励器。
图3提供的示意图是一个硬盘驱动器磁头-万向节组件(HGA),按照本发明的原理具有“U”形的微激励器。
图4表示具有按照本发明原理的“U”形微激励器的一个磁头(及滑板)的具体示意图。
图5表示一个“U”形微激励器,用来进一步解释本发明的原理。
图6表示按照本发明的原理通过金球焊接(GBB)连接到悬架上的另一种微激励器和磁头。
图7a-d表示采用银膏(环氧树脂)来连接时因湿度和/或温度变化带来的变形问题。
图8a-d表示按照本发明的原理采用金球焊接(GBB)对变形问题的校正。
最佳实施例的详细说明
图3提供的示意图是一个硬盘驱动器磁头-万向节组件(HGA),按照本发明的原理具有“U”形的微激励器。在一个实施例中,在两点304将一个滑板(带读/写磁头)302焊接到“U”形微激励器306上。按照一个实施例,“U”形微激励器在一个(Zirconia)氧化锆支撑框架(激励器基座/底臂)308的每一侧具有压电PZT(压电传感器)束(臂)307。如下所述,用一个臂悬挂310连接和支撑微激励器。
图4表示具有按照本发明原理的“U”形微激励器的一个磁头(及滑板)402的具体示意图。PZT材料具有各向异性构造,能够为电偶极子特性提供正、负离子之间的电荷分离。若是在极化的压电材料两端施加一个电压,Weiss域就会正比于电压加强其调整,致使PZT材料发生构造变形(即局部膨胀/收缩)。PZT构造406和焊接到PZT构造406上且同样弯曲的Zirconia臂408(一致地)弯曲,使得磁头/滑板402相对于微激励器404调节其位置(用于磁头微调)。如下所述,底臂420被固定在悬架舌片412上,维持悬架410的取向。
如上所述,由于使用中所处环境的限制,硬盘微激励器404和磁头402对一个驱动臂悬架410的物理和电气连接存在困难。采用银膏(高汞含量环氧树脂)进行物理/电气连接的缺点是环氧树脂的粘稠度特性会随温度和湿度改变,如下所述。
使用银膏还存在与银的迁移有关的问题。迁移是银(原子或离子)因电化学过程而发生迁移的一种现象。特别是在高湿度环境下施加电场时容易发生。与银迁移有关的一个问题是金属沉积物会从阴极迁移到阳极。此类迁移会在多层PZT的各层(树枝状构造)之间造成有害的污染。与银迁移有关的另一问题是有可能发生电气短路。迁移会造成PZT层间或是阳极或阴极焊盘对地的短路。另一肋银迁移是金属在银膏的树脂内部扩散,形成一种金属云。它可能渗透隔离薄膜并且到达一个表面,损伤PZT406与悬架410之间的电气连接。
微激励器404对悬架410的物理安装和电连接可以使用银膏,但是如上、下文所述存在缺点,因为环氧树脂在温度和/或湿度变化时有可能发生物理变形。按照本发明的一个实施例,执行球焊接操作例如是金球焊接(GBB)414或焊料碰焊(SBB)来实现微激励器404对悬架410的物理/电气连接。GBB可以包括电弧焊,采用的线材约含95%-99%的金。在一个实施例中,通过施加压力使熔化的金线与悬架和微激励器焊盘416的金材料混合。如上所述,焊料碰焊(SBB)是本发明的另一种实施例。微激励器404对悬架410的物理/电气连接也可以采用其他适当的球焊材料。磁头402对悬架410的电气连接(最好是在执行微激励器/悬架连接之前)也可以采用GBB414。如上所述,焊料碰焊(SBB)是另一种实施例。
如下所述,在一个实施例中,用环氧树脂将底臂420连接到悬架舌片412上,在另一实施例中,粘合剂是树脂。这样就能将微激励器固定到臂悬架410上。
图5表示一个“U”形微激励器,用来进一步解释本发明的原理。如上所述,若是对极化的压电材料施加一个电压,PZT材料就会发生构造变形(即局部膨胀/收缩)。随着PZT构造406和焊接到PZT构造406上且同样弯曲的Zirconia臂408(一致地)弯曲,使得磁头/滑板相对于微激励器404调节其位置(用于磁头微调)。
图6表示按照本发明的原理通过金球焊接(GBB)连接到悬架606上的另一种微激励器602和磁头604。在本发明的一个实施例中,采用六个微激励器GBB作用点(每一侧三个)608实现微激励器602对悬架606的物理/电气连接。用四个磁头GBB作用点(在焊盘上)610完成磁头604对悬架606的物理/电气连接。
图7a-d表示采用银膏(环氧树脂)的物理/电气连接因湿度和/或温度变化带来的变形问题。如图7a所示,在微激励器702和悬架舌片705之间存在特定的间隙706。这一间隙706应该是沿着微激励器702的长度构成(微激励器应该与悬架舌片平行)。图7b表示在加热八小时之后的银膏(高汞含量环氧树脂)708和微激励器安装环氧树脂,它随着温度和湿度的变化而软化,使微激励器702相对于悬架704发生物理位移,造成微激励器702不再与悬架舌片705平行(并且会缩小微激励器与悬架舌片之间的间隙706)。如图7c所示,在延长的加热过程中,间隙706持续缩小。图7d表示再以后恢复到室温的结构,间隙维持在比其加热之前小。
图8a-d表示按照本发明的原理采用金球焊接(GBB)对变形问题的校正。在本实施例中按相同的时间周期对结构进行加热(并恢复到室温),微激励器802与悬架舌片805之间的间隙806维持不变(保持微激励器与悬架舌片平行)。
进而,由于金在熔化时具有很低的粘度(与银,铅,铜等等相比),GBB焊接不会发生上述的迁移(污染/短路)问题。
尽管具体描述了若干个实施例,通过上文的说明仍然可以看出本发明的权利要求书所覆盖的各种修改和变更,它们都不会脱离本发明的原理和范围。
Claims (34)
1.激励器元件对悬架元件的一种连接系统包括:
一个激励器元件,适合由焊接剂的至少一个作用点物理支撑并且连接到悬架元件上,所述的焊接剂是一种导电球形焊接材料。
2.按照权利要求1的系统,其特征是激励器元件还适合用上述焊接剂的至少一个作用点电气连接到上述悬架元件上。
3.按照权利要求2的系统,其特征是用金球焊接(GBB)将激励器元件连接到上述悬架元件上。
4.按照权利要求2的系统,其特征是用焊料碰焊(SBB)将激励器元件连接到上述悬架元件上。
5.按照权利要求3的系统,其特征是激励器元件是一个微激励器。
6.按照权利要求5的系统,其特征是微激励器是一个压电式U形微激励器。
7.按照权利要求6的系统,其特征是激励器元件适合至少在各个电气焊盘上用上述焊接剂的上述至少一个作用点连接到上述悬架元件上。
8.按照权利要求7的系统,其特征是上述悬架元件是一个悬架舌片。
9.激励器元件对悬架元件的一种连接系统包括:
一个悬架元件,适合由焊接剂的至少一个作用点物理支撑并且物理连接到激励器元件上,所述的焊接剂是一种导电球形焊接材料。
10.按照权利要求9的系统,其特征是激励器元件还适合用上述焊接剂的上述至少一个作用点电气连接到上述激励器元件上。
11.按照权利要求10的系统,其特征是用金球焊接(GBB)将激励器元件连接到上述悬架元件上。
12.按照权利要求10的系统,其特征是用焊料碰焊(SBB)将激励器元件连接到上述悬架元件上。
13.按照权利要求10的系统,其特征是激励器元件是一个微激励器。
14.按照权利要求13的系统,其特征是微激励器是一个压电式U形微激励器。
15.按照权利要求14的系统,其特征是悬架元件适合至少在各个电气焊盘上用上述焊接剂的上述至少一个作用点连接到上述激励器元件上。
16.按照权利要求15的系统,其特征是上述悬架元件是一个悬架舌片。
17.磁头对悬架元件的一种连接系统包括:
一个磁头,适合由焊接剂的至少一个作用点电气连接到悬架元件上,所述的焊接剂是一种导电球形焊接材料。
18.按照权利要求17的系统,其特征是用金球焊接(GBB)将磁头连接到上述悬架元件上。
19.按照权利要求17的系统,其特征是用焊料碰焊(SBB)将激励器元件连接到上述悬架元件上。
20.按照权利要求17的系统,其特征是磁头是一个硬盘驱动器磁头。
21.按照权利要求20的系统,其特征是磁头适合至少在各个电气焊盘上用上述焊接剂的上述至少一个作用点连接到上述悬架元件上。
22.激励器元件对悬架元件的一种连接方法包括:
由焊接剂的至少一个作用点适当地物理支撑一个激励器元件并且连接到悬架元件上,所述的焊接剂是一种导电球形焊接材料。
23.按照权利要求22的方法,其特征是激励器元件还适合用上述焊接剂的至少一个作用点电气连接到上述悬架元件上。
24.按照权利要求23的方法,其特征是用金球焊接(GBB)将激励器元件连接到上述悬架元件上。
25.按照权利要求23的方法,其特征是用焊料碰焊(SBB)将激励器元件连接到上述悬架元件上。
26.按照权利要求23的方法,其特征是激励器元件是一个微激励器。
27.按照权利要求26的方法,其特征是微激励器是一个压电式U形微激励器。
28.按照权利要求27的方法,其特征是激励器元件适合至少在各个电气焊盘上用上述焊接剂的上述至少一个作用点连接到上述悬架元件上。
29.按照权利要求28的方法,其特征是上述悬架元件是一个悬架舌片。
30.磁头对悬架元件的一种连接方法包括:
由焊接剂的至少一个作用点将磁头电气连接到悬架元件上,所述的焊接剂是一种导电球形焊接材料。
31.按照权利要求30的方法,其特征是用金球焊接(GBB)将磁头连接到上述悬架元件上。
32.按照权利要求30的方法,其特征是用焊料碰焊(SBB)将激励器元件连接到上述悬架元件上。
33.按照权利要求30的方法,其特征是磁头是一个硬盘驱动器磁头。
34.按照权利要求33的方法,其特征是磁头适合至少在各个电气焊盘上用上述焊接剂的上述至少一个作用点连接到上述悬架元件上。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2002/000027 WO2003060886A1 (en) | 2002-01-19 | 2002-01-19 | Method and apparatus for the physical and electrical coupling of a hard disk micro-actuator and magnetic head to a drive arm suspension |
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CN1498398A true CN1498398A (zh) | 2004-05-19 |
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CNA02806769XA Pending CN1498398A (zh) | 2002-01-19 | 2002-01-19 | 硬盘微激励器和磁头对一个驱动臂悬架的物理和电气连接方法及装置 |
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US (1) | US20030135985A1 (zh) |
CN (1) | CN1498398A (zh) |
WO (1) | WO2003060886A1 (zh) |
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CN101964194A (zh) * | 2009-06-22 | 2011-02-02 | 希捷科技有限公司 | 具有凹道的滑动器结合垫 |
CN113643727A (zh) * | 2020-05-11 | 2021-11-12 | 西部数据技术公司 | 用于微细间距电极垫的焊料凸块高度稳定 |
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WO2014043498A2 (en) | 2012-09-14 | 2014-03-20 | Hutchinson Technology Incorporated | Co-located gimbal-based dual stage actuation disk drive suspensions |
JP6356682B2 (ja) | 2012-10-10 | 2018-07-11 | ハッチンソン テクノロジー インコーポレイテッドHutchinson Technology Incorporated | 二段作動構造を有するサスペンション |
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2002
- 2002-01-19 WO PCT/CN2002/000027 patent/WO2003060886A1/en active Application Filing
- 2002-01-19 CN CNA02806769XA patent/CN1498398A/zh active Pending
- 2002-03-20 US US10/103,353 patent/US20030135985A1/en not_active Abandoned
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CN101964194A (zh) * | 2009-06-22 | 2011-02-02 | 希捷科技有限公司 | 具有凹道的滑动器结合垫 |
CN101964194B (zh) * | 2009-06-22 | 2013-06-19 | 希捷科技有限公司 | 具有凹道的滑动器结合垫 |
CN113643727A (zh) * | 2020-05-11 | 2021-11-12 | 西部数据技术公司 | 用于微细间距电极垫的焊料凸块高度稳定 |
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US20030135985A1 (en) | 2003-07-24 |
WO2003060886A1 (en) | 2003-07-24 |
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